Abstract: The present invention provides a metal molded article, a manufacturing method therefor, and an inspection device having same. The metal molded article has an overall length dimension in a longitudinal direction, an overall thickness dimension in a thickness direction perpendicular to the longitudinal direction, and an overall width dimension in a width direction perpendicular to the longitudinal direction. The metal molded article is divided into a first body region and a second body region in the thickness direction. The lateral surfaces of the first body region are provided with multiple micro-trenches that are grooves formed to be elongated in the thickness direction and arranged side by side all over the entire lateral surfaces of the first body region. The lateral surfaces of the second body region are not provided with these micro-trenches.

Abstract: Proposed are an anodized film structure which improves the mechanical and/or electrical characteristics by protecting perforated holes with a protective layer, and an inspection device. In the anodized film structure, parylene-type protective layer is formed with a uniform thickness on an inner wall of each of the perforated holes and a surface of the body made of an anodized film material. Micro-trenches are defined by peaks and valleys repeatedly arranged and formed on the inner wall of each of the perforated holes, and the protective layer covers the entire micro-trenches. In addition, a metal layer is provided on a surface of the body and between the protective layer and the inner wall of each of the perforated holes.

Abstract: Proposed are an electro-conductive contact pin capable of effectively testing the electrical characteristics of a test object without a body thereof being elastically bent or curved in a convex shape in the horizontal direction by pressure applied to opposite ends thereof, and a vertical probe card having the same.

Abstract: The present invention relates to an inductor and a manufacturing method therefor, and, particularly, the objective of the present invention is to provide an inductor and a manufacturing method therefor, the inductor satisfying needs of small size and low resistance and, simultaneously, having a simplified manufacturing process such that mass production thereof is possible.

Abstract: Proposed are a method of manufacturing a metal product that uses an anodic aluminum oxide film and a patternable material together, in which a space where the metal product is manufactured is formed by the patternable material and the anodic aluminum oxide film provides structural support to the patternable material; and a mold using an anodic aluminum oxide film used therefor.

Abstract: Proposed is a probe card. The probe card according to the present disclosure includes: a circuit board; a probe head having a guide plate, and through which a plurality of probes pass; and a connection member electrically connecting the circuit board and the probes to each other, wherein an insulating part of the connection member and the guide plate are made of an anodic aluminum oxide film formed by anodizing a metal as a base material.

Abstract: A probe head and a probe card having the same are provided. The probe head includes a plurality of guide plates each having a guide hole, wherein each of the guide plates has a shape in which a plurality of layers are stacked, and each of the guide plates includes: a first guide layer provided at a lowermost side thereof, and having a first guide hole; and a second guide layer provided at an uppermost side thereof, and having a second guide hole, wherein a side wall of the first guide hole and a side wall of the second guide hole are not provided on the same vertical line.

Abstract: The present invention provides an electrically conductive contact pin for a Kelvin test and a test device comprising same, which can cope with the narrower pitch between electrodes of a semiconductor device.

Abstract: The present invention provides an electrically conductive contact pin and an inspection device having improved inspection reliability for an inspection object. The electrically conductive contact pin is characterized in that a first connection portion contacts a support portion to form a current path when a first elastic portion is compressed, and a second connection portion contacts the support portion to form a current path when a second elastic portion is compressed. The inspection device comprises an installation member having a through hole for receiving the electrically conductive contact pin.

Abstract: Proposed is an electro-conductive contact pin which can implement a narrow pitch between electro-conductive contact pins and prevent the electro-conductive contact pins from being short-circuited even upon contact between center portions of the electro-conductive contact pins, through a manufacturing method for an electro-conductive contact pin, the manufacturing method including a step of forming a module area including pin bodies and a support frame supporting the pin bodies through connecting portions, and a coating layer forming step of forming a coating layer on the pin bodies.

Abstract: A guide member, an inspection device, and an electro-conductive contact pin for improving inspection reliability with respect to an inspection object are proposed.

Abstract: The present invention provides an anodic oxidation film structure and a manufacturing method therefor, the anodic oxidation film structure comprising: a body made of an anodic oxidization film obtained by anodic oxidation on a parent metal and then removing the parent metal; a through-hole which is formed through the body and has a larger inner width than that of a pore formed during the anodic oxidation; and a metal layer provided on the inner wall of the through-hole, and thus improving the mechanical and/or electrical characteristics of the inner wall of the through-hole.

Abstract: Proposed are a metal product, a method of manufacturing the same, and a test device having the same. More particularly, proposed are a metal product that has a high degree of freedom of shape and reliability and improves test reliability for a test object, a method of manufacturing the same, and a test device having the same.

Abstract: Proposed is a vertical probe card capable of effectively testing the electrical characteristics of a test object without a body thereof being elastically bent or curved in a convex shape in the horizontal direction by pressure applied to opposite ends thereof.

Abstract: The present invention relates to a susceptor which seats a substrate on the upper surface thereof during a deposition process for the substrate, the susceptor comprising: a first plate; a second plate provided under the first plate; and a planar heater provided between the first and second plates, wherein the planar heater is in the form of a plane, and a heating pattern formed to have a large area corresponding to the area of the plane is provided inside the planar heater. Accordingly, the present invention provides a susceptor in which a uniform temperature is formed over the entire area thereof without the risk of disconnection.

Abstract: Proposed are a probe head for testing, through a probe, a pattern formed on a wafer, and a probe card having the same. More particularly, proposed are a probe head in which formation of a guide hole into which a probe is inserted and insertion of the probe therein are facilitated, and a probe card having the same.

Abstract: Proposed are a method of manufacturing a metal product that uses an anodic aluminum oxide film and a patternable material together, in which a space where the metal product is manufactured is formed by the patternable material and the anodic aluminum oxide film provides structural support to the patternable material; and a mold using an anodic aluminum oxide film used therefor.

Abstract: Proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure. More particularly, proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure, wherein production yield of the entire product can be improved by repairing a defective region to be made normal.

Abstract: Proposed are a probe head for testing, through a probe, a pattern formed on a wafer, and a probe card having the same. More particularly, proposed are a probe head in which formation of a guide hole into which a probe is inserted and insertion of the probe therein are facilitated, and a probe card having the same.