Abstract: An information handling system may include at least one processor and a memory. The information handling system may be configured to: receive a request to perform a management operation on a target information handling system, wherein the request is received from a mobile device via a mobile network, and wherein the request includes data retrieved from a visual identifier associated with the target information handling system; and perform the management operation by communicating with the target information handling system via a management network other than the mobile network.

Abstract: Cable assemblies for providing electrical communication between hinged sections of an electronic device are described. The cable assemblies can include a cover that covers one or more cables that run through a hinge region of the electronic device. The cable and cover can be drawn over a mandrel of the hinge region. The cover and the portions of the mandrel can be visible to a user at the hinge region of the electronic device. The cover can be sufficiently rigid to guide a path of the cable and protect the cable from bending beyond a prescribed angle during rotation of the electronic device at the hinge region. The cover can also be sufficiently rigid to prevent ceasing or folding of the cover and the cable during rotation of the electronic device at the hinge region.

Abstract: Mutations in oncogenes and tumor suppressors contribute to the development and progression of cancer. The present disclosure describes compounds and methods that restore DNA binding affinity of p53 mutants. The compounds of the present disclosure can bind to mutant p53 and restore the ability of the p53 mutant to bind DNA and activate downstream effectors involved in tumor suppression. The disclosed compounds can be used to reduce the progression of cancers that contain a p53 mutation.

Abstract: An apparatus that includes a module for use in installing a heatsink, the module comprising a fastener, a first indicator member comprising a first visual indicator surface, and a second indicator member comprising a second visual indicator surface, the first and second indicator members defining an opening for receiving the fastener. The first visual indicator surface is visible when the fastener is not fully installed and the second visual indicator surface is visible when the fastener is fully installed. A method for installing the heatsink with the module is also disclosed herein.

Abstract: An apparatus that includes a module for use in installing a heatsink, the module comprising a fastener, a first indicator member comprising a first visual indicator surface, and a second indicator member comprising a second visual indicator surface, the first and second indicator members defining an opening for receiving the fastener. The first visual indicator surface is visible when the fastener is not fully installed and the second visual indicator surface is visible when the fastener is fully installed. A method for installing the heatsink with the module is also disclosed herein.

Abstract: In one embodiment, an apparatus includes a module for use in installing a heatsink, the module comprising a fastener, a first indicator member comprising a first visual indicator surface, and a second indicator member comprising a second visual indicator surface, the first and second indicator members defining an opening for receiving the fastener. The first visual indicator surface is visible when the fastener is not fully installed and the second visual indicator surface is visible when the fastener is fully installed. A method for installing the heatsink with the module is also disclosed herein.

Abstract: In one embodiment, an apparatus includes a module for use in installing a heatsink, the module comprising a fastener, a first indicator member comprising a first visual indicator surface, and a second indicator member comprising a second visual indicator surface, the first and second indicator members defining an opening for receiving the fastener. The first visual indicator surface is visible when the fastener is not fully installed and the second visual indicator surface is visible when the fastener is fully installed. A method for installing the heatsink with the module is also disclosed herein.

Abstract: Embodiments of the present disclosure provide a method and apparatus for dynamic storage tiering by calculating a density of data according to a temperature of the data, and making the density of data with a higher temperature smaller; obtaining density threshold of each of the tiers, wherein the density threshold of an upper tier is smaller than that of a lower tier; comparing the density of the data with the density threshold of each of the tiers to determine which tier the data should be moved to; and moving the data to the determined tier. Embodiments of the present invention may be used to provide a dynamic storage tiering scheme with higher flexibility and scalability.

Abstract: An apparatus comprises an input node, a power rail to power a circuit load, and multiple current paths coupled in parallel with each other between the input node and the power rail. Each current path respectively provides a sense output to indicate current in the path and a current switch having a control input to control the current in the path. A control circuit, coupled to each control input individually and to each sense output individually, controls the current in each path individually based on the indicated current therein after a non-zero input voltage is initially applied to the input node, such that all of the paths concurrently conduct current from the input node to the power rail and collectively cause a total inrush current and corresponding voltage at the power rail to gradually increase.

Abstract: An apparatus comprises an input node, a power rail to power a circuit load, and multiple current paths coupled in parallel with each other between the input node and the power rail. Each current path respectively provides a sense output to indicate current in the path and a current switch having a control input to control the current in the path. A control circuit, coupled to each control input individually and to each sense output individually, controls the current in each path individually based on the indicated current therein after a non-zero input voltage is initially applied to the input node, such that all of the paths concurrently conduct current from the input node to the power rail and collectively cause a total inrush current and corresponding voltage at the power rail to gradually increase.

Abstract: Embodiments of the present disclosure provide a method and apparatus for dynamic storage tiering by calculating a density of data according to a temperature of the data, and making the density of data with a higher temperature smaller; obtaining density threshold of each of the tiers, wherein the density threshold of an upper tier is smaller than that of a lower tier; comparing the density of the data with the density threshold of each of the tiers to determine which tier the data should be moved to; and moving the data to the determined tier. Embodiments of the present invention may be used to provide a dynamic storage tiering scheme with higher flexibility and scalability.

Abstract: An online transaction method includes providing a network platform, providing a seller interface and providing a buyer interface. The seller interface is stored in the network platform for the sellers to set commodity data, selling price, quantity per unit and selling condition of at least one commodity. The selling price per unit is obtained from the result of dividing the selling price by the amount per unit. The selling condition includes the selling duration and minimal sell quantity per unit. The buyer interface is stored in the network platform for the buyers to connect for choosing the number of the corresponding units of to-buy commodity. When the number of the unit of the commodity is higher than or equal to the minimal sell quantity and the set selling duration ends, the bidding winner will be selected from those who purchase that unit of commodity.

Abstract: A semiconductor fabrication enterprise includes fabrication equipment, transportable containers for work—in—process and an enterprise information system. The transportable containers have associated radio frequency tags having identification codes uniquely identifying the carriers in the fabrication process. The enterprise information system contains data corresponding to each such identification code. The identification codes are read by a radio frequency interrogation device, and the radio frequency interrogation device carries out transactions with the enterprise data system to transfer the data corresponding to the identification codes to the radio frequency interrogation device. The radio frequency tags may be adapted for read/write functionality allowing for writing data to the radio frequency tags and synchronization of radio frequency tag data and enterprise information system data.

Abstract: A small memory card includes a substrate, a plurality of memory chips, a plurality of wires, and a glue layer, the substrate is formed with a plurality of through slots of the substrate, then the plurality of memory chips are mounted on the substrate, so that the plurality of bounding pads of the memory chip are exposed from through slot, the plurality of wires are electrically connected to the substrate, the glue layer is encapsulated the plurality of memory chips at the same time. Thus, the small memory card of present invention has small packed volume, and the manufacturing processes may be convenient.

Abstract: A small memory card includes a substrate, a plurality of memory chips, a plurality of wires, and a glue layer, the substrate is formed with a plurality of through slots, then the plurality of memory chips be mounted on the substrate, so that the plurality of bounding pads of the memory chip from through slot may be revealed, and use a plurality of wires electrically connecting to the substrate, finally use the glue layer encapsulating a plurality of memory chips at the same time. Thus, the small memory card of present invention has small packed volume, and the manufacturing processes may be convenient.

Abstract: An injection molded image sensor includes metal sheets arranged in a matrix, an injection molded structure, a photosensitive chip, bonding pads, wires, and a transparent layer. Each metal sheet has a first board, a second board and a third board to form a -shaped structure. The molded structure encapsulates the metal sheets by way of injection molding and has a first molded body and a second molded body. The injection molded structure has a U-shaped structure and is formed with a cavity. The first boards are partially encapsulated by the first molded body. The second and third boards are exposed from bottom and side surfaces of the first molded body. The chip is mounted within the cavity. The pads are formed on the chip. The wires electrically connect the pads to input terminals of the first boards. The transparent layer covers over the first molded body to encapsulate the chip.

Abstract: An image sensor includes lower and upper metal sheet sets, an encapsulant, a photosensitive chip, wires, and a transparent layer. The lower metal sheet set includes plural lower metal sheets and a middle board among and flush with the lower metal sheets. The upper metal sheet set includes plural upper metal sheets stacked on the lower metal sheets, respectively. The encapsulant encapsulates the upper and lower metal sheets and the middle board with upper surfaces of the upper sheets, lower surfaces of the lower sheets, and upper and lower surfaces of the middle board exposed from the encapsulant, and with a frame layer formed around the upper sheets to define a chamber. The chip is mounted to the middle board and located within the chamber. The wires electrically connect the chip to the upper metal sheets. The transparent layer is arranged on the frame layer to cover the chip.

Abstract: An image sensor package includes a plurality of leadframes, a molded resin, a photosensitive, a plurality of wires and a transparent layer. Each of the leadframes have a first board and a second board located on a height different from that of the first board, and a chamber is defined upper a central of the plurality of leadframes. The molded resin is for encapsulating the leadframes, and is forming an upper surface and a lower surface, wherein the first boards of the leadframes are exposed from the upper surface of the molded resin. The photosensitive chip is mounted onto the upper surface of the molded resin and arranged within the chamber. Each of wires are electrically connected the photosensitive chip to the each second board of the plurality of leadframes. And the transparent resin is covered onto the each first board of the plurality of leadframes.

Abstract: A wire bonding capillary includes a first column having a first end and a second end, a second column extending from the second end of the first column and having a circular cross-section with a diameter smaller than that of the first column, and a third column extending from the second column and formed with a funnel structure and a pointed wire-bonding end. The third column is positioned between a frame layer and a photosensitive chip of an image sensor to bond a plurality of wires to a photosensitive chip and a substrate of the image sensor.

Abstract: An image sensor includes a substrate, a frame layer, a photosensitive chip, and a transparent layer. The substrate has an upper surface formed with a plurality of first connection points, and a lower surface formed with a plurality of second connection points. The frame layer has a first surface and a second surface and is mounted to the upper surface of the substrate with the first surface of the frame layer contacting the upper surface of the substrate so as to form a cavity together with the substrate. The second surface is formed with a rough contact surface. The photosensitive chip is mounted to the upper surface of the substrate and located within the cavity and is electrically connected to the first connection points of the substrate. The transparent layer is adhered to the rough contact surface.