Abstract: An image sensor having improved functions. The image sensor includes a plurality of metal sheets arranged in a matrix, an insulation layer, a photosensitive chip, a plurality of wires, a glue layer, and a transparent layer. Each metal sheet has a first board and a second board. The insulation layer is adhered to the first boards to fix the first boards. The photosensitive chip is arranged on the first boards. The wires electrically connect the photosensitive chip to the first boards. The glue layer encapsulates the metal sheets with the first boards and second boards exposed from the glue layer, and the glue layer is formed with a projection edge. The transparent layer is placed on the projection edge to cover the photosensitive chip.

Abstract: An injection-molded structure of an image sensor to be electrically connected to a printed circuit board. The image sensor includes metal sheets arranged in a matrix, a U-shaped injection molding structure encapsulating the metal sheets by way of injection molding, a photosensitive chip having a plurality of bonding pads, wires, and a transparent layer. Each metal sheet includes a first board. The injection molding structure has a first molded body, a second molded body, and a cavity. The first boards are exposed from the injection molding structure to form signal input and output terminals, respectively. The chip is arranged within the cavity. The wires electrically connect the bonding pads to the signal input terminals, respectively. The transparent layer is arranged on a top of the first molded body to cover over the chip. The invention also discloses a method for manufacturing the image sensor.

Abstract: An improved structure of an image sensor includes a substrate, a frame layer on the substrate to form a chamber together with the substrate, a photosensitive chip arranged on the substrate and within the chamber, a plurality of wires, a transparent layer placed on the frame layer, and a filling medium. The frame layer is formed with at least one venthole communicating with the chamber. The wires electrically connect the chip to the substrate. The filling medium is filled into the venthole of the frame layer to seal the chamber. Accordingly, the air pressure within the chamber generated when the transparent layer is fixed to the frame layer may be released through the venthole, and the transparent layer may be firmly fixed to the frame layer.

Abstract: A simplified image sensor module of the invention includes a substrate, a frame layer, a photosensitive chip, wires, and a transparent layer. The substrate has an upper surface and a lower surface. The frame layer has a first surface and a second surface. The first surface is arranged on the upper surface of the substrate, and a cavity is formed between the substrate and the frame layer. The photosensitive chip has bonding pads and is mounted to the upper surface of the substrate and located within the cavity. The wires electrically connect the bonding pads of the photosensitive chip to the substrate. The transparent layer is arranged on the second surface of the frame layer and is formed with a convex portion at a position corresponding to the photosensitive chip. Accordingly, the photosensitive chip may receive focused optical signals passing through the convex portion.

Abstract: An image sensor with improved sensor effects includes a substrate, a frame layer, a photosensitive chip, wires, and a transparent layer. The substrate has an upper surface and a lower surface. Signal input terminals are formed at a periphery of the upper surface, and projections with the same height are formed at a central portion of the upper surface. The frame layer is arranged at a periphery of the substrate to form a U-shaped structure and a cavity together with the substrate. The signal input terminals and projections are inside the cavity. The photosensitive chip is arranged on the projections. The wires electrically connect the photosensitive chip to the signal input terminals of the substrate. The transparent layer is placed on the frame layer to cover the photosensitive chip. By placing the photosensitive chip on the projections, better flatness and thus better sensor effects may be obtained.

Abstract: An injection molded image sensor includes metal sheets arranged in a matrix, an injection molded structure, a photosensitive chip, bonding pads, wires, and a transparent layer. Each metal sheet has a first board, a second board, a third board, and a fourth board. The injection molded structure encapsulates the metal sheets by way of injection molding and has a first molded body and a second molded body. The injection molded structure has a U-shaped structure and is formed with a cavity. The photosensitive chip is mounted within the cavity. The bonding pads are formed on the photosensitive chip. The wires electrically connect the bonding pads to signal input terminals of the first boards. The transparent layer covers over the first molded body to encapsulate the photosensitive chip.

Abstract: An image sensor package without a frame layer. The image sensor package includes a substrate, a photosensitive chip, a transparent layer, a plurality of wires, and a glue layer. The substrate has an upper surface formed with signal input terminals, and a lower surface formed with signal output terminals electrically connected to a printed circuit board. The photosensitive chip includes a photosensitive region and bonding pads formed on a periphery of the photosensitive region. The transparent layer is adhered to the photosensitive region by an adhesive. Each of the wires has a first terminal and a second terminal. The first terminals are electrically connected to the bonding pads, respectively, and the second terminals are electrically connected to the signal input terminals, respectively, so as to electrically connect the photosensitive chip to the substrate. The glue layer covers over the substrate for sealing the plurality of wires.

Abstract: An injection molded image sensor includes metal sheets arranged in a matrix, an injection molded structure, a photosensitive chip, bonding pads, wires, and a transparent layer. Each metal sheet has a first board, a second board and a third board to form a -shaped structure. The molded structure encapsulates the metal sheets by way of injection molding and has a first molded body and a second molded body. The injection molded structure has a U-shaped structure and is formed with a cavity. The first boards are partially encapsulated by the first molded body. The second and third boards are exposed from bottom and side surfaces of the first molded body. The chip is mounted within the cavity. The pads are formed on the chip. The wires electrically connect the pads to input terminals of the first boards. The transparent layer covers over the first molded body to encapsulate the chip.

Abstract: An image sensor having shortened wires. The image sensor includes a substrate composed of metal sheets arranged in a matrix, a photosensitive chip, bonding pads on the chip, a frame layer, wires and a transparent layer placed on the frame layer. Each metal sheet has a first board and a second board. A chamber is defined under the substrate to accommodate the chip. Each pad is arranged between first boards. The frame layer is formed on a periphery and the bottom surface to encapsulate the chip. The bottom faces of the second boards are electrically connected to a printed circuit board. Each wire has a first terminal and a second terminal. The first terminals are electrically connected to the pads, and the second terminals are electrically connected to the first boards, respectively.

Abstract: An image sensor to be mounted to a printed circuit board. The module includes a substrate, an integrated circuit, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate is composed of metal sheets arranged in a matrix, and a middle board positioned in a central region surrounded by the metal sheets. Each metal sheet has a first board and a second board connected to the printed circuit board. A slot is formed under the substrate. The integrated circuit is arranged within the slot and electrically connected to the substrate. The chip is placed on the middle board. The wires electrically connect the first boards, to the chip. The transparent layer is placed on the frame layer to cover the chip.

Abstract: A semiconductor fabrication enterprise includes fabrication equipment, transportable containers for work-in-process and an enterprise information system. The transportable containers have associated radio frequency tags having identification codes uniquely identifying the carriers in the fabrication process. The enterprise information system contains data corresponding to each such identification code. The identification codes are read by a radio frequency interrogation device, and the radio frequency interrogation device carries out transactions with the enterprise data system to transfer the data corresponding to the identification codes to the radio frequency interrogation device. The radio frequency tags may be adapted for read/write functionality allowing for writing data to the radio frequency tags and synchronization of radio frequency tag data and enterprise information system data.

Abstract: An injection molded image sensor includes metal sheets arranged in a matrix, an injection molded structure, a photosensitive chip, bonding pads, wires, and a transparent layer. Each metal sheet has a first board, a second board and a third board to form a -shaped structure. The injection molded structure encapsulates the metal sheets by way of injection molding and has a first molded body and a second molded body. The injection molded structure has a U-shaped structure and is formed with a cavity. The first, second, and third boards are exposed from top, bottom, side surfaces of the first molded body. The photosensitive chip is mounted within the cavity. The bonding pads are formed on the photosensitive chip. The wires electrically connect the bonding pads to signal input terminals of the first boards. The transparent layer covers over the first molded body to encapsulate the photosensitive chip.

Abstract: A power stapler including a cover shell, a base, a frame, a circuit board assembly, an electromagnetic valve, a magazine and tie plate assembly, an anvil, a micro-switch, a presser case assembly, a staple magazine constraint control device, an adjusting rod, and a linkage, wherein the valve block of the electromagnetic valve is controlled by the circuit board to drive the linkage causing the presser case assembly reciprocated to achieve a striking in driving a staple through the sheets of paper to be fastened; the adjusting rod is turned to move the circuit board assembly in changing the position of the micro-switch so that the binding position is adjusted.