Abstract: Disclosed herein is a blank for a heat-transfer device that includes a vapor chamber enclosed by a body of the heat-transfer device, and a charging tube connected to the vapor chamber, wherein a part of the charging tube protruding from the body has at least one unsealed sealing zone with an oblong flow area, where a width of the charging tube exceeds a height of the charging tube.

Abstract: In one embodiment a power semiconductor module includes a substrate having a first substrate side for carrying an electric circuit and having a second substrate side being located opposite to the first substrate side. The second substrate side has a flat surface and is adapted for coming in contact with a cooler. A cooling area that is surrounded by a connecting area is located at the second substrate side. A first casing component of the cooler is connected to the second substrate side at the connecting area and a second casing component is connected to the first casing component such that a cooling channel for providing the cooling area with cooling fluid is provided between the first casing component and the second casing component. A cooling structure can be welded to the cooling area at the second substrate side.

Abstract: A heat dissipation device is provided herein. The heat dissipation device includes an evaporator chamber at least partially filled with a working fluid to be evaporated when being heated by a heat source; at least one condenser chamber for receiving evaporated working fluid and for condensing the evaporated working fluid, wherein the condenser chamber is interconnected with the evaporator chamber in a fluid conductive manner; and at least one air fin element interconnected between the condenser chamber and one of a further condenser chamber and a side wall of the heat dissipation device; wherein the air fin element has a triply periodic surface providing air fins.

Abstract: A heat-transfer device includes a bi-porous wick having at least one layer including a micro-porous body and tubular macro-pores, and a dense casing enclosing the wick, wherein the body and the macro-pores are fluidically interconnected and are at least partially overlapping inside the layer.

Abstract: A heat exchanger includes: a baseplate having a first side and a second side opposite the first side, the first side being coupled to a thermosiphon, one or more electronic components being mounted on the second side. The baseplate has a two-phase heat spreading structure. In an embodiment, the heat exchanger includes a thermosiphon.

Abstract: The disclosure relates to a vapor chamber for cooling an electronic component. The vapor chamber includes a bottom cover for receiving waste heat from the electronic component, a top cover, wherein the bottom cover and the top cover are formed such that a vapor cavity for accommodating a liquid is formed between the bottom cover and the top cover, a crate element for providing mechanical strength to the vapor chamber, wherein the crate element has at least one compartment, which is formed by at least three side panels being connected to each other and extending from the bottom cover to the top cover, and a top recess facing the top cover and a bottom recess facing the bottom cover, and at least one porous pillar for transferring the liquid from the top cover to the bottom cover.

Abstract: A loop heat pipe includes: an evaporator having an enclosure with a heat receiving side and side walls with openings forming an evaporator chamber, the evaporator chamber including a primary capillary structure adjacent to the heat receiving side of the enclosure and extending to the side walls of the evaporator chamber, a plurality of grooves in the primary capillary structure, each of which extends from an opening in one of the side walls to an opening in an opposite side wall, the plurality of grooves transporting vapor from the primary capillary structure to the openings; and a condenser.

Abstract: The invention relates to a method which is suited for manufacturing a 3D-vapor chamber in a defined and efficient manner. Especially, the present method provides a solution for providing a vapor chamber having an evaporator and a condenser made from a first part and a second part, wherein continuity of internal structures is given which in turn provides an efficient working behaviour of the vapor chamber.

Abstract: The invention relates to a two-phase heat transfer device for dissipating heat from a heat source, for instance a power semiconductor module, by a heat transfer medium, wherein the two-phase heat transfer device includes a main body, wherein the main body is formed by a body material and includes a multi-dimensional void network, wherein the multi-dimensional void network includes voids and is adapted for containing the heat transfer medium, wherein the multi-dimensional void network is adapted such that a flow of the heat transfer medium along a path through the main body is based on a variation in capillary action exerted by the multi-dimensional void network on the heat transfer medium along the path. Further the invention relates to a power semiconductor module comprising the above two-phase heat transfer device for heat dissipation and to a method for producing the above two-phase heat transfer device.

Abstract: The application relates to a vapor chamber for cooling a heat source, the vapor chamber includes an evaporator proceeding in a first plane and the vapor chamber includes at least a first condenser and a second condenser, wherein the first and second condenser are internally coupled to the evaporator, wherein the first condenser proceeds in a second plane, and the second condenser proceeds in a third plane, wherein the second plane and the third plane are arranged in an angle to the first plane, wherein at least one air fin is provided, wherein the at least one air fin proceeds in a fourth plane, and wherein the first condenser and the second condenser are internally coupled to the air fin, and wherein the evaporator, the first condenser, the second condenser and the air fin form a common internal volume.

Abstract: The invention relates to a vapor chamber (10), comprising a sealed casing (12) which comprises two main walls, wherein a first main wall is an evaporator wall (14) and a second main wall is a condenser wall (16), wherein the two main walls are connected by side connections (18, 20) to form a sealed volume (21) inside the two main walls and the side connections (18, 20), wherein a plurality of pillars (22) is provided in the sealed volume (21) such, that the pillars (22) connect the evaporator wall (14) and the condenser wall (16), wherein the pillars (22) have a first contact area (24) to the evaporator wall (14) and a second contact area (26) to the condenser wall (16), and wherein the pillars (22) further comprise an intermediate cross section area (28) being arranged between the first contact area (24) and the second contact area (26), wherein the extension of the intermediate cross section area (28) is smaller compared to the extension of both of the first contact area (24) and the second contact area (26

Abstract: A heat exchanger includes: a baseplate having a first side and a second side opposite the first side, the first side being coupled to a thermosiphon, one or more electronic components being mounted on the second side. The baseplate has a two-phase heat spreading structure. In an embodiment, the heat exchanger includes a thermosiphon.

Abstract: The invention relates to a method which is suited for manufacturing a 3D-vapor chamber in a defined and efficient manner. Especially, the present method provides a solution for providing a vapor chamber having an evaporator and a condenser made from a first part and a second part, wherein continuity of internal structures is given which in turn provides an efficient working behaviour of the vapor chamber.

Abstract: A heat exchange device may be based on a pulsating heat pipe and a cooling arrangement. The heat exchange device may include a plurality of pipes to provide fluid paths between a first fluid distribution element and a second fluid distribution element. Each pipe of the plurality of pipes may include a group of channels. Each of the first and second fluid distribution elements may include a plate of a first type. Each plate of the first type may include openings for providing alignment functionality for the plurality of pipes. The first fluid distribution element may include a plate of a second type that may include openings for providing fluid paths between the pipes. The plate of the second type may be positioned on a side of the plate of the first type of plates of the first fluid distribution element that is opposite to the second fluid distribution element.

Abstract: An arrangement for cooling a closed, sealed cabinet (1), comprising a thermosiphon heat exchanger (2) disposed inside the cabinet (1) and having an evaporator (3) and a condenser (4) for circulating a working fluid between the evaporator (3) and the condenser (4) in a closed loop, wherein the working fluid evaporated in the evaporator (3) by heat flows to the condenser (4) for cooling and the condensed working fluid flows back to the evaporator (3). The evaporator (3) is exposed to hot air flow generated inside the cabinet (1), and a heat transfer element (5) is attached to the condenser (3) in a sealed manner through a cabinet wall (6) for transferring heat to the outside of the cabinet (1).

Abstract: A heat exchanger assembly is disclosed.

Abstract: This invention relates to a cooling apparatus comprising a base plate, an evaporator and a condenser. In order to obtain a simple and efficient cooling apparatus the evaporator is a porous aluminum evaporator having a capillary structure with pores and a plurality of larger sized evaporator channels extending through the evaporator between a second end and the first end of the evaporator. A compensation chamber extending along a second surface of the evaporator receives first fluid from the condenser such that pores opening up into the second surface of the evaporator are provided with first fluid.

Abstract: A heat exchanger assembly (1) is disclosed.

Abstract: A power device comprises at least one power semiconductor module comprising a wide bandgap semiconductor element; and a cooling system for actively cooling the wide bandgap semiconductor element with a cooling medium, wherein the cooling system comprises a refrigeration device for lowering a temperature of the cooling medium below an ambient temperature of the power device; wherein the cooling system is adapted for lowering the temperature of the cooling medium in such a way that a temperature of the wide bandgap semiconductor element is below 100° C.

Abstract: A cooling assembly comprising a plurality of fin elements stacked in a stack direction, a plurality of coolant channels each located between adjacent fin elements and extending in a coolant channel direction perpendicular to the stack direction, a first heat transfer surface adapted to be in contact with a heat generating element, and a second heat transfer surface spaced apart from the first heat transfer surface, the plurality of fin elements and the plurality of coolant channels being located between the first heat transfer surface and the second heat transfer surface. Each of the fin elements comprises a pulsating heat pipe embedded therein, a main pulsating direction of each of the pulsating heat pipes being substantially parallel to a normal of the first heat transfer surface.