Abstract: A magnetic field sensor includes at least one coil responsive to an AC coil drive signal; at least one magnetic field sensing element responsive to a sensing element drive signal and configured to detect a directly coupled magnetic field generated by the at least one coil and to generate a magnetic field signal in response to the directly coupled magnetic field; a processor responsive to the magnetic field signal to compute a sensitivity value associated with detection of the directly coupled magnetic field and substantially independent of a reflected magnetic field reflected by a conductive target disposed proximate to the at least one magnetic field sensing element; and an output signal generator configured to generate an output signal of the magnetic field sensor indicative of the reflected magnetic field.

Abstract: Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.

Abstract: An electronics module assembly for detecting photons is provided to include: a substrate layer; a buried layer deposited upon a first surface area of the substrate layer; an intrinsic layer deposited upon a first portion of a first surface area of the buried layer; a plug layer deposited upon a second portion of the first surface area of the buried layer; a p-plus layer deposited upon a first surface area of the intrinsic layer; an n-plus layer deposited upon a first surface area of the plug layer; a pre-metal dielectric (PMD) layer deposited upon the p-plus layer and n-plus layer; a first node coupled, through the PMD layer, to the p-plus layer; and a second node coupled, through the PMD layer, to the n-plus layer.

Abstract: Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.

Abstract: According to an embodiment of the present disclosure, a photodetector device can include a substrate layer; a bottom contacting layer disposed over a surface of the substrate layer and having a first contacting region and a second contacting region, the bottom contacting layer providing a low resistance path between the first and second contacting regions; an insulating layer disposed over a surface of the bottom contacting layer; an intrinsic region disposed within the insulating layer, the intrinsic region in electrical contact with the first contacting region of the bottom contacting layer, the intrinsic region comprising a low band-gap material; a metal contact disposed within the insulating layer and in electrical contact with the second contacting region of the bottom contacting layer; an anode in electrical contact with the intrinsic region; and a cathode in electrical contact with the metal contact.

Abstract: A magnetoresistance assembly can include a substrate and a first GMR element disposed over the substrate, the first GMR element having a bottom surface and top surface. The magnetoresistance assembly can further include a first TMR element disposed over the substrate, the first TMR element having a top surface and a bottom surface, wherein a line perpendicular to and intersecting the top or bottom surface of the first TMR element intersects the first GMR element. The first GMR element and the first TMR element are in electrical communication.

Abstract: Methods and apparatus for sensing target position by generating a signal by energizing a shaped coil with an AC signal. A sensor receives a signal reflected by a target in response to the signal from the shaped coil, wherein the shaped coil has a first width, and wherein the sensor includes a first sensing element aligned with the shaped coil at the first width, wherein a ratio of the first width and a distance from the sensor to the target is about three-to-one. The received signal can be processed to determine position information of the target. In some embodiments, a shaped coil can have a trapezoidal shape and sensors aligned with the coil to select a sensor based upon target to sensor distance.

Abstract: A current sensor can indirectly measure a sensed current by directly measuring static perturbing AC magnetic fields with magnetoresistance elements, the perturbing magnetic fields generated by perturbing coils. The sensed current can be indirectly measured by modulating or changing sensitivities of the magnetoresistance elements in a way that is directly related to the sensed current.

Abstract: A pressure sensor includes a conductive substrate having a cavity which forms a thin portion that can be deformed by a pressure differential. A magnetic field sensor has at least one coil responsive to a changing coil drive signal and positioned proximate to the thin portion of the substrate that induces eddy currents in the thin portion that generate a reflected magnetic field. Magnetic field sensing elements detect the reflected magnetic field and generate a magnetic field signal. The magnetic field sensor is positioned so that deformation of the thin portion of the substrate causes a distance between the thin portion of the substrate and the magnetic field sensor to change.

Abstract: A magnetic field sensor includes at least one coil responsive to an AC coil drive signal; at least two spaced apart magnetic field sensing elements responsive to a sensing element drive signal and positioned proximate to the at least one coil; and a circuit coupled to the at least two magnetic field sensing elements to generate an output signal of the magnetic field sensor indicative of a difference between a distance of a conductive target with respect to each of the at least two spaced apart magnetic field sensing elements.

Abstract: A pressure sensor comprises a deformable substrate, at least one coil supported by the substrate and responsive to a changing coil drive signal to produce a changing magnetic field, a fluid chamber having a first wall formed by the substrate and a second wall formed by a conductive material and positioned proximate to the at least one coil so that the changing magnetic field produces eddy currents within the conductive material that generate a reflected magnetic field, and at least one magnetic field sensing element configured to detect the reflected magnetic field and produce a signal responsive to a distance between the magnetic field sensing element and the second wall. The substrate is deformable by fluid pressure within the fluid chamber and the deformation of the substrate changes the distance between the magnetic field sensing element and the second wall.

Abstract: An apparatus including a magnetoresistance element having conductive contacts disposed between the magnetoresistance element and a semiconductor substrate.

Abstract: Methods and apparatus for a magnetic field sensor integrated circuit including a lead frame having a first surface, a second opposing surface, and a plurality of leads. A substrate has a first surface supporting a magnetic field sensing element and a second surface attached to the first surface of the lead frame. A magnet has a first surface and a second, opposing surface, and is configured to generate a magnetic field. A spacer is positioned between the first surface of the magnet and the second surface of the lead frame with a thickness selected to establish a predetermined distance between the first surface of the magnet and the magnetic field sensing element, the predetermined distance selected to provide the magnetic field signal as a sinusoidal signal.

Abstract: Methods and apparatus for sensing target position by generating a signal by energizing a shaped coil with an AC signal. A sensor receives a signal reflected by a target in response to the signal from the shaped coil, wherein the shaped coil has a first width, and wherein the sensor includes a first sensing element aligned with the shaped coil at the first width, wherein a ratio of the first width and a distance from the sensor to the target is about three-to-one. The received signal can be processed to determine position information of the target. In some embodiments, a shaped coil can have a trapezoidal shape and sensors aligned with the coil to select a sensor based upon target to sensor distance.

Abstract: A manufacturing method results in a magnetoresistance element having conductive contacts disposed between the magnetoresistance element and a semiconductor substrate.

Abstract: A magnetoresistance element assembly has two stacks of material layers with respective reference layers and respective bias layers that have relative magnetic directions that are not perpendicular to each other. Bias layers in the two stacks have bias magnetic directions that oppose each other. Linear range is increased.

Abstract: A pressure sensor comprises a deformable substrate, at least one coil supported by the substrate and responsive to a changing coil drive signal to produce a changing magnetic field, a fluid chamber having a first wall formed by the substrate and a second wall formed by a conductive material and positioned proximate to the at least one coil so that the changing magnetic field produces eddy currents within the conductive material that generate a reflected magnetic field, and at least one magnetic field sensing element configured to detect the reflected magnetic field and produce a signal responsive to a distance between the magnetic field sensing element and the second wall. The substrate is deformable by fluid pressure within the fluid chamber and the deformation of the substrate changes the distance between the magnetic field sensing element and the second wall.

Abstract: A pressure sensor includes a conductive substrate having a cavity which forms a thin portion that can be deformed by a pressure differential. A magnetic field sensor has at least one coil responsive to a changing coil drive signal and positioned proximate to the thin portion of the substrate that induces eddy currents in the thin portion that generate a reflected magnetic field. Magnetic field sensing elements detect the reflected magnetic field and generate a magnetic field signal. The magnetic field sensor is positioned so that deformation of the thin portion of the substrate causes a distance between the thin portion of the substrate and the magnetic field sensor to change.

Abstract: A manufacturing method results in a magnetoresistance element having conductive contacts disposed between the magnetoresistance element and a semiconductor substrate.

Abstract: A magnetic field sensor can include a magnetic field sensor can include a substrate having a major surface in an x-y plane with an x axis and a y axis. The magnetic field sensor can also have an external field sensing circuit disposed upon the substrate and responsive to an external magnetic field generated outside of the magnetic field sensor. The external field sensing circuit can include one or more magnetoresistance elements, each having a respective reference layer with a magnetic direction parallel to the y axis and in the x-y plane. The one or more magnetoresistance elements can be operable to generate a magnetoresistance element signal responsive to the external magnetic field.