Patents by Inventor Byeong Cheol Moon

Byeong Cheol Moon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10847308
    Abstract: A coil component includes: an internal coil including a coil body and first and second lead portions; and first and second external electrodes electrically connected to the internal coil. At least one of the first and second lead portions may include first and second lead wires and at least one extension wire connected to at least one of the first and second lead wires and directly connected to the external electrode.
    Type: Grant
    Filed: January 2, 2018
    Date of Patent: November 24, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ji Hyung Jung, Byeong Cheol Moon
  • Publication number: 20200350115
    Abstract: A coil electronic component includes a body having one surface and the other surface, opposing each other, and a plurality of wall surfaces respectively connecting the one surface and the other surface of the body, first and second recesses, respectively formed in both end surfaces of the body opposing each other among the plurality of wall surfaces of the body, extending to the one surface of the body, a wound coil, embedded in the body, including first and second lead-out portions, a first external electrode disposed along an internal wall of the first recess and the one surface of the body and connected to the first lead-out portion, and a second external electrode disposed along an internal wall of the second recess and the one surface of the body and connected to the first lead-out portion. The first and second external electrodes are spaced apart from each other.
    Type: Application
    Filed: August 2, 2019
    Publication date: November 5, 2020
    Inventors: In Young KANG, Byeong Cheol MOON, Doo Ho PARK, Tai Yon CHO, No Il PARK, Seung Mo LIM, Tae Jun CHOI, Jeong Hoon RYOU
  • Patent number: 10818426
    Abstract: An inductor includes a body and first and second external electrodes disposed on an external surface of the body. The body includes a support member, a first coil disposed on an upper surface of the support member, and a second coil disposed on the first coil. One end of the first coil is connected to a first connection portion directly connected to a first external electrode and one end of the second coil is connected to a second connection portion directly connected to a second external electrode.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: October 27, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Mi Geum Kim, Byeong Cheol Moon
  • Publication number: 20200335256
    Abstract: A coil component includes a body having one surface and the other surface facing each other, and having one end surface and the other end surface facing each other in one direction; a supporting substrate embedded in the body; a coil portion disposed on the supporting substrate; a first lead-out portion connected to one end of the coil portion and exposed from the body; and a second lead-out portion connected to the other end of the coil portion and exposed from the body. The coil portion has a first pattern region facing the one surface and a second pattern region facing the other surface, each of the first and second pattern regions extends in the one direction, and a distance of the first pattern region in the one direction is shorter than a distance of the second pattern region in the one direction.
    Type: Application
    Filed: August 2, 2019
    Publication date: October 22, 2020
    Inventors: Ji Hyung JUNG, Byeong Cheol MOON, Jae Hun KIM, Joung Gul RYU
  • Patent number: 10811193
    Abstract: A capacitor component includes a porous body, a first electrode layer covering surfaces of pores of the porous body, a dielectric layer covering the first electrode layer, and a second electrode layer filling the pores of the porous body and covering the dielectric layer.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: October 20, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Hoon Ryou, Hyun Ho Shin, Byeong Cheol Moon, Chang Soo Jang, Tae Joon Park, Yun Hee Kim, Kyo Yeol Lee, Seung Mo Lim
  • Publication number: 20200329339
    Abstract: A server may include a communication circuit communicating with a user terminal, storage including a fingerprint DB storing fingerprints corresponding to a plurality of points and a signal fluctuation probability DB, and a processor electrically connected to the communication circuit and the storage. The processor may be configured to store similarity between first signal strength and second signal strength, which are determined based on a probability that a pair of the first signal strength and the second signal strength received from a first AP occurs with respect to fingerprints corresponding to a first point, in the signal fluctuation probability DB, to obtain a fingerprint including signal strength received from the first AP, from the user terminal, and to determine a location of the user terminal based on the obtained fingerprint and the signal fluctuation probability DB.
    Type: Application
    Filed: June 29, 2020
    Publication date: October 15, 2020
    Inventors: Sung Hwan AHN, Byeong Cheol MOON, Suk Hoon JUNG, Dong Soo HAN, Kyung Shik ROH, Suk June YOON
  • Patent number: 10804028
    Abstract: A coil electronic component includes a magnetic body in which a coil having leads exposed to side surfaces of the coil is disposed. External terminals are connected to the leads and disposed on outer surfaces of the magnetic body. Additionally, the external terminals are folded to have side surface portions which are disposed on end surfaces of the magnetic body, and bottom surface portions which are disposed on a bottom surface of the magnetic body.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: October 13, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Byeong Cheol Moon
  • Patent number: 10796840
    Abstract: A coil component includes: a body including a support member, a coil, and a magnetic material; and external electrodes disposed on an external surface of the body. The coil may include first and second coils supported by one surface and the other surface of the support member, respectively, and the first and second coils may include first and second seed patterns, respectively. A thickness of the first seed pattern may be thinner than that of the second seed pattern. Warpage properties of the first support member adjacent to the first seed pattern may be greater than those of the second support member adjacent to the second seed pattern.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: October 6, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Joung Gul Ryu, Boum Seock Kim, Kang Wook Bong, Byeong Cheol Moon
  • Publication number: 20200312559
    Abstract: A multilayered capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes; and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. Each of the external electrodes includes a conductive layer formed on the capacitor body and connected to the internal electrodes; an inner plated layer including nickel (Ni) and phosphorus (P), and covering the conductive layer; and an outer plated layer including palladium (Pd) and phosphorus (P), and covering the inner plated layer.
    Type: Application
    Filed: August 12, 2019
    Publication date: October 1, 2020
    Inventors: Mi Geum KIM, Byeong Cheol MOON, Kun Hoi KOO, Jung Min KIM
  • Patent number: 10789083
    Abstract: Disclosed herein are a method and apparatus for virtual desktop service. The apparatus includes a connection manager configured to perform an assignment task of assigning a virtual machine to a user terminal using virtual desktop service, a resource pool configured to allocate software resources to a virtual desktop, wherein the software resources include an OS, applications, and user profiles, and a virtual machine infrastructure configured to support hardware resources including a CPU and a memory, wherein the connection manager is configured to perform a coordination task of coordinating a delivery protocol used between the user terminal and servers that provide the virtual desktop service, wherein the resource pool has a management function, wherein the management function is based on usage pattern information about a user's average usage of resources, and wherein the management function uses a physical distance on network from the user terminal to a server.
    Type: Grant
    Filed: November 17, 2016
    Date of Patent: September 29, 2020
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Dae-Won Kim, Sun-Wook Kim, Jong-Bae Moon, Myeong-Hoon Oh, Byeong-Thaek Oh, Soo-Cheol Oh, Seong-Woon Kim, Ji-Hyeok Choi, Hag-Young Kim, Wan Choi
  • Publication number: 20200303113
    Abstract: A coil component may include a body having one surface and the other surface facing each other; a wound coil embedded in the body; a first lead frame and a second lead frame, embedded in the body and each having one surface exposed to the one surface of the body to be spaced apart from each other; and a connection portion connecting at least one of the first and second lead frames and at least one end portion of the wound coil.
    Type: Application
    Filed: August 5, 2019
    Publication date: September 24, 2020
    Inventors: Ju Hwan YANG, Tae Jun CHOI, Byung Soo KANG, Woo Chul SHIN, Byeong Cheol MOON
  • Publication number: 20200294709
    Abstract: A coil component includes a mold portion having a first surface and the second surface opposing each other, a winding coil disposed in the second surface of the mold portion, a cover portion disposed on the mold portion and the winding coil, and accommodating grooves on the first surface of the mold portion to be spaced apart from each other, and in which both ends of the winding coil are disposed, the accommodating grooves extend from one side of the mold portion in a width direction, and a minimum distance from the accommodating grooves to the second surface of the mold portion increases or decreased in the width direction.
    Type: Application
    Filed: July 31, 2019
    Publication date: September 17, 2020
    Inventors: Jae Hun KIM, Byeong Cheol MOON
  • Publication number: 20200294712
    Abstract: A coil electronic component includes a body, an insulating substrate disposed in the body, first and second coil portions respectively disposed on a first surface and a second surface of the insulating substrate opposing each other, first and second lead-out portions each disposed on the first surface of the insulating substrate and exposed to at least two external surfaces of the body, first and second connection conductors disposed on the first surface of the insulating substrate and connecting the first lead-out portion and the first coil portion and connecting the second lead-out portion and the second coil portion, respectively, wherein the first connection conductor and the second connection conductor respectively include a plurality of first connection conductors and a plurality of second connection conductors, and the plurality of first connection conductors are spaced apart from one another and the plurality of second connection conductors are spaced apart from one another.
    Type: Application
    Filed: August 2, 2019
    Publication date: September 17, 2020
    Inventors: Jae Hun KIM, Byeong Cheol MOON
  • Publication number: 20200286661
    Abstract: A coil electronic component includes a body having first to fourth surfaces, an insulating substrate disposed in the body, coil portions disposed on opposing surfaces of the insulating substrate, respectively, a first lead-out portion connected to one of the coil portions and exposed from the first and third surfaces, a second lead-out portion connected to another of the coil portions and exposed from the second and third surfaces, and first and second external electrodes covering the first and second lead-out portions, respectively. The insulating substrate includes a support portion supporting the coil portions, a first end portion extending from the support portion and including end surfaces respectively exposed from the first and third surfaces and spaced apart from each other, and a second end portion extending from the support portion and including end surfaces exposed from the second and third surfaces and spaced apart from each other.
    Type: Application
    Filed: July 30, 2019
    Publication date: September 10, 2020
    Inventors: Jae Hun KIM, Byeong Cheol MOON
  • Publication number: 20200286671
    Abstract: A coil component and a method for manufacturing the same are provided, and the coil component includes a body portion including a magnetic material, a support member disposed in the body portion, first and second conductor patterns disposed in both sides of the support member, opposing each other, a recess portion formed in a side surface of the support member, a via conductor disposed in the recess portion and connecting the first and second conductor patterns to each other, and a via pad disposed in an end portion of each of the first and second conductor patterns to connect the first and second conductor patterns to the via conductor, and having a line width greater than line widths of the first and second conductor patterns.
    Type: Application
    Filed: July 31, 2019
    Publication date: September 10, 2020
    Inventors: Jae Hun KIM, Byeong Cheol MOON
  • Publication number: 20200286672
    Abstract: A coil electronic component includes a body having a first surface and a second surface opposing each other and a third and a fourth surface opposing each other, an insulating substrate disposed inside the body, first and second coil portions respectively disposed on opposing surfaces of the insulating substrate, a first lead-out portion connected the first coil portion and exposed from the first and third surfaces, a second lead-out portion connected to the second coil portion and exposed from the second and third surfaces, and first and second external electrodes respectively covering the first and second lead-out portions. The insulating substrate includes a support portion supporting the first and second coil portions, a first tip exposed from the first and third surfaces and supporting the first lead-out portion, and a second tip exposed from the second and third surfaces and supporting the second lead-out portion.
    Type: Application
    Filed: August 1, 2019
    Publication date: September 10, 2020
    Inventors: Ju Hwan YANG, Byung Soo KANG, Yoon Mi CHA, Byeong Cheol MOON
  • Patent number: 10763032
    Abstract: A thin film-type inductor includes a body and a first external electrode and a second external electrode, each disposed on an external surface of the body. The body includes a support member, a first coil, a second coil, a magnetic material surrounding the support member. The first coil is disposed on an upper surface of the support member, and the second coil is disposed on a lower surface of the support member. The support member includes through-hole and a via electrode therein. A portion of one of an upper surface and a lower surface of the via electrode opposes the magnetic material.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: September 1, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Boum Seock Kim, Byeong Cheol Moon, Kang Wook Bong
  • Patent number: 10741321
    Abstract: A thin film type inductor includes first, second and third exposed portions exposed to a first end surface of a body and fourth, fifth and sixth exposed portions exposed to a second end surface of the body opposing the first end surface of the body among external surfaces of the body. The first, second and third exposed portions are formed to be exposed symmetrically to the fourth, fifth and sixth exposed portions opposing the first, second and third exposed portions, respectively.
    Type: Grant
    Filed: January 3, 2018
    Date of Patent: August 11, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Boum Seock Kim, Kang Wook Bong, Byeong Cheol Moon, Joung Gul Ryu
  • Publication number: 20200219651
    Abstract: A coil component includes a molded portion having one surface and another surface opposing each other, and a wound coil disposed on the one surface of the molded portion and including an innermost turn, at least one intermediate turn, and an outermost turn disposed outwardly of a central portion of the one surface of the molded portion. A cover portion is disposed to face the one surface of the molded portion and to cover the wound coil, and first and second external electrodes are connected to the wound coil and arranged to be spaced apart from each other on the other surface of the molded portion. A thickness of one region of the cover portion disposed on the innermost turn is thicker than a thickness of another region of the cover portion disposed on the outermost turn.
    Type: Application
    Filed: September 17, 2019
    Publication date: July 9, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Byung Soo Kang, Byeong Cheol Moon, Tae Jun Choi, Ju Hwan Yang
  • Patent number: 10707009
    Abstract: A thin film-type inductor includes a body including a support member having a through-hole filled with a magnetic material and a via hole, a coil disposed on at least one side of the support member and including a plurality of coil patterns, and a magnetic material sealing the support member and the coil. Each of the coil patterns includes a first conductor layer, a second conductor layer, and a third conductor layer. The second conductor layer is disposed on a side surface of the via hole, and is disposed to seal a lower surface of the via hole.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: July 7, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Joung Gul Ryu, Byeong Cheol Moon, Jin Hyuk Jang