Abstract: A method includes placing a microelectromechanical system (MEMS) device over a carrier, wire bonding the MEMS device to a bond pad on the carrier with a bond wire, and spray coating a buffer layer over the MEMS device and enclosing the bond wire. A Young's modulus value of the buffer layer is less than a Young's modulus value of the MEMS device.

Abstract: A system and method for blocking heat from reaching an image sensor in a three dimensional stack with a semiconductor device. In an embodiment a heat sink is formed in a back end of line process either on the semiconductor device or else on the image sensor itself when the image sensor is in a backside illuminated configuration. The heat sink may be a grid in either a single layer or in two layers, a zig-zag pattern, or in an interleaved fingers configuration.

Abstract: A microelectromechanical system (MEMS) device may include a MEMS structure above a first substrate. The MEMS structure comprising a central static element, a movable element, and an outer static element. A portion of bonding material between the central static element and the first substrate. A second substrate above the MEMS structure, with a portion of a dielectric layer between the central static element and the second substrate. A supporting post comprises the portion of bonding material, the central static element, and the portion of dielectric material.

Abstract: A microelectro mechanical system (MEMS) assembly includes a carrier and a MEMS device disposed over the carrier. A buffer layer is disposed over the MEMS device. The Young's modulus of the buffer layer is less than that of the MEMS device.

Abstract: A device includes a semiconductor substrate, and a capacitive sensor having a back-plate, wherein the back-plate forms a first capacitor plate of the capacitive sensor. The back-plate is a portion of the semiconductor substrate. A conductive membrane is spaced apart from the semiconductor substrate by an air-gap. A capacitance of the capacitive sensor is configured to change in response to a movement of the polysilicon membrane.

Abstract: A biometrics sensor module includes a housing, a biometrics sensor and a coupling electrode. The housing has a first surface and a second surface opposite to the first surface. The biometrics sensor has a sensing surface, which is disposed on the first surface of the housing and has sensing members arranged in an array. The coupling electrode is disposed on the first or second surface of the housing. Two regions, projected from the sensing surface and the coupling electrode to the second surface of the housing, do not overlap with each other. A coupling signal is provided to the coupling electrode and directly or indirectly couples the coupling signal to an object, so that the sensing members of the biometrics sensor sense biometrics messages of the object contacting with the second surface of the housing.

Abstract: Embodiments of the present disclosure include a semiconductor device and methods of forming a semiconductor device. An embodiment is a method of forming a semiconductor device, the method comprising forming a conductive pad in a first substrate, forming an interconnecting structure over the conductive pad and the first substrate, the interconnecting structure comprising a plurality of metal layers disposed in a plurality of dielectric layers, bonding a die to a first side of the interconnecting structure, and etching the first substrate from a second side of the interconnecting structure, the etching exposing a portion of the conductive pad.

Abstract: A semiconductor device includes a first die having a first active surface and a first backside surface opposite the first active surface, a second die having a second active surface and a second backside surface opposite the second active surface, and an interposer, the first active surface of the first die being electrically coupled to a first side of the interposer, the second active surface of the second die being electrically coupled to a second side of the interposer. The semiconductor device also includes a first connector over the interposer, a first encapsulating material surrounding the second die, the first encapsulating material having a first surface over the interposer, and a via electrically coupling the first connector and the interposer. A first end of the via is substantially coplanar with the first surface of the first encapsulating material.

Abstract: Embodiments of the present disclosure include a semiconductor device and methods of forming a semiconductor device. An embodiment is a method of forming a semiconductor device, the method comprising forming a conductive pad in a first substrate, forming an interconnecting structure over the conductive pad and the first substrate, the interconnecting structure comprising a plurality of metal layers disposed in a plurality of dielectric layers, bonding a die to a first side of the interconnecting structure, and etching the first substrate from a second side of the interconnecting structure, the etching exposing a portion of the conductive pad.

Abstract: A device includes a semiconductor substrate, and a capacitive sensor having a back-plate, wherein the back-plate forms a first capacitor plate of the capacitive sensor. The back-plate is a portion of the semiconductor substrate. A conductive membrane is spaced apart from the semiconductor substrate by an air-gap. A capacitance of the capacitive sensor is configured to change in response to a movement of the polysilicon membrane.

Abstract: The present invention provides a MEMS structure comprising confined sacrificial oxide layer and a bonded Si layer. Polysilicon stack is used to fill aligned oxide openings and MEMS vias on the sacrificial layer and the bonded Si layer respectively. To increase the design flexibility, some conductive polysilicon layer can be further deployed underneath the bonded Si layer to form the functional sensing electrodes or wiring interconnects. The MEMS structure can be further bonded to a metallic layer on top of the Si layer and the polysilicon stack.

Abstract: A composite wafer semiconductor device includes a first wafer and a second wafer. The first wafer has a first side and a second side, and the second side is substantially opposite the first side. The composite wafer semiconductor device also includes an isolation set is formed on the first side of the first wafer and a free space is etched in the isolation set. The second wafer is bonded to the isolation set. A floating structure, such as an inertia sensing device, is formed in the second wafer over the free space. In an embodiment, a surface mount pad is formed on the second side of the first wafer. Then, the floating structure is electrically coupled to the surface mount pad using a through silicon via (TSV) conductor.

Abstract: The present invention provides a MEMS structure comprising confined sacrificial oxide layer and a bonded Si layer. Polysilicon stack is used to fill aligned oxide openings and MEMS vias on the sacrificial layer and the bonded Si layer respectively. To increase the design flexibility, some conductive polysilicon layer can be further deployed underneath the bonded Si layer to form the functional sensing electrodes or wiring interconnects. The MEMS structure can be further bonded to a metallic layer on top of the Si layer and the polysilicon stack.

Abstract: A microelectro mechanical system (MEMS) assembly includes a carrier and a MEMS device disposed over the carrier. A buffer layer is disposed over the MEMS device. The Young's modulus of the buffer layer is less than that of the MEMS device.

Abstract: In a fingerprint apparatus, fingerprint sensing members disposed on a silicon substrate detect skin textures of a finger placed thereon to generate electric signals. A set of integrated circuits formed on the substrate processes the electric signals. First bonding pads are disposed on the substrate and electrically connected to the set of integrated circuits. A first insulating layer is disposed below the first bonding pads. Metal plugs penetrating through the substrate are respectively electrically connected to the first bonding pads. A second insulating layer is formed on the substrate and between the metal plugs and the substrate. Second bonding pads are formed on a rear side of the second insulating layer, and are respectively electrically connected to the first bonding pads through the metal plugs. The protection layer is disposed on the substrate and covers the sensing members to form a flat touch surface to be touched by the finger.

Abstract: An imaging device for sensing an image of an object includes a negative feedback amplifier, a substrate, a sense electrode, a couple electrode and an insulation protection layer. The sense and couple electrodes are disposed above the substrate. The insulation protection layer covers the sense and couple electrodes. The sense electrode and the object form a sense capacitor. The couple electrode and the object form a couple capacitor. A negative input terminal of the negative feedback amplifier is directly electrically connected to the sense electrode, and the couple electrode is directly electrically connected to one of a signal output terminal of the negative feedback amplifier and a signal input terminal of the imaging device.

Abstract: An information sensing device includes a substrate, one information sensing chip, one electroconductive structure and a molded body. An electrical output portion including output connections is formed on the substrate. The information sensing chip is electrically connected to the electrical output portion and has one bottom chip surface mounted on the substrate, and one top chip surface to be close to or in contact with an object to sense specific information of the object. The electroconductive structure is electrically connected to the electrical output portion. The molded body is in contact with the information sensing chip and the at least one electroconductive structure to expose the top chip surface and a first surface of the electroconductive structure. The top chip surface is disposed opposite the bottom chip surface. The top chip surface and the first surface are exposed outside and disposed on substantially the same plane.

Abstract: An image sensing device adapted to a flat surface design includes a carrier and an image sensing structure. The carrier has carrier input pads and carrier output pads respectively electrically connected to the carrier input pads. The image sensing structure has signal input pads and signal output pads respectively electrically connected to the signal input pads. The signal output pads are respectively electrically connected to the carrier input pads. The image sensing structure includes a sensing chip having image sensing members and a processing circuit. The signal input pads and the image sensing members are electrically connected to the processing circuit. The image sensing members sense an image of an object and output sensed signals. The processing circuit processes the sensed signals into processed signals, which are transmitted to the carrier output pads through the signal input pads, the signal output pads and the carrier input pads.

Abstract: A fingerprint sensing device includes a chip substrate, first connecting pads and a flexible printed circuit board. The substrate has fingerprint sensing cells. The first connecting pads are respectively disposed on the fingerprint sensing cells and exposed from a top surface of the substrate. The printed circuit board is disposed above the substrate and has signal transmission structures exposed from a bottom surface of the printed circuit board. The fingerprint sensing cells are respectively electrically connected to the signal transmission structures, and a top surface of the printed circuit board serves as a contact surface for a finger so that sensed fingerprint signals of the finger are transmitted to the fingerprint sensing cells through the signal transmission structures. The numbers of the first connecting pads, the fingerprint sensing cells and the signal transmission structures are equal to one another. A method of manufacturing the fingerprint sensing device is also disclosed.

Abstract: A biometrics signal input device with a USB interface is connected to a computer apparatus to control BIOS booting procedures of the computer apparatus. The computer apparatus communicates with a USB controller of the input device through the USB interface according to a USB communication protocol and regards this device as a USB device. Then, the computer apparatus executes a program stored in a memory of the input device and enables a biometrics sensor to read biometrics data of a user. Then, to-be-identified biometrics data and biometrics template data pre-stored in the memory are transferred to a main memory of the computer apparatus. A CPU of the computer apparatus compares the to-be-identified biometrics data with the biometrics template data. After the comparison passes, the BIOS booting procedures are allowed to be continued until the CPU has completely loaded an operation system stored in a main storage device of the computer apparatus.