Abstract: Provided is a heat dissipating substrate including a diamond substrate, wherein an upper portion of the diamond substrate has a concave-convex structure including recessed regions that are spaced apart from each other, and insulation patterns that fill the recessed regions. The insulation patterns include at least one of silicon carbide, silicon nitride, silicon oxide, aluminum nitride, and aluminum oxide.

Abstract: A soft sensor includes an elastic sheet, which includes a first elastic layer and a second elastic layer facing each other, and a sensor unit formed by printing a predetermined conductive liquid metal between the first elastic layer and the second elastic layer. A hand-wearable device may include at least one soft sensor, wherein the hand-wearable device has a shape corresponding to at least a portion of a shape of a hand, and the soft sensor is located at a position corresponding to at least some joints of the hand.

Abstract: Provided is a soft sensor embedded glove including an upper inside skin pattern, a soft sensor module coupled to at least a surface of the upper inside skin pattern, and including at least one soft sensor formed on a joint portion of a finger to measure flexion and extension of the finger, and an outside skin coupled to the upper inside skin pattern and exposed to outside, wherein, in the upper inside skin pattern, a width of a region to which the at least one soft sensor is coupled is less than a width of another region.

Abstract: Provided is a heat dissipating substrate including a diamond substrate, wherein an upper portion of the diamond substrate has a concave-convex structure including recessed regions that are spaced apart from each other, and insulation patterns that fill the recessed regions. The insulation patterns include at least one of silicon carbide, silicon nitride, silicon oxide, aluminum nitride, and aluminum oxide.

Abstract: Provided are a semiconductor device and a method of fabricating the same. The semiconductor device includes a substrate having a first region and a second region, a buffer layer disposed on the substrate, a semiconductor layer disposed on the buffer layer, a barrier layer disposed on the semiconductor layer, a first source electrode, a first drain electrode, and a first gate electrode disposed therebetween, which are disposed on the barrier layer in the first region, a second source electrode, a second drain electrode, and a second gate electrode disposed therebetween, which are disposed on the barrier layer in the second region, and a ferroelectric pattern interposed between the first gate electrode and the barrier layer.

Abstract: A hand-wearable device includes an elastic sheet including a first elastic layer and a second elastic layer facing each other; a sensor unit formed by printing a predetermined conductive liquid metal between the first elastic layer and the second elastic layer; a wire unit extending from the sensor unit and electrically connected to the sensor unit; an electrode substrate formed on one side of the wire unit and spaced apart from the wire unit by a predetermined distance; and a connection electrode formed by printing a predetermined conductive liquid metal between the wire unit and the electrode substrate.

Abstract: A method for controlling displaying, an electronic device therefor, and a server and method therefor are provided. The method includes transmitting information including at least one input keyword to a server, receiving, from the server, a recognition model for filtering out an object included in a received webpage, installing the recognition model, determining whether a first object corresponding to the at least one input keyword exists in the webpage, when the first object corresponding to the input keyword exists in the webpage, processing the first object to become a second object, and displaying the webpage including the processed object.

Abstract: Provided is a soft sensor embedded glove including an upper inside skin pattern, a soft sensor module coupled to at least a surface of the upper inside skin pattern, and including at least one soft sensor formed on a joint portion of a finger to measure flexion and extension of the finger, and an outside skin coupled to the upper inside skin pattern and exposed to outside, wherein, in the upper inside skin pattern, a width of a region to which the at least one soft sensor is coupled is less than a width of another region.

Abstract: Provided are a semiconductor device and a method of fabricating the same. The semiconductor device includes a substrate having a first region and a second region, a buffer layer disposed on the substrate, a semiconductor layer disposed on the buffer layer, a barrier layer disposed on the semiconductor layer, a first source electrode, a first drain electrode, and a first gate electrode disposed therebetween, which are disposed on the barrier layer in the first region, a second source electrode, a second drain electrode, and a second gate electrode disposed therebetween, which are disposed on the barrier layer in the second region, and a ferroelectric pattern interposed between the first gate electrode and the barrier layer.

Abstract: A hand-wearable device includes an elastic sheet including a first elastic layer and a second elastic layer facing each other; a sensor unit formed by printing a predetermined conductive liquid metal between the first elastic layer and the second elastic layer; a wire unit extending from the sensor unit and electrically connected to the sensor unit; an electrode substrate formed on one side of the wire unit and spaced apart from the wire unit by a predetermined distance; and a connection electrode formed by printing a predetermined conductive liquid metal between the wire unit and the electrode substrate.

Abstract: A hand-wearable device includes an elastic sheet including a first elastic layer and a second elastic layer facing each other; a sensor unit formed by printing a predetermined conductive liquid metal between the first elastic layer and the second elastic layer; a wire unit extending from the sensor unit and electrically connected to the sensor unit; an electrode substrate formed on one side of the wire unit and spaced apart from the wire unit by a predetermined distance; and a connection electrode formed by printing a predetermined conductive liquid metal between the wire unit and the electrode substrate.

Abstract: A method for fabricating a semiconductor device includes sequentially laminating a separation layer and a first substrate layer on a sacrificial substrate, and forming a heat dissipation plate comprising a first region and a second region on the first substrate layer. The method further includes removing the sacrificial substrate and the separation layer, and patterning the first substrate layer to form a first substrate exposing the heat dissipation plate in the second region and contacting the heat dissipation plate in the first region, and forming a first element on the first substrate. The method still further includes forming a plurality of conductive pads disposed on the heat dissipation plate in the second region and a first line connecting at least one of the plurality of conductive pads to the first element, and forming a second element on the conductive pads in the second region.

Abstract: Provided are a semiconductor device and a method for fabricating the same. The semiconductor device includes a heat dissipation plate including a first region and a second region, a first element disposed on the heat dissipation plate in the first region, and a second element disposed on the heat dissipation plate in the second region.

Abstract: Provided are a semiconductor device and a method for fabricating the same. The semiconductor device includes a heat dissipation plate including a first region and a second region, a first element disposed on the heat dissipation plate in the first region, and a second element disposed on the heat dissipation plate in the second region. The first element includes a first substrate, the second element includes a second substrate, the first substrate includes a material different from a material of the second substrate, the first substrate contacts the heat dissipation plate, and the second element is bonded to the heat dissipation plate in a flip-chip bonding manner.

Abstract: A soft sensor includes an elastic sheet, which includes a first elastic layer and a second elastic layer facing each other, and a sensor unit formed by printing a predetermined conductive liquid metal between the first elastic layer and the second elastic layer.

Abstract: A hand-wearable device includes an elastic sheet including a first elastic layer and a second elastic layer facing each other; a sensor unit formed by printing a predetermined conductive liquid metal between the first elastic layer and the second elastic layer; a wire unit extending from the sensor unit and electrically connected to the sensor unit; an electrode substrate formed on one side of the wire unit and spaced apart from the wire unit by a predetermined distance; and a connection electrode formed by printing a predetermined conductive liquid metal between the wire unit and the electrode substrate.

Abstract: Provided is a force conveyance system that is configured to have 6 degrees of freedom, thereby allowing freedom of movement such as opening/closing of a hand and adduction/abduction of a finger and reflecting a desired force to a fingertip without obstructing the movement of a finger. Also, the force conveyance system may estimate a fingertip position and a finger joint angle, measure a finger movement, and convey a more accurate force accordingly.

Abstract: Provided is a force conveyance system that is configured to have 6 degrees of freedom, thereby allowing freedom of movement such as opening/closing of a hand and adduction/abduction of a finger and reflecting a desired force to a fingertip without obstructing the movement of a finger. Also, the force conveyance system may estimate a fingertip position and a finger joint angle, measure a finger movement, and convey a more accurate force accordingly.

Abstract: A semiconductor device includes a first semiconductor layer. A second semiconductor layer is disposed on the first semiconductor layer. A structure layer is disposed on the second semiconductor layer. A metal film covers a side surface of the first semiconductor layer, a side surface of the second semiconductor layer, and an upper surface of the structure layer. A flexible substrate covers the metal film.

Abstract: Provided are a semiconductor device and a method for fabricating the same. The semiconductor device includes a heat dissipation plate including a first region and a second region, a first element disposed on the heat dissipation plate in the first region, and a second element disposed on the heat dissipation plate in the second region. The first element includes a first substrate, the second element includes a second substrate, the first substrate includes a material different from a material of the second substrate, the first substrate contacts the heat dissipation plate, and the second element is bonded to the heat dissipation plate in a flip-chip bonding manner.