Abstract: A cooling assembly is disclosed having a device chamber, a cooling chamber, a heat exchanger, a fan and a controller, the heat exchanger having a first heat exchanger unit and a second heat exchanger unit located above the first heat exchanger unit. The fan includes a first fan adapted to generate a first cooling air flow. The cooling assembly further includes a first dust tray located between the first heat exchanger unit and the second heat exchanger unit, the first cooling air flow being directed towards the first dust tray, the first dust tray being adapted to receive and retain at least part of contaminant particles present in the first cooling air flow, the device chamber being separated from the cooling chamber.

Abstract: A heat exchanger including a first heat exchanger module with a first evaporator channel and a first condenser channel. The first evaporator channel and the first condenser channel are arranged in a first conduit. The first evaporator channel and the first condenser channel are fluidly connected to one another by a first upper distribution manifold and a first lower distribution manifold such that the first evaporator channel and the first condenser channel form a first loop for a working fluid. The first heat exchanger module includes a first evaporator heat transfer element and a first condenser heat transfer element. The heat exchanger includes a second heat exchanger module coupled to the first heat exchanger module by a fluid connection element for an exchange of the working fluid between the first heat exchanger module and second heat exchanger module.

Abstract: The disclosure relates to a heat exchanger including an evaporator with a pair of base plates, each base plate having a first surface with channels extending from a manifold at a first end of the evaporator to a manifold at a second end of the evaporator, some of the channels are embedded into the base plate and some of the channels are arranged outside of base plate, a condenser with channels extending from a manifold at a first end of the condenser to a manifold at a second end of the condenser, at least one riser pipe and at least one return pipe.

Abstract: An electric machine including a closed chamber with a wall and enclosing a stator, a rotor and a first fluid and a heat exchanging unit stretching from the chamber through the wall to a fluid transporting passage. The heat exchanging unit includes conduits provided in a loop, containing a working fluid and equipped with evaporator channels and condenser channels, first heat transfer elements inside the chamber for transferring heat from the first fluid to the working fluid via the evaporator channels and second heat transfer elements in the passage for transferring heat out of the working fluid via the condenser channels to a second fluid, a first fluid propagating unit inside the chamber forcing the first fluid to circulate and a second fluid propagating unit in the passage forcing the second fluid to flow past the second heat transfer element.

Abstract: The disclosure relates to an apparatus including a first heat transfer element having a base plate, with a first surface for receiving an electric component and channels for transferring a heat load received via the first surface into a fluid in the channels, at least some of the channels protrude from a second surface of the base plate, and a second heat transfer element for receiving fluid from the first heat transfer element and passing a heat load from said fluid to surroundings. In order to obtain an efficient cooling, a phase change material is arranged at a second surface of the base plate between at least two of the channels, the phase change material absorbing heat by changing phase at a phase change temperature during operation of the electric component.

Abstract: A power-electronic arrangement comprising semiconductor components (102, 103, 107), a heat exchanger (110), and an electrically conductive element (109) is presented. The heat exchanger comprises evaporator channels (111) and condenser channels (112) for working fluid. The electrically conductive element comprises a contact surface providing a thermal contact to outer surfaces of walls of the evaporator channels for transferring heat from the electrically conductive element to the evaporator channels. A main current terminal of each semiconductor component is bonded to the electrically conductive element which thus forms a part of a main current circuitry of a power system. As the main current terminal is directly bonded to the electrically conductive element cooled with the heat exchanger, the temperature gradients inside the semiconductor components can be kept moderate, and thus the temperatures inside the semiconductor components can be limited.

Abstract: Exemplary embodiments are directed to a heat exchanger system for transformers or reactors having at least one coil being cooled by gaseous fluids circulating around the transformer. The system having an enclosure that houses the transformer and the at least one coil, where flow of cooling gaseous fluid passes over the coil and is heated by the heat of the transformer or reactor the heated gas is directed to pass over a thermosiphon heat exchanger which dissipates the heat to a cooling media.

Abstract: A cooling device for a circuit breaker which comprises a case having a front wall, a rear wall, an upper wall, a lower wall, two flanks, and a first series of side-by-side terminals and a second series of side-by-side terminals that protrude outside from the case for the connection of the circuit breaker with an electrical circuit. The cooling device includes at least one first body made of a thermal conducting material and which has a central portion suitable for being positioned transversally along and facing the first series of terminals so as to absorb heat generated at the first series of terminals, and a first end portion and a second end portion that protrude from the central portion and are configured so as to receive the heat absorbed by the central portion and to diffuse it outside the cooling device itself.

Abstract: The disclosure relates to a heat exchanger including at least a first group and a second group of channels arranged to provide fluid paths between a first end and a second end of the heat exchanger. Connecting parts are arranged at the first end and at the second end of the heat exchanger. A first heat transfer element transfers a heat load to fluid, and a second heat transfer element transfers a heat load from the fluid. The channels have capillary dimensions.

Abstract: An evaporator is disclosed for a cooling circuit. The evaporator includes a housing having at least one wall for contacting a heat emitting device. A channel, the cross section of which is small enough to allow convection boiling, and a separation volume are located in the evaporator. The separation volume is located at a vapor exiting port of the channel. The evaporator can include a liquid reservoir.

Abstract: Exemplary embodiments relate to a system and method for monitoring functional operational reliability of a cooling system having at least one thermosyphon for transformers provided with at least one evaporator and with at least one condenser. The cooling system using a coolant which can be vaporized and a gaseous medium, as a heat carrier.

Abstract: A method for fabricating an electrical module comprising a first substrate plate (101), a second substrate plate (102), and semiconductor components (103-110) between the first and second substrate plates is presented. Also an electrical module obtainable with the method and an electrical converter device including such electrical modules are presented. In the method, a bond (112) between first sides of the semiconductor components and the first substrate plate is made by sintering and, subsequently, a bond (111) between second sides of the semiconductor components and the second substrate plate is made by soldering. As the sintered bond can withstand high temperatures, a high temperature solder can be used for the soldered bond without damaging the earlier made sintered bond.

Abstract: An exemplary heat exchanger includes evaporator channels and condenser channels, connecting parts for providing fluid paths between evaporator channels and the condenser channels, a first heat transfer element for transferring a heat load to a fluid in said evaporator channels, and a second heat transfer element for transferring a heat load from a fluid in the condenser channels. In order to achieve a heat exchanger that can be used in any position, the evaporator channels and said condenser channels can have capillary dimensions. The connecting part arranged at a first end of heat exchanger can include a first fluid distribution element for conducting fluid from a predetermined condenser channel into a corresponding predetermined evaporator channel, and the connecting part arranged at a second end of the heat exchanger can include a second fluid distribution element for conducting fluid from a predetermined evaporator channel into a corresponding predetermined condenser channel.

Abstract: A power-electronic arrangement comprising semiconductor components (102, 103, 107), a heat exchanger (110), and an electrically conductive element (109) is presented. The heat exchanger comprises evaporator channels (111) and condenser channels (112) for working fluid. The electrically conductive element comprises a contact surface providing a thermal contact to outer surfaces of walls of the evaporator channels for transferring heat from the electrically conductive element to the evaporator channels. A main current terminal of each semiconductor component is bonded to the electrically conductive element which thus forms a part of a main current circuitry of a power system. As the main current terminal is directly bonded to the electrically conductive element cooled with the heat exchanger, the temperature gradients inside the semiconductor components can be kept moderate, and thus the temperatures inside the semiconductor components can be limited.

Abstract: An evaporator for a cooling circuit is provided, for cooling at least one heat emitting device by evaporation of a cooling fluid. The evaporator includes a top collector, a bottom collector, and an evaporator body. The evaporator body includes at least one thermoconducting wall that is thermally connectable to the at least one heat emitting device, a plurality of evaporation channels, and a plurality of return channels.

Abstract: A thermosyphon heat exchanger according to the disclosure includes a set of linear conduit elements and a heat exchange plate mounted in a heat receiving region on the conduit elements. The longitudinal axes of the conduit elements extend in a first direction in a plane defined by the flat side of the heat exchange plate. The conduit elements project above the heat receiving region in the first direction on a first side and an opposing second side such that the extension of the conduit elements on each side of the heat exchange region is suitable for constituting a condensing region for condensing a refrigerant vaporized in the heat receiving region if the first direction is arranged vertically.

Abstract: A cooling device for a circuit breaker which comprises a case having a front wall, a rear wall, an upper wall, a lower wall, two flanks, and a first series of side-by-side terminals and a second series of side-by-side terminals that protrude outside from the case for the connection of the circuit breaker with an electrical circuit. The cooling device includes at least one first body made of a thermal conducting material and which has a central portion suitable for being positioned transversally along and facing the first series of terminals so as to absorb heat generated at the first series of terminals, and a first end portion and a second end portion that protrude from the central portion and are configured so as to receive the heat absorbed by the central portion and to diffuse it outside the cooling device itself.

Abstract: A thermosyphon heat exchanger includes a first set of first conduit elements for heat absorbing and a second set of second conduit elements for heat releasing. A first end of the first set can be connected to a first end of the second set by at least one manifold and a second end of the first set is connected to a second end of the second set by at least one other manifold. At least one first set of first conduit elements and the at least one second set of second conduit elements are at least partially arranged such that a stack is formed.

Abstract: A thermosyphon heat exchanger includes a plurality of first conduit elements and a plurality of second conduit elements. Each first conduit element has a heat absorbing portion defining a first plane and a first fluid transfer portion defining a second plane. The first plane and the second plane are twisted relative to each other. Each second conduit element has a heat releasing portion and a second fluid transfer portion or a connection to a fluid return line. At least one first conduit element and at least one second conduit element are connected to each other such that the fluid in the thermosyphon heat exchanger can flow in a closed loop through said first conduit element and said second conduit element.

Abstract: The disclosure relates to a two-phase cooling circuit. The cooling circuit can include an evaporator and a condenser. The evaporator and condenser can be connected by a feeder line and a first return line. A phase separator is arranged at an inlet side of the condenser. The phase separator can be connected with the evaporator by a second return line.