Patents by Inventor Bucknell C. Webb
Bucknell C. Webb has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250148328Abstract: A method comprises performing a pattern recognition process to determine a geometry of a superconducting quantum device comprising one or more Josephson junctions, determining, based on the geometry determined by the pattern recognition process, a laser beam illumination pattern for laser annealing the one or more Josephson junctions of the superconducting quantum device, and configuring a laser microscope to generate the laser beam illumination pattern.Type: ApplicationFiled: November 4, 2023Publication date: May 8, 2025Inventors: Russell A. Budd, Eric Zhang, Jared Barney Hertzberg, Jason S. Orcutt, Sami Rosenblatt, James B Hannon, Yves Martin, Bucknell C. Webb
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Patent number: 11961958Abstract: A composition includes an electrode made of Lithium Manganese Oxyfluoride (LMOF). A single layer separator adheres to a surface of the electrode, is a dielectric that is conductive for Lithium ions but not electrons, and has top and bottom sides. A solid polymer electrolyte (SPE) saturates the electrode so that the LMOF is between 55 percent and 85 percent by mass of a composition of the LMOF electrode and the SPE is between 7.5 percent and 20 percent by mass of the composition of the LMOF electrode. The SPE saturates the separator so that the SPE resides both on the separator top and bottom sides so that the SPE residing on the separator top side contacts the surface. The LMOF exhibits X-Ray Diffraction spectrum peaks between twenty-two and twenty-four 2-theta degrees, between forty-eight and fifty 2-theta degrees, between fifty-four and fifty-six 2-theta degrees, and between fifty-six and fifty-eight 2-theta degrees.Type: GrantFiled: June 13, 2019Date of Patent: April 16, 2024Assignee: International Business Machines CorporationInventors: John Collins, Bucknell C. Webb, Paul S. Andry, Teodor Krassimirov Todorov, Devendra K. Sadana
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Patent number: 11903734Abstract: Systems, computer-implemented methods and/or computer program products that facilitate wearable multiplatform sensing are provided. In one embodiment, a computer-implemented method comprises: measuring, by a system operatively coupled to a processor, wirelessly on a nail plate, physiological data of an entity; integrating and synchronizing, by the system, the physiological data with other physiological data from one or more devices to form integrated physiological data; and analyzing, by the system, the integrated physiological data to detect one or more disorders.Type: GrantFiled: January 2, 2019Date of Patent: February 20, 2024Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Rajeev Narayanan, Katsuyuki Sakuma, John Knickerbocker, Bucknell C. Webb
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Patent number: 11895932Abstract: Techniques regarding selectively tuning the operating frequency of superconducting Josephson junction resonators are provided. For example, one or more embodiments described herein can comprise a method that can include chemically altering a Josephson junction of a Josephson junction resonator via a plasma treatment. The method can also comprise selectively tuning an operating frequency of the Josephson junction resonator based on a property of the plasma treatment.Type: GrantFiled: June 25, 2020Date of Patent: February 6, 2024Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Eric Peter Lewandowski, Jeng-Bang Yau, Eric Zhang, Bucknell C Webb
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Patent number: 11651973Abstract: A method and apparatus for bonding a processor wafer with a microchannel wafer/glass manifold to form a bonded wafer structure are provided. A glass fixture is also provided for protecting C4 solder bumps on chips disposed on the processor wafer. When the glass fixture is positioned on the processor wafer, posts extending from the glass fixture contact corresponding regions on the processor wafer devoid of C4 solder bumps, so that the glass fixture protects the C4 solder bumps during wafer bonding. The method involves positioning the processor wafer/glass fixture and the microchannel wafer/glass manifold in a metal fixture having one or more alignment structures adapted to engage corresponding alignment elements formed in the processor wafer, glass fixture and/or glass manifold. The metal fixture secures the wafer components in place and, after melting solder pellets disposed between the processor wafer/glass fixture and microchannel wafer/glass manifold, a bonded wafer structure is formed.Type: GrantFiled: May 8, 2020Date of Patent: May 16, 2023Assignee: International Business Machines CorporationInventors: Jae-Woong Nah, Evan Colgan, Robert P. Kuder, II, James L. Speidell, Bucknell C. Webb
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Patent number: 11489219Abstract: An energy storage device sits within a trench with electrically insulated sides within a substrate. Within the trench there is an anode, an electrolyte disposed on the anode, and a cathode structure disposed on the electrolyte. Variations of an electrically conductive contact are disposed on and in electrical contact with the cathode structure. At least part of the conductive contact is disposed within the trench and the conductive contact partially seals the anode, electrolyte, and cathode structure within the trench. Conductive and/or non-conductive adhesives are used to complete the seal thereby enabling full working electrochemical devices where singulation of the devices from the substrate enables high control of device dimensionality and footprint.Type: GrantFiled: June 18, 2019Date of Patent: November 1, 2022Assignee: International Business Machines CorporationInventors: John Collins, Devendra K. Sadana, Bucknell C. Webb, Paul S. Andry
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Patent number: 11411272Abstract: A micro-battery is provided in which a metallic sealing layer is used to provide a hermetic seal between an anode side of the micro-battery and the cathode side of the micro-battery. In accordance with the present application, the metallic sealing layer is formed around a perimeter of each metallic anode structure located on the anode side and then the metallic sealing layer is bonded to a solderable metal layer of a wall structure present on the cathode side. The wall structure contains a cavity that exposes a metallic current collector structure, the cavity is filled with battery materials.Type: GrantFiled: November 13, 2017Date of Patent: August 9, 2022Assignee: International Business Machines CorporationInventors: Paul S. Andry, Bing Dang, John U. Knickerbocker, Yang Liu, Jae-Woong Nah, Adinath Narasgond, Bucknell C. Webb
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Patent number: 11362382Abstract: A micro-battery is provided in which a metallic sealing layer is used to provide a hermetic seal between an anode side of the micro-battery and the cathode side of the micro-battery. In accordance with the present application, the metallic sealing layer is formed around a perimeter of each metallic anode structure located on the anode side and then the metallic sealing layer is bonded to a solderable metal layer of a wall structure present on the cathode side. The wall structure contains a cavity that exposes a metallic current collector structure, the cavity is filled with battery materials.Type: GrantFiled: January 26, 2017Date of Patent: June 14, 2022Assignee: International Business Machines CorporationInventors: Paul S. Andry, Bing Dang, John U. Knickerbocker, Yang Liu, Jae-Woong Nah, Adinath Narasgond, Bucknell C. Webb
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Patent number: 11316164Abstract: Batteries include an anode structure, a cathode structure, and a conductive overcoat. The anode structure includes an anode substrate, an anode formed on the anode substrate, and an anode conductive liner that is in contact with the anode. The cathode structure includes a cathode substrate, a cathode formed on the cathode substrate, and a cathode conductive liner that is in contact with the cathode. The conductive overcoat is formed over the anode structure and the cathode structure to seal a cavity formed by the anode structure and the cathode structure. At least one of the anode substrate and the cathode substrate is pierced by through vias that are in contact with the respective anode conductive liner or cathode conductive liner.Type: GrantFiled: July 29, 2019Date of Patent: April 26, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Paul S. Andry, Bucknell C. Webb
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Publication number: 20210408360Abstract: Techniques regarding selectively tuning the operating frequency of superconducting Josephson junction resonators are provided. For example, one or more embodiments described herein can comprise a method that can include chemically altering a Josephson junction of a Josephson junction resonator via a plasma treatment. The method can also comprise selectively tuning an operating frequency of the Josephson junction resonator based on a property of the plasma treatment.Type: ApplicationFiled: June 25, 2020Publication date: December 30, 2021Inventors: Eric Peter Lewandowski, Jeng-Bang Yau, Eric Zhang, Bucknell C Webb
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Patent number: 11183725Abstract: A method for forming a battery structure includes texturing an anode packaging material to form a first textured surface, depositing one or more metal layers including an anode metal on the first textured surface and forming a separator on the anode metal. It also includes texturing a cathode packaging material to form a second textured surface, depositing a cathode metal on the second textured surface, and forming an electrolyte binder paste on the cathode metal, which contacts the separator with any gap being filled with electrolyte.Type: GrantFiled: January 2, 2020Date of Patent: November 23, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Paul S. Andry, Paul A. Lauro, Jae-Woong Nah, Adinath Narasgond, Robert J. Polastre, Bucknell C. Webb
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Publication number: 20210351043Abstract: A method and apparatus for bonding a processor wafer with a microchannel wafer/glass manifold to form a bonded wafer structure are provided. A glass fixture is also provided for protecting C4 solder bumps on chips disposed on the processor wafer. When the glass fixture is positioned on the processor wafer, posts extending from the glass fixture contact corresponding regions on the processor wafer devoid of C4 solder bumps, so that the glass fixture protects the C4 solder bumps during wafer bonding. The method involves positioning the processor wafer/glass fixture and the microchannel wafer/glass manifold in a metal fixture having one or more alignment structures adapted to engage corresponding alignment elements formed in the processor wafer, glass fixture and/or glass manifold. The metal fixture secures the wafer components in place and, after melting solder pellets disposed between the processor wafer/glass fixture and microchannel wafer/glass manifold, a bonded wafer structure is formed.Type: ApplicationFiled: May 8, 2020Publication date: November 11, 2021Inventors: Jae-Woong Nah, Evan Colgan, Robert P. Kuder, II, James L. Speidell, Bucknell C. Webb
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Patent number: 11088097Abstract: An electronic package apparatus is formed from a semiconductor substrate having a cavity formed therein. The cavity has a top surface, a bottom surface and a sidewall surface, and a spacer extending from the bottom surface to the top surface. The spacer is formed from a dielectric material and has at least one lateral dimension less than 0.1 cm.Type: GrantFiled: May 16, 2019Date of Patent: August 10, 2021Assignee: International Business Machines CorporationInventor: Bucknell C. Webb
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Patent number: 11043690Abstract: Systems and/or techniques associated with a sandwich-parallel micro-battery are provided. In one example, a device comprises a first battery and a second battery. The first battery comprises a first surface and a second surface. The second surface is smaller than the first surface. The second battery comprises a third surface and a fourth surface. The fourth surface is smaller than the third surface. Furthermore, the fourth surface is mechanically coupled to the second surface of the first battery. The third surface of the second battery and the first surface of the first battery comprise a conductive contact that electrically couples the first battery and the second battery.Type: GrantFiled: January 2, 2019Date of Patent: June 22, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jae-Woong Nah, Paul S. Andry, Eric Peter Lewandowski, Bucknell C. Webb, Adinath Shantinath Narasgond, Bo Wen
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Patent number: 11000474Abstract: Electromechanical substance delivery devices are provided which implement low-power electromechanical release mechanisms for controlled delivery of substances such as drugs and medication. For example, an electromechanical device includes a substrate having a cavity formed in a surface of the substrate, a membrane disposed on the surface of the substrate covering an opening of the cavity, and a seal disposed between the membrane and the surface of the substrate. The seal surrounds the opening of the cavity, and the seal and membrane are configured to enclose the cavity and retain a substance within the cavity. An electrode structure is configured to locally heat a portion of the membrane in response to a control voltage applied to the electrode structure, and create a stress that causes a rupture in the locally heated portion of the membrane to release the substance from within the cavity.Type: GrantFiled: December 22, 2017Date of Patent: May 11, 2021Assignee: International Business Machines CorporationInventors: S. Jay Chey, Bing Dang, John U. Knickerbocker, Kenneth F. Latzko, Joana Sofia Branquinho Teresa Maria, Lavanya Turlapati, Bucknell C. Webb, Steven L. Wright
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Patent number: 10940265Abstract: A digital biomedical device includes a substrate forming a reservoir, a membrane comprising a first layer and a second layer having a strain therebetween, the membrane sealing the reservoir, and a controller configured to activate the membrane and release at least a portion of the strain causing the membrane curl and open the reservoir.Type: GrantFiled: June 9, 2019Date of Patent: March 9, 2021Assignee: International Business Machines CorporationInventors: Bing Dang, John U. Knickerbocker, Joana S. B. T. Maria, Bucknell C. Webb, Steven L. Wright
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Patent number: 10881788Abstract: A digital biomedical device includes a substrate forming a cavity, a seal formed around the cavity, a lid coupled to the substrate by the seal, a reactive metal structure comprising a plurality of metal layers, wherein the reactive metal structure is a component of at least one of the substrate and the lid, a metal trace configured to initiate a self-propagating reaction between the plurality of metal layers of the reactive metal structure and release contents of the cavity, and a power supply configured to apply an electric current to the metal trace.Type: GrantFiled: October 30, 2015Date of Patent: January 5, 2021Assignee: International Business Machines CorporationInventors: Bing Dang, Gregory M Fritz, Eric P Lewandowski, Joana S. B. T. Maria, Bucknell C Webb, Steven L Wright
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Publication number: 20200403190Abstract: An energy storage device sits within a trench with electrically insulated sides within a substrate. Within the trench there is an anode, an electrolyte disposed on the anode, and a cathode structure disposed on the electrolyte. Variations of an electrically conductive contact are disposed on and in electrical contact with the cathode structure. At least part of the conductive contact is disposed within the trench and the conductive contact partially seals the anode, electrolyte, and cathode structure within the trench. Conductive and/or non-conductive adhesives are used to complete the seal thereby enabling full working electrochemical devices where singulation of the devices from the substrate enables high control of device dimensionality and footprint.Type: ApplicationFiled: June 18, 2019Publication date: December 24, 2020Inventors: John Collins, Devendra K. Sadana, Bucknell C. Webb, Paul S. Andry
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Publication number: 20200395628Abstract: According to an embodiment of the present invention there is a cathode of an energy storage device. The cathode is made of Lithium Manganese Oxyfluoride (LMOF), with the approximate stoichiometry of Li2MnO2F. In some embodiments, the cathode is made of Lithium Manganese Oxyfluoride (LMOF), Li2MnO2F combined with a solid polymer electrolyte (SPE). Other materials such as conductive material and binders can be included in the cathode. Methods of making are disclosed. According to an embodiment of the present invention there is a composition of matter. The composition is made of Lithium Manganese Oxyfluoride (LMOF), with the approximate stoichiometry of Li2MnO2F combined with a solid polymer electrolyte (SPE). Other materials such as conductive material and binders can be included in the cathode. Methods of making are disclosed. The composition can be used as a cathode in an energy storage device. An energy storage device, e.g. a battery, is disclosed.Type: ApplicationFiled: June 13, 2019Publication date: December 17, 2020Inventors: John Collins, Bucknell C. Webb, Paul S. Andry, Teodor Krassimirov Todorov, Devendra K. Sadana
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Patent number: 10833241Abstract: A thermalization structure is formed using a foil and a low temperature device (LTD). The foil includes a first layer of a first material. The LTD includes a surface from which heat is transferred away from the LTD. A coupling is formed between the foil and the surface of the LTD, where the coupling includes a bond formed between the foil and the surface such that forming the bond forms a set of ridges in the foil, a ridge in the set of ridges operating to dissipate the heat.Type: GrantFiled: June 20, 2019Date of Patent: November 10, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Eric Peter Lewandowski, Bucknell C. Webb, Jared Barney Hertzberg, Martin O. Sandberg, Oblesh Jinka