Patents by Inventor Bum-Gyu Choi

Bum-Gyu Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200051790
    Abstract: A plasma processing apparatus includes a plasma chamber, an electrostatic chuck disposed in the plasma chamber and a pressure control ring disposed in the plasma chamber. The pressure control ring includes a body surrounding an electrostatic chuck in a plan view, an exhaust part disposed in a portion of the body along a first direction, the exhaust part configured to induce a flow of gas in the plasma chamber toward the first direction in a plan view, and a blocking part disposed in another portion of the body along a second direction perpendicular to the first direction in a plan view, the blocking part configured to block the flow of the gas in the second direction.
    Type: Application
    Filed: January 21, 2019
    Publication date: February 13, 2020
    Inventors: Kyu-Chul SHIM, Min-Kyu KANG, Bum-Soo KIM, Yong-Soo KIM, Hee-Jung KIM, Dae-Gyu BAN, Kyoung-Soo LEE, Jong-Sang LEE, Hyo-Il CHOI
  • Patent number: 10090219
    Abstract: The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.
    Type: Grant
    Filed: January 28, 2015
    Date of Patent: October 2, 2018
    Assignee: LG CHEM, LTD.
    Inventors: Min Jin Ko, Kyung Mi Kim, Jae Ho Jung, Bum Gyu Choi, Min Kyoun Kim
  • Patent number: 9870970
    Abstract: The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.
    Type: Grant
    Filed: January 28, 2015
    Date of Patent: January 16, 2018
    Assignee: LG CHEM, LTD.
    Inventors: Min Jin Ko, Kyung Mi Kim, Jae Ho Jung, Bum Gyu Choi, Min Kyoun Kim
  • Patent number: 9837329
    Abstract: The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.
    Type: Grant
    Filed: January 28, 2015
    Date of Patent: December 5, 2017
    Assignee: LG CHEM, LTD.
    Inventors: Min Jin Ko, Kyung Mi Kim, Jae Ho Jung, Bum Gyu Choi, Min Kyoun Kim
  • Patent number: 9805999
    Abstract: The present application relates to a cured product and the use thereof. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. The cured product has excellent transparency, moisture resistance, mechanical properties, and cracking resistance, etc. The cured product, for example, may be applied as an encapsulant or an adhesive material of a semiconductor device to provide a device having high long-term reliability.
    Type: Grant
    Filed: January 28, 2015
    Date of Patent: October 31, 2017
    Assignee: LG CHEM, LTD.
    Inventors: Min Jin Ko, Kyung Mi Kim, Jae Ho Jung, Bum Gyu Choi, Min Kyoun Kim
  • Patent number: 9624345
    Abstract: Provided are a curable composition and its use. The curable composition exhibits excellent processability and workability before curing, and excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability, and adhesiveness after curing. In addition, the curable composition may provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions, and does not causing whitening and surface stickiness.
    Type: Grant
    Filed: January 27, 2015
    Date of Patent: April 18, 2017
    Assignee: LG CHEM, LTD.
    Inventors: Min Jin Ko, Bum Gyu Choi, Jae Ho Jung, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
  • Patent number: 9598542
    Abstract: Provided is a curable composition and its use. The curable composition may exhibit excellent processibility and workability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property after curing. The curable composition may provide a cured product exhibiting stable durability and reliability under severe conditions for a long time and having no whitening and surface stickiness.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: March 21, 2017
    Assignee: LG CHEM, LTD.
    Inventors: Bum Gyu Choi, Min Jin Ko, Myung Sun Moon, Jae Ho Jung, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
  • Publication number: 20160336248
    Abstract: The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.
    Type: Application
    Filed: January 28, 2015
    Publication date: November 17, 2016
    Applicant: LG CHEM, Ltd.
    Inventors: Min Jin KO, Kyung Mi KIM, Jae Ho JUNG, Bum Gyu CHOI, Min Kyoun KIM
  • Publication number: 20160322546
    Abstract: The present application relates to a cured product and the use thereof. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. The cured product has excellent transparency, moisture resistance, mechanical properties, and cracking resistance, etc. The cured product, for example, may be applied as an encapsulant or an adhesive material of a semiconductor device to provide a device having high long-term reliability.
    Type: Application
    Filed: January 28, 2015
    Publication date: November 3, 2016
    Applicant: LG CHEM, LTD.
    Inventors: Min Jin KO, Kyung Mi KIM, Jae Ho JUNG, Bum Gyu CHOI, Min Kyoun KIM
  • Publication number: 20160315026
    Abstract: The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.
    Type: Application
    Filed: January 28, 2015
    Publication date: October 27, 2016
    Applicant: LG CHEM, LTD.
    Inventors: Min Jin KO, Kyung Mi KIM, Jae Ho JUNG, Bum Gyu CHOI, Min Kyoun KIM
  • Patent number: 9455210
    Abstract: Provided are a curable composition and its use. The curable composition can exhibit excellent processibility and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability, and that does not cause whitening and surface stickiness even under harsh conditions.
    Type: Grant
    Filed: July 29, 2013
    Date of Patent: September 27, 2016
    Assignee: LG CHEM, LTD.
    Inventors: Min Jin Ko, Bum Gyu Choi, Jae Ho Jung, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
  • Publication number: 20160257788
    Abstract: The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.
    Type: Application
    Filed: January 28, 2015
    Publication date: September 8, 2016
    Applicant: LG CHEM, LTD.
    Inventors: Min Jin KO, Kyung Mi KIM, Jae Ho JUNG, Bum Gyu CHOI, Min Kyoun KIM
  • Patent number: 9410018
    Abstract: The present application relates to a curable composition. A curable composition may be provided; which shows excellent processability and workability; which shows excellent light extraction efficiency, crack resistance, hardness, thermal shock resistance and adhesive strength after curing; and which has excellent reliability and long-term reliability under high-temperature and/or high-moisture conditions. Also, turbidity and surface stickiness may be prevented in the cured product.
    Type: Grant
    Filed: December 27, 2013
    Date of Patent: August 9, 2016
    Assignee: LG CHEM, LTD.
    Inventors: Min Jin Ko, Myung Sun Moon, Jae Ho Jung, Bum Gyu Choi, Dae Ho Kang, Min Kyoun Kim
  • Patent number: 9379296
    Abstract: A silicone resin is provided. The silicone resin may be effectively used to encapsulate a semiconductor element, for example, a light-emitting element of a light-emitting diode.
    Type: Grant
    Filed: December 30, 2013
    Date of Patent: June 28, 2016
    Assignee: LG Chem, Ltd.
    Inventors: Min Jin Ko, Myung Sun Moon, Jae Ho Jung, Bum Gyu Choi, Dae Ho Kang, Min Kyoun Kim
  • Patent number: 9362468
    Abstract: Provided are a curable composition and its use. The curable composition having excellent processability, workability, heat resistance, and light resistance, and having no problem of discoloring despite using for a long time may be provided. The curable composition which may scatter light and disperse linearity of light when used as an encapsulant of an optical semiconductor such as an LED may be provided.
    Type: Grant
    Filed: January 27, 2015
    Date of Patent: June 7, 2016
    Assignee: LG CHEM, LTD.
    Inventors: Min Jin Ko, Jae Ho Jung, Bum Gyu Choi, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
  • Patent number: 9355926
    Abstract: Provided are a curable composition and its use. The curable composition can exhibit excellent processability and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability, and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions and that does not cause whitening or surface stickiness.
    Type: Grant
    Filed: September 18, 2013
    Date of Patent: May 31, 2016
    Assignee: LG CHEM, LTD.
    Inventors: Min Jin Ko, Bum Gyu Choi, Jae Ho Jung, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
  • Patent number: 9299896
    Abstract: A curable composition is provided. A cured product showing excellent light extraction efficiency, crack resistance, hardness, thermal shock resistance and adhesive strength after a curing, as well as showing excellent processability and workability is provided. Also, surface stickiness may be prevented in the cured product without causing turbidity etc.
    Type: Grant
    Filed: December 30, 2013
    Date of Patent: March 29, 2016
    Assignee: LG CHEM, LTD.
    Inventors: Min Jin Ko, Myung Sun Moon, Jae Ho Jung, Bum Gyu Choi, Dae Ho Kang, Min Kyoun Kim
  • Patent number: 9243166
    Abstract: Provided are a curable composition and its use. The curable composition has excellent processability, workability and adhesiveness, exhibits excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and adhesiveness after curing, has long-lasting durability and reliability even under harsh conditions, and does not cause whitening or surface stickiness. The curable composition can be used as an encapsulant or adhesive material for an optical semiconductor such as an LED.
    Type: Grant
    Filed: January 27, 2015
    Date of Patent: January 26, 2016
    Assignee: LG CHEM, LTD.
    Inventors: Min Jin Ko, Jae Ho Jung, Bum Gyu Choi, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
  • Patent number: 9243143
    Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability and workability, no whitening and surface stickiness, and an excellent adhesive property. Since the curable composition has excellent thermal resistance, gas barrier-ability, and crack resistance, even when a semiconductor device to which the composition is applied is used at a high temperature for a long time, performance of the device may be stably maintained. Specifically the curable composition is a blend of three different polyorganosiloxanes having aliphatic unsaturated groups and specific Ar/Si ratios and a polyorganosiloxane having SiH groups.
    Type: Grant
    Filed: August 13, 2014
    Date of Patent: January 26, 2016
    Assignee: LG Chem, Ltd.
    Inventors: Min Jin Ko, Kyung Mi Kim, Young Ju Park, Bum Gyu Choi, Dae Ho Kang, Byung Kyu Cho, You Na Yang
  • Patent number: 9177883
    Abstract: Provided is a curable composition and its use. The curable composition may exhibit excellent processibility and workability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property after curing. The curable composition may provide a cured product exhibiting stable durability and reliability under severe conditions in a long time and having no whitening and surface stickiness.
    Type: Grant
    Filed: December 23, 2013
    Date of Patent: November 3, 2015
    Assignee: LG Chem, Ltd.
    Inventors: Min Jin Ko, Jae Ho Jung, Myung Sun Moon, Bum Gyu Choi, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho