Patents by Inventor Bruce Chen
Bruce Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240427641Abstract: Techniques for memory access management in a distributed computing system are described herein. In some aspects, the techniques described herein relate to a method for memory access management in a distributed computing system, where the method includes: receiving a first request to execute a first operation using a distributed architecture and in a uniform memory access (UMA) mode, wherein the distributed architecture comprises a first processor, a first memory that is local to the first processor, and a second memory that is remote to the first processor; subsequent to receiving the first request and a first delay period, transmitting first data associated with the first operation to the first processor, wherein the first data is stored in the first memory; and subsequent to receiving the first request, transmitting second data associated with the first operation to the first processor, wherein the second data is stored in the second memory.Type: ApplicationFiled: June 26, 2023Publication date: December 26, 2024Applicant: Cisco Technology, Inc.Inventors: Yang SUN, Bruce Chen, Davy Gu, Alvin Li, Bo Liu
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Patent number: 11821842Abstract: An apparatus that includes a module for use in installing a heatsink, the module comprising a fastener, a first indicator member comprising a first visual indicator surface, and a second indicator member comprising a second visual indicator surface, the first and second indicator members defining an opening for receiving the fastener. The first visual indicator surface is visible when the fastener is not fully installed and the second visual indicator surface is visible when the fastener is fully installed. A method for installing the heatsink with the module is also disclosed herein.Type: GrantFiled: January 10, 2022Date of Patent: November 21, 2023Assignee: CISCO TECHNOLOGY, INC.Inventors: Le Gao, Yang Sun, Rudong Shi, Bruce Chen
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Publication number: 20220128482Abstract: An apparatus that includes a module for use in installing a heatsink, the module comprising a fastener, a first indicator member comprising a first visual indicator surface, and a second indicator member comprising a second visual indicator surface, the first and second indicator members defining an opening for receiving the fastener. The first visual indicator surface is visible when the fastener is not fully installed and the second visual indicator surface is visible when the fastener is fully installed. A method for installing the heatsink with the module is also disclosed herein.Type: ApplicationFiled: January 10, 2022Publication date: April 28, 2022Inventors: Le Gao, Yang Sun, Rudong Shi, Bruce Chen
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Patent number: 11268909Abstract: In one embodiment, an apparatus includes a module for use in installing a heatsink, the module comprising a fastener, a first indicator member comprising a first visual indicator surface, and a second indicator member comprising a second visual indicator surface, the first and second indicator members defining an opening for receiving the fastener. The first visual indicator surface is visible when the fastener is not fully installed and the second visual indicator surface is visible when the fastener is fully installed. A method for installing the heatsink with the module is also disclosed herein.Type: GrantFiled: October 23, 2018Date of Patent: March 8, 2022Assignee: CISCO TECHNOLOGY, INC.Inventors: Le Gao, Yang Sun, Rudong Shi, Bruce Chen
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Publication number: 20200124540Abstract: In one embodiment, an apparatus includes a module for use in installing a heatsink, the module comprising a fastener, a first indicator member comprising a first visual indicator surface, and a second indicator member comprising a second visual indicator surface, the first and second indicator members defining an opening for receiving the fastener. The first visual indicator surface is visible when the fastener is not fully installed and the second visual indicator surface is visible when the fastener is fully installed. A method for installing the heatsink with the module is also disclosed herein.Type: ApplicationFiled: October 23, 2018Publication date: April 23, 2020Applicant: CISCO TECHNOLOGY, INC.Inventors: Le Gao, Yang Sun, Rudong Shi, Bruce Chen
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Patent number: 10120575Abstract: Embodiments of the present disclosure provide a method and apparatus for dynamic storage tiering by calculating a density of data according to a temperature of the data, and making the density of data with a higher temperature smaller; obtaining density threshold of each of the tiers, wherein the density threshold of an upper tier is smaller than that of a lower tier; comparing the density of the data with the density threshold of each of the tiers to determine which tier the data should be moved to; and moving the data to the determined tier. Embodiments of the present invention may be used to provide a dynamic storage tiering scheme with higher flexibility and scalability.Type: GrantFiled: March 30, 2015Date of Patent: November 6, 2018Assignee: EMC IP Holding Company LLCInventors: Bruce Chen Shen, Bob Biao Yan, Huijuan Fan, Su Yang, Jessica Jing Ye, Yu Wen
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Patent number: 9917437Abstract: An apparatus comprises an input node, a power rail to power a circuit load, and multiple current paths coupled in parallel with each other between the input node and the power rail. Each current path respectively provides a sense output to indicate current in the path and a current switch having a control input to control the current in the path. A control circuit, coupled to each control input individually and to each sense output individually, controls the current in each path individually based on the indicated current therein after a non-zero input voltage is initially applied to the input node, such that all of the paths concurrently conduct current from the input node to the power rail and collectively cause a total inrush current and corresponding voltage at the power rail to gradually increase.Type: GrantFiled: May 6, 2015Date of Patent: March 13, 2018Assignee: Cisco Technology, Inc.Inventors: Yang Sun, Zhongmin Gan, Bruce Chen, Yun Bai, Nan Wang
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Publication number: 20160329702Abstract: An apparatus comprises an input node, a power rail to power a circuit load, and multiple current paths coupled in parallel with each other between the input node and the power rail. Each current path respectively provides a sense output to indicate current in the path and a current switch having a control input to control the current in the path. A control circuit, coupled to each control input individually and to each sense output individually, controls the current in each path individually based on the indicated current therein after a non-zero input voltage is initially applied to the input node, such that all of the paths concurrently conduct current from the input node to the power rail and collectively cause a total inrush current and corresponding voltage at the power rail to gradually increase.Type: ApplicationFiled: May 6, 2015Publication date: November 10, 2016Inventors: Yang Sun, Zhongmin Gan, Bruce Chen, Yun Bai, Nan Wang
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Publication number: 20150277773Abstract: Embodiments of the present disclosure provide a method and apparatus for dynamic storage tiering by calculating a density of data according to a temperature of the data, and making the density of data with a higher temperature smaller; obtaining density threshold of each of the tiers, wherein the density threshold of an upper tier is smaller than that of a lower tier; comparing the density of the data with the density threshold of each of the tiers to determine which tier the data should be moved to; and moving the data to the determined tier. Embodiments of the present invention may be used to provide a dynamic storage tiering scheme with higher flexibility and scalability.Type: ApplicationFiled: March 30, 2015Publication date: October 1, 2015Inventors: Bruce Chen Shen, Bob Biao Yan, Huijuan Fan, Su Yang, Jessica Jing Ye, Yu Wen
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Publication number: 20120166301Abstract: An online transaction method includes providing a network platform, providing a seller interface and providing a buyer interface. The seller interface is stored in the network platform for the sellers to set commodity data, selling price, quantity per unit and selling condition of at least one commodity. The selling price per unit is obtained from the result of dividing the selling price by the amount per unit. The selling condition includes the selling duration and minimal sell quantity per unit. The buyer interface is stored in the network platform for the buyers to connect for choosing the number of the corresponding units of to-buy commodity. When the number of the unit of the commodity is higher than or equal to the minimal sell quantity and the set selling duration ends, the bidding winner will be selected from those who purchase that unit of commodity.Type: ApplicationFiled: December 22, 2011Publication date: June 28, 2012Inventor: Bruce CHEN
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Patent number: 7158850Abstract: A semiconductor fabrication enterprise includes fabrication equipment, transportable containers for work—in—process and an enterprise information system. The transportable containers have associated radio frequency tags having identification codes uniquely identifying the carriers in the fabrication process. The enterprise information system contains data corresponding to each such identification code. The identification codes are read by a radio frequency interrogation device, and the radio frequency interrogation device carries out transactions with the enterprise data system to transfer the data corresponding to the identification codes to the radio frequency interrogation device. The radio frequency tags may be adapted for read/write functionality allowing for writing data to the radio frequency tags and synchronization of radio frequency tag data and enterprise information system data.Type: GrantFiled: June 14, 2002Date of Patent: January 2, 2007Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chien-Fei Cheng, Bruce Chen, Yuan-Ching Lu, Li-Ren Lin, Shi-Ming Wang, Pei-Chen Yeh
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Patent number: 7126219Abstract: A small memory card includes a substrate, a plurality of memory chips, a plurality of wires, and a glue layer, the substrate is formed with a plurality of through slots of the substrate, then the plurality of memory chips are mounted on the substrate, so that the plurality of bounding pads of the memory chip are exposed from through slot, the plurality of wires are electrically connected to the substrate, the glue layer is encapsulated the plurality of memory chips at the same time. Thus, the small memory card of present invention has small packed volume, and the manufacturing processes may be convenient.Type: GrantFiled: October 9, 2003Date of Patent: October 24, 2006Assignee: Kingpak Technology Inc.Inventors: Jackson Hsieh, Jichen Wu, Worrell Tsai, Bruce Chen
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Publication number: 20050077607Abstract: A small memory card includes a substrate, a plurality of memory chips, a plurality of wires, and a glue layer, the substrate is formed with a plurality of through slots, then the plurality of memory chips be mounted on the substrate, so that the plurality of bounding pads of the memory chip from through slot may be revealed, and use a plurality of wires electrically connecting to the substrate, finally use the glue layer encapsulating a plurality of memory chips at the same time. Thus, the small memory card of present invention has small packed volume, and the manufacturing processes may be convenient.Type: ApplicationFiled: October 9, 2003Publication date: April 14, 2005Inventors: Jackson Hsieh, Jichen Wu, Worrell Tsai, Bruce Chen
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Patent number: 6878917Abstract: An injection molded image sensor includes metal sheets arranged in a matrix, an injection molded structure, a photosensitive chip, bonding pads, wires, and a transparent layer. Each metal sheet has a first board, a second board and a third board to form a -shaped structure. The molded structure encapsulates the metal sheets by way of injection molding and has a first molded body and a second molded body. The injection molded structure has a U-shaped structure and is formed with a cavity. The first boards are partially encapsulated by the first molded body. The second and third boards are exposed from bottom and side surfaces of the first molded body. The chip is mounted within the cavity. The pads are formed on the chip. The wires electrically connect the pads to input terminals of the first boards. The transparent layer covers over the first molded body to encapsulate the chip.Type: GrantFiled: December 16, 2002Date of Patent: April 12, 2005Assignee: Kingpak Technology, Inc.Inventors: Jackson Hsieh, Jichen Wu, Bruce Chen, Worrell Tsai
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Publication number: 20050012025Abstract: An image sensor includes lower and upper metal sheet sets, an encapsulant, a photosensitive chip, wires, and a transparent layer. The lower metal sheet set includes plural lower metal sheets and a middle board among and flush with the lower metal sheets. The upper metal sheet set includes plural upper metal sheets stacked on the lower metal sheets, respectively. The encapsulant encapsulates the upper and lower metal sheets and the middle board with upper surfaces of the upper sheets, lower surfaces of the lower sheets, and upper and lower surfaces of the middle board exposed from the encapsulant, and with a frame layer formed around the upper sheets to define a chamber. The chip is mounted to the middle board and located within the chamber. The wires electrically connect the chip to the upper metal sheets. The transparent layer is arranged on the frame layer to cover the chip.Type: ApplicationFiled: July 16, 2003Publication date: January 20, 2005Inventors: Jackson Hsieh, Jichen Wu, Bruce Chen, Abnet Chen
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Publication number: 20040245590Abstract: An image sensor package includes a plurality of leadframes, a molded resin, a photosensitive, a plurality of wires and a transparent layer. Each of the leadframes have a first board and a second board located on a height different from that of the first board, and a chamber is defined upper a central of the plurality of leadframes. The molded resin is for encapsulating the leadframes, and is forming an upper surface and a lower surface, wherein the first boards of the leadframes are exposed from the upper surface of the molded resin. The photosensitive chip is mounted onto the upper surface of the molded resin and arranged within the chamber. Each of wires are electrically connected the photosensitive chip to the each second board of the plurality of leadframes. And the transparent resin is covered onto the each first board of the plurality of leadframes.Type: ApplicationFiled: June 5, 2003Publication date: December 9, 2004Inventors: Jackson Hsieh, Jichen Wu, Eric Chang, Bruce Chen
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Publication number: 20040211814Abstract: A wire bonding capillary includes a first column having a first end and a second end, a second column extending from the second end of the first column and having a circular cross-section with a diameter smaller than that of the first column, and a third column extending from the second column and formed with a funnel structure and a pointed wire-bonding end. The third column is positioned between a frame layer and a photosensitive chip of an image sensor to bond a plurality of wires to a photosensitive chip and a substrate of the image sensor.Type: ApplicationFiled: April 23, 2003Publication date: October 28, 2004Inventors: Jackson Hsieh, Jichen Wu, Bruce Chen, Eric Chang, Worrell Tsai, Abnet Chen, Jr-Shuen Yang
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Publication number: 20040211882Abstract: An image sensor includes a substrate, a frame layer, a photosensitive chip, and a transparent layer. The substrate has an upper surface formed with a plurality of first connection points, and a lower surface formed with a plurality of second connection points. The frame layer has a first surface and a second surface and is mounted to the upper surface of the substrate with the first surface of the frame layer contacting the upper surface of the substrate so as to form a cavity together with the substrate. The second surface is formed with a rough contact surface. The photosensitive chip is mounted to the upper surface of the substrate and located within the cavity and is electrically connected to the first connection points of the substrate. The transparent layer is adhered to the rough contact surface.Type: ApplicationFiled: April 23, 2003Publication date: October 28, 2004Inventors: Jackson Hsieh, Jichen Wu, Bruce Chen, Bird Lin, Worrell Tsai, Abnet Chen, Tiao-Mu Hsu
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Publication number: 20040178335Abstract: An image sensor having improved functions. The image sensor includes a plurality of metal sheets arranged in a matrix, an insulation layer, a photosensitive chip, a plurality of wires, a glue layer, and a transparent layer. Each metal sheet has a first board and a second board. The insulation layer is adhered to the first boards to fix the first boards. The photosensitive chip is arranged on the first boards. The wires electrically connect the photosensitive chip to the first boards. The glue layer encapsulates the metal sheets with the first boards and second boards exposed from the glue layer, and the glue layer is formed with a projection edge. The transparent layer is placed on the projection edge to cover the photosensitive chip.Type: ApplicationFiled: March 10, 2003Publication date: September 16, 2004Inventors: Jackson Hsieh, Jichen Wu, Bruce Chen, Eric Chang
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Publication number: 20040149898Abstract: An injection-molded structure of an image sensor to be electrically connected to a printed circuit board. The image sensor includes metal sheets arranged in a matrix, a U-shaped injection molding structure encapsulating the metal sheets by way of injection molding, a photosensitive chip having a plurality of bonding pads, wires, and a transparent layer. Each metal sheet includes a first board. The injection molding structure has a first molded body, a second molded body, and a cavity. The first boards are exposed from the injection molding structure to form signal input and output terminals, respectively. The chip is arranged within the cavity. The wires electrically connect the bonding pads to the signal input terminals, respectively. The transparent layer is arranged on a top of the first molded body to cover over the chip. The invention also discloses a method for manufacturing the image sensor.Type: ApplicationFiled: January 30, 2003Publication date: August 5, 2004Inventors: Jackson Hsieh, Jichen Wu, Bruce Chen, Abnet Chen