Abstract: Systems and/or techniques associated with a sandwich-parallel micro-battery are provided. In one example, a device comprises a first battery and a second battery. The first battery comprises a first surface and a second surface. The second surface is smaller than the first surface. The second battery comprises a third surface and a fourth surface. The fourth surface is smaller than the third surface. Furthermore, the fourth surface is mechanically coupled to the second surface of the first battery. The third surface of the second battery and the first surface of the first battery comprise a conductive contact that electrically couples the first battery and the second battery.

Abstract: Systems, computer-implemented methods and/or computer program products that facilitate wearable multiplatform sensing are provided. In one embodiment, a computer-implemented method comprises: measuring, by a system operatively coupled to a processor, wirelessly on a nail plate, physiological data of an entity; integrating and synchronizing, by the system, the physiological data with other physiological data from one or more devices to form integrated physiological data; and analyzing, by the system, the integrated physiological data to detect one or more disorders.

Abstract: An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.

Abstract: An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.

Abstract: A method for forming a battery structure includes texturing an anode packaging material to form a first textured surface, depositing one or more metal layers including an anode metal on the first textured surface and forming a separator on the anode metal. It also includes texturing a cathode packaging material to form a second textured surface, depositing a cathode metal on the second textured surface, and forming an electrolyte binder paste on the cathode metal, which contacts the separator with any gap being filled with electrolyte.

Abstract: An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.

Abstract: Devices that have integrated cooling structures for two-phase cooling and methods of assembly thereof are provided. In one example, a chip manifold can be affixed to a chip. An interface can be located at a first position between the chip manifold and the manifold cap. Furthermore, the interface can create a seal.

Abstract: A battery structure includes an anode packaging material having a first textured surface and an anode metal formed on the first textured surface. A separator is formed on the anode metal. A cathode packaging material includes a second textured surface. A cathode metal is formed on the second textured surface. An active cathode paste is formed on the cathode metal and brought into contact with the separator such that any gap is filled with electrolyte.

Abstract: Batteries include an anode structure, a cathode structure, and a conductive overcoat. The anode structure includes an anode substrate, an anode formed on the anode substrate, and an anode conductive liner that is in contact with the anode. The cathode structure includes a cathode substrate, a cathode formed on the cathode substrate, and a cathode conductive liner that is in contact with the cathode. The conductive overcoat is formed over the anode structure and the cathode structure to seal a cavity formed by the anode structure and the cathode structure. At least one of the anode substrate and the cathode substrate is pierced by through vias that are in contact with the respective anode conductive liner or cathode conductive liner.

Abstract: Batteries and methods of forming the same include an anode structure, a cathode structure, and a conductive overcoat. The anode structure includes an anode substrate, an anode formed on the anode substrate, and an anode conductive liner that is in contact with the anode. The cathode structure includes a cathode substrate, a cathode formed on the cathode substrate, and a cathode conductive liner that is in contact with the cathode. The conductive overcoat is formed over the anode structure and the cathode structure to seal a cavity formed by the anode structure and the cathode structure. At least one of the anode substrate and the cathode substrate is pierced by through vias that are in contact with the respective anode conductive liner or cathode conductive liner.

Abstract: A digital biomedical device includes a substrate forming a reservoir, a membrane comprising a first layer and a second layer having a strain therebetween, the membrane sealing the reservoir, and a controller configured to activate the membrane and release at least a portion of the strain causing the membrane curl and open the reservoir.

Abstract: An electronic package apparatus is formed from a semiconductor substrate having a cavity formed therein. The cavity has a top surface, a bottom surface and a sidewall surface, and a spacer extending from the bottom surface to the top surface. The spacer is formed from a dielectric material and has at least one lateral dimension less than 0.1 cm.

Abstract: An electronic package apparatus is formed from a semiconductor substrate having a cavity formed therein. The cavity has a top surface, a bottom surface and a sidewall surface, and a spacer extending from the bottom surface to the top surface. The spacer is formed from a dielectric material and has at least one lateral dimension less than 0.1 cm.

Abstract: An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.

Abstract: A digital biomedical device includes a substrate forming a reservoir, a membrane comprising a first layer and a second layer having a strain therebetween, the membrane sealing the reservoir, and a controller configured to activate the membrane and release at least a portion of the strain causing the membrane curl and open the reservoir.

Abstract: A data readout device is provided and includes a reflective base, reflective sidewalls disposed about the reflective base and an actuation system. The actuation system is configured to modify relative positioning of one of the reflective base and the reflective sidewalls to either reflect incoming radiation back toward an origin thereof or to reflect the incoming radiation away from the origin thereof.

Abstract: Deep via technology is used to construct an integrated silicon cantilever and cavity oriented in a vertical plane which creates an electrostatically-switched MEMS switch in a small wafer area. Another embodiment is a small wafer area electrostatically-switched, vertical-cantilever MEMS switch wherein the switch cavity is etched within a volume defined by walls grown internally within a silicon substrate using through vias.

Abstract: A deformable closed-loop multi-layered microelectronic device is provided. A top layer, a bottom layer and a middle layer of the microelectronic device each have at least a first section and a second section pivotable with respect to each other. A pivot is provided to a terminal end of the first section of the middle layer, for allowing the first section to rotate about the pivot. The pivot is vertically sandwiched between and connected to a terminal end of the first section of the top layer and a terminal end of the first section of the bottom layer. The first sections of the bottom layer and the top layer are pivotable in a substantially synchronized manner to deform the bottom layer and the top layer in a substantially synchronized manner.

Abstract: Deep via technology is used to construct an integrated silicon cantilever and cavity oriented in a vertical plane which creates an electrostatically-switched MEMS switch in a small wafer area. Another embodiment is a small wafer area electrostatically-switched, vertical-cantilever MEMS switch wherein the switch cavity is etched within a volume defined by walls grown internally within a silicon substrate using through vias.

Abstract: A deformable closed-loop multi-layered microelectronic device is provided. A top layer, a bottom layer and a middle layer of the microelectronic device each have at least a first section and a second section pivotable with respect to each other. A pivot is provided to a terminal end of the first section of the middle layer, for allowing the first section to rotate about the pivot. The pivot is vertically sandwiched between and connected to a terminal end of the first section of the top layer and a terminal end of the first section of the bottom layer. The first sections of the bottom layer and the top layer are pivotable in a substantially synchronized manner to deform the bottom layer and the top layer in a substantially synchronized manner.