Abstract: An encapsulation material suitable for dissipating heat generated by an electronic module, such as by directly contacting a heat-generating power device or contacting a heat sink of a heat-generating power device. The encapsulation material comprises phase change particles dispersed in a gel material. The phase change particles preferably comprise a solder alloy encapsulated by a dielectric coating so the phase change particles are electrically insulated from each other. The encapsulation material may further comprise dielectric particles dispersed in the gel material for the purpose of increasing the thermal conductivity of the encapsulation material. Alternatively or in addition, the dielectric coating on the phase change particles may comprise dielectric particles that are dispersed in a dielectric matrix, again with the preferred effect of increasing the thermal conductivity of the encapsulation material.

Abstract: An overmolded circuit board assembly and a method for forming the assembly. The assembly and method entail overmolding both surfaces of a circuit board and underfilling at least one surface-mount circuit device attached to at least one surface of the board with solder bump connections, with the result that the circuit device is spaced above the surface of the circuit board so as to define a gap therebetween. A cavity, such as a blind hole or closed through-hole, is defined in the surface of the circuit board beneath the circuit device and communicates with the gap but is closed off from the opposite surface of the circuit board. Air that is trapped in the gap by a molding material during the overmolding/underfilling process is collected and compressed within the cavity, yielding a void-free underfill between the circuit board and circuit device.

Abstract: An overmolded electronic assembly having an electromagnetic interference shield, in the form of a thin metal film or foil, coupled to the top of or within an overmolded body. The shield effectively reduces the amount of electromagnetic interference (“EMI”) emissions from penetrating within the assembly to the circuit board without substantially increasing the cost of the unit. Thus, an electronic assembly having improved vibration, moisture, and EMI emission resistance is achieved as compared with traditional overmolded or metal assemblies. Further, because the shield can be formed on the electronic assembly in one continuous processing step, a substantial savings in time and cost for the manufacturing process is also realized.

Abstract: An encapsulation material suitable for dissipating heat generated by an electronic module, such as by directly contacting a heat-generating power device or contacting a heat sink of a heat-generating power device. The encapsulation material comprises phase change particles dispersed in a gel material. The phase change particles preferably comprise a solder alloy encapsulated by a dielectric coating so the phase change particles are electrically insulated from each other. The encapsulation material may further comprise dielectric particles dispersed in the gel material for the purpose of increasing the thermal conductivity of the encapsulation material. Alternatively or in addition, the dielectric coating on the phase change particles may comprise dielectric particles that are dispersed in a dielectric matrix, again with the preferred effect of increasing the thermal conductivity of the encapsulation material.

Abstract: An electrically-insulating polymer-based material with improved thermal conductivity so as to be suitable for use as an adhesive for mounting and conducting heat from electronic devices. The polymer-based material comprises metal particles dispersed in a matrix material. The metal particles are encapsulated by a dielectric coating so that they are electrically insulated from each other. The polymer-based material may also comprise dielectric particles dispersed in the matrix material and/or the dielectric coating for the purpose of further increasing the thermal conductivity of the polymer-based material. The material is also suitable for use as a potting compound or an encapsulation material for various electronic applications.

Abstract: A corrosive resistant electronics assembly 10 is provided including at least one heat generating electronics component 12 mounted on a substrate 14 and positioned within potting material 18. A thermally conductive block element 24 is thermally mounted to the at least one heat generating electronics component 12 and positioned within the potting material 18, thereby providing a corrosive resistant electronics assembly 10 with improved thermal dissipation.

Abstract: An overmolded circuit board assembly and a method for forming the assembly. The assembly and method entail overmolding both surfaces of a circuit board and underfilling at least one surface-mount circuit device attached to at least one surface of the board with solder bump connections, with the result that the circuit device is spaced above the surface of the circuit board so as to define a gap therebetween. A cavity, such as a blind hole or closed through-hole, is defined in the surface of the circuit board beneath the circuit device and communicates with the gap but is closed off from the opposite surface of the circuit board. Air that is trapped in the gap by a molding material during the overmolding/underfilling process is collected and compressed within the cavity, yielding a void-free underfill between the circuit board and circuit device.

Abstract: A DIN press-fit coaxial connector having a press-fit center pin and a modified BNC coaxial connector having a hollow center pin are mounted back-to-back on opposite sides of a backplane with the respective center pins of the two coaxial connectors aligned along the same linear axis and in conductive press-fit engagement with each other within a waveguide defined by a conductive-material-coated center hole in the backplane. The diameter of the center hole is dimensioned in relation to the outside diameter of a cylindrical hollow portion of the center pin of the modified BNC coaxial connector to impedance match the connection between the modified BNC coaxial connector and the DIN press-fit coaxial connector.

Abstract: Contaminants such as sulfur oxides are removed from flue gas in a low pressure drop, turbulent mixing zone, vertical dry scrubber by channeling the flue gas through a low pressure drop gas distribution means which controls flue gas introduction to the scrubber, along with control of reagent introduction, by treating the flue gas with a finely atomized alkali solution or slurry reagent preferably from a single or multiple array of dual-fluid atomizers. The atomizers create a turbulent mixing zone downstream of the gas distribution means which results in a homogeneous distribution of the alkali solution or slurry reagent in the flue gas. Control means are provided for creating and maintaining the turbulent mixing zone. A transition at the bottom of the dry scrubber is used to entrain any particulates and/or spray dried materials in the bulk gas stream exiting the dry scrubber.

Abstract: Contaminants such as sulfur oxides are removed from flue gas in a low pressure drop, turbulent mixing zone, vertical dry scrubber by channeling the flue gas through a low pressure drop gas distribution means which controls flue gas introduction to the scrubber, along with control of reagent introduction, by treating the flue gas with a finely atomized alkali solution or slurry reagent preferably from a single or multiple array of dual-fluid atomizers. The atomizers create a turbulent mixing zone downstream of the gas distribution means which results in a homogeneous distribution of the alkali solution or slurry reagent in the flue gas. Control means are provided for creating and maintaining the turbulent mixing zone. A transition at the bottom of the dry scrubber is used to entrain any particulates and/or spray dried materials in the bulk gas stream exiting the dry scrubber.

Abstract: A method is provided for applying solder to a flip chip pattern on a circuit board. The method involves forming solder bumps on a chip, and then transferring the solder bumps to the flip chip pattern by soldering the chip to the flip chip pattern, and then gradually heating the solder bumps while applying a force to separate the chip from the circuit board, such that the solder bumps substantially remain adhered to the flip chip pattern. The solder is transferred to the flip chip pattern in order to allow a flexible circuit interconnect to be soldered to the flip chip pattern for the purpose of establishing electronic communications between the circuit board's electronic circuit components and a microprocessor emulator. The electronic circuit can then be evaluated and tested without a microprocessor chip being present on the substrate.

Abstract: A method is provided for flip-chip bonding a flip chip to a substrate, which may be a ceramic substrate, printed wiring board, flexible circuit, or a silicon substrate, in which a number of input/output solder bumps are reflowed to both bond the flip chip to the circuit board as well as provide the necessary electrical connection between the flip chip and the circuit board's circuitry. The method enables the height of the input/output solder bumps to be closely controlled thereby providing sufficient spacing between the chip and its substrate, thus optimizing the cleanability and stress relief of the package. Generally, the preferred method involves the use of non-input/output, or "dummy" solder bumps which are present in sufficient numbers to overcome the tendency for the input/output solder bumps to draw the flip chip excessively close to the circuit board.

Abstract: Disclosed is an ultra-thick thick film of copper or silver or other suitable conductor material for use in spreading heat laterally, i.e., in the x and y directions, along a substrate. A substrate of suitable thickness is chosen to dissipate heat in the vertical or z-direction underneath a heat generating component such as a semiconductor chip. The ultra-thick films have a thickness ranging from about 2 to about 5 mils and are prepared from metal powders having average particles sizes ranging from about 1 micron to 3 microns.

Abstract: A method of forming solder stops on a thick film, comprising a conductive metal and an inorganic oxide, including the step of directing a laser beam onto the film to form a surface consisting essentially of fused inorganic oxides which acts as a solder stop.

Abstract: A method and apparatus are disclosed for enabling automated printing of through holes extending between top and bottom surfaces of a ceramic substrate or the like. The perimeter of the substrate is placed on a support that locates the bottom surface of the substrate spaced from a member that interacts with the interior portion of the substrate. The interacting member has holes that correspond to the through holes in the substrate, and it is moved generally perpendicular to the substrate to a position where it is in juxtaposition with the bottom surface of the substrate and its holes are in registration with the holes in the substrate. Conductive material is applied to the top surface of the substrate and a vacuum is applied to the holes in the interacting member to pull the conductive material through the through holes in the substrate. The vacuum is then discontinued and the interacting member is moved back to a position where it is spaced from the bottom surface of the substrate.

Abstract: A method of forming solder stops on a thick film, comprising a conductive metal and an inorganic oxide, including the step of directing a laser beam onto the film to form a surface consisting essentially of fused inorganic oxides which acts as a solder stop.

Abstract: An interface device for thermally coupling an integrated circuit to a heat sink having a first material characterized by high thermal conductivity such as copper, where the copper completely surrounds a plurality of inner core regions. The plurality of inner core regions contain a low coefficient of thermal expansion material and are primarily disposed in the copper material in the region directly under the integrated circuit. The low expansion regions retard thermal expansion of the interface device during exposure to variations in the temperature, yet there are continuous paths of copper provided between the integrated circuit and heat sink to promote efficient heat transfer between the silicon chip to the heat sink through the high conductivity copper. In addition, high thermal resistance layers are provided for dielectric isolation between an integrated circuit chip and heat sink, when necessary, using this invention.

Abstract: A method and apparatus are disclosed for enabling automated printing of through holes extending between top and bottom surfaces of a ceramic substrate or the like. The perimeter of the substrate is placed on a support that locates the bottom surface of the substrate spaced from a member that interacts with the interior portion of the substrate. The interacting member has holes that correspond to the through holes in the substrate, and it is moved generally perpendicular to the substrate to a position where it is in juxtaposition with the bottom surface of the substrate and its holes are in registration with the holes in the substrate. Conductive material is applied to the top surface of the substrate and a vacuum is applied to the holes in the interacting member to pull the conductive material through the through holes in the substrate. The vacuum is then discontinued and the interacting member is moved back to a position where it is spaced from the bottom surface of the substrate.

Abstract: A flexible circuit interconnector connects a circuit board having a ceramic substrate to pin connectors at the connector end of a circuit board connector housing. The interconnect has a thin flexible sheet of polymeric, electrical insulating material with a mating end and a connector end. The mating end includes a plurality of spaced holes therethrough for receiving tail ends of the pin connectors. A plurality of electrically conductive runners provided on one side of the flexible sheet electrically connect the pin connectors to printed conductors on the ceramic substrate. The thin flexible sheet has a viewing slot at the connector end thereof which is bridged by the runners and it has a bend which accommodates differential thermal expansion in the circuit board and connector.