Patents by Inventor Byeong Cheol Moon
Byeong Cheol Moon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11646146Abstract: A coil component includes a body comprising a support member and a coil portion embedded in one surface of the support member; and external electrodes connected to the coil portion, wherein the body comprises a plurality of metal particles, at least some of the plurality of metal particles comprises a plastically deformable first particle, and at least some of the first particles have a deformed surface and thus have a shape corresponding to a surface of a neighboring magnetic metal particle.Type: GrantFiled: May 20, 2020Date of Patent: May 9, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Il Lee, Jeong Gu Yeo, Ji Hoon Hwang, Myoung Ki Shin, Byeong Cheol Moon
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Patent number: 11640870Abstract: A coil component includes a body having one surface and the other surface opposing each other in a first direction; an internal insulating layer buried in the body; a coil portion disposed in the internal insulating layer, and forming at least one turn centering on an axis in a second direction perpendicular to the first direction; first and second external electrodes disposed on one surface of the body and spaced apart from each other, and connected to the coil portion; an external insulating layer covering the body and exposing the first and second external electrodes. Lengths of the first and second external electrodes taken in the second direction are shorter than a length of the external insulating layer taken in the second direction.Type: GrantFiled: February 21, 2019Date of Patent: May 2, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ju Hwan Yang, Byung Soo Kang, Byeong Cheol Moon
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Patent number: 11626231Abstract: A coil electronic component includes a body having first to fourth surfaces, an insulating substrate disposed in the body, coil portions disposed on opposing surfaces of the insulating substrate, respectively, a first lead-out portion connected to one of the coil portions and exposed from the first and third surfaces, a second lead-out portion connected to another of the coil portions and exposed from the second and third surfaces, and first and second external electrodes covering the first and second lead-out portions, respectively. The insulating substrate includes a support portion supporting the coil portions, a first end portion extending from the support portion and including end surfaces respectively exposed from the first and third surfaces and spaced apart from each other, and a second end portion extending from the support portion and including end surfaces exposed from the second and third surfaces and spaced apart from each other.Type: GrantFiled: July 30, 2019Date of Patent: April 11, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hun Kim, Byeong Cheol Moon
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Publication number: 20230108548Abstract: An apparatus for detecting a stacking direction of internal electrodes of a multilayer capacitor includes a capacitor moving unit having a supply unit in which a plurality of multilayer capacitors are continuously supplied ad moving the supplied multilayer capacitors in one direction, a sensor unit including a coil, installed on the capacitor moving unit, and detecting inductance of the coil when each of the multilayer capacitors approaches the coil to determine a stacking direction of internal electrodes of the multilayer capacitor based on the detected inductance of the coil, and a separating unit installed on the capacitor moving unit and separating a multilayer capacitor selected as an unsuitable multilayer capacitor by the sensor unit.Type: ApplicationFiled: May 16, 2022Publication date: April 6, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Soo Hwan SON, Se Hun PARK, Byeong Cheol MOON, Young Ghyu AHN
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Patent number: 11610725Abstract: A coil component includes a mold portion having a first surface and the second surface opposing each other, a winding coil disposed in the second surface of the mold portion, a cover portion disposed on the mold portion and the winding coil, and accommodating grooves on the first surface of the mold portion to be spaced apart from each other, and in which both ends of the winding coil are disposed, the accommodating grooves extend from one side of the mold portion in a width direction, and a minimum distance from the accommodating grooves to the second surface of the mold portion increases or decreased in the width direction.Type: GrantFiled: July 31, 2019Date of Patent: March 21, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hun Kim, Byeong Cheol Moon
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Patent number: 11600437Abstract: A coil component includes a molded portion having one surface and another surface opposing each other, and a wound coil disposed on the one surface of the molded portion and including an innermost turn, at least one intermediate turn, and an outermost turn disposed outwardly of a central portion of the one surface of the molded portion. A cover portion is disposed to face the one surface of the molded portion and to cover the wound coil, and first and second external electrodes are connected to the wound coil and arranged to be spaced apart from each other on the other surface of the molded portion. A thickness of one region of the cover portion disposed on the innermost turn is thicker than a thickness of another region of the cover portion disposed on the outermost turn.Type: GrantFiled: September 17, 2019Date of Patent: March 7, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Byung Soo Kang, Byeong Cheol Moon, Tae Jun Choi, Ju Hwan Yang
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Patent number: 11587722Abstract: A coil component includes a body having one surface and the other surface opposing each other in one direction, and a plurality of walls each connecting the one surface to the other surface; a coil portion buried in the body, and having both ends exposing to one of the plurality of walls of the body; first and second external electrodes respectively including first and second terminal electrodes disposed on one surface of the body and spaced apart from each other, and first and second connection electrodes respectively connecting the first and second terminal electrodes to both ends of the coil portion; a first external insulating layer disposed on the other surface of the body; and a first shielding layer disposed on the external insulating layer.Type: GrantFiled: February 27, 2019Date of Patent: February 21, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ju Hwan Yang, Byung Soo Kang, Byeong Cheol Moon
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Patent number: 11581125Abstract: A coil component includes a body having a molded portion and a cover portion disposed on one surface of the molded portion, and including magnetic metal powder; a winding coil disposed between one surface of the molded portion and the cover portion and embedded in the body, and including a coating layer surrounding a surface of each of a plurality of turns; and a first protective film disposed between the one surface of the molded portion and the cover portion and between at least a portion of the surface of the winding coil and the cover portion.Type: GrantFiled: November 4, 2019Date of Patent: February 14, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jeong Gu Yeo, Young Il Lee, Byeong Cheol Moon
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Patent number: 11574762Abstract: A coil component includes a body and a coil portion embedded in the body and having a plurality of turns wound about an axis. Each of the plurality of turns includes a plurality of corner portions adjacent to corners of the body, and at least one connection portion connecting adjacent corner portions among the plurality of corner portions, and a difference in heights, measured in the direction of the axis, between an innermost turn and a turn adjacent to the innermost turn, among the plurality of turns, is greater in the corner portion than in the connection portion.Type: GrantFiled: May 20, 2020Date of Patent: February 7, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yong Hui Li, Byeong Cheol Moon
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Patent number: 11574761Abstract: A coil electronic component includes a body having first to fourth surfaces, an insulating substrate disposed in the body, coil portions disposed on opposing surfaces of the insulating substrate, respectively, a first lead-out portion connected to one of the coil portions and exposed from the first and third surfaces, a second lead-out portion connected to another of the coil portions and exposed from the second and third surfaces, and first and second external electrodes covering the first and second lead-out portions, respectively. The insulating substrate includes a support portion supporting the coil portions, a first end portion extending from the support portion and including end surfaces respectively exposed from the first and third surfaces and spaced apart from each other, and a second end portion extending from the support portion and including end surfaces exposed from the second and third surfaces and spaced apart from each other.Type: GrantFiled: July 30, 2019Date of Patent: February 7, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hun Kim, Byeong Cheol Moon
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Patent number: 11574765Abstract: A coil component includes a body having one surface and the other surface facing each other, and having one end surface and the other end surface facing each other in one direction; a supporting substrate embedded in the body; a coil portion disposed on the supporting substrate; a first lead-out portion connected to one end of the coil portion and exposed from the body; and a second lead-out portion connected to the other end of the coil portion and exposed from the body. The coil portion has a first pattern region facing the one surface and a second pattern region facing the other surface, each of the first and second pattern regions extends in the one direction, and a distance of the first pattern region in the one direction is shorter than a distance of the second pattern region in the one direction.Type: GrantFiled: August 2, 2019Date of Patent: February 7, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ji Hyung Jung, Byeong Cheol Moon, Jae Hun Kim, Joung Gul Ryu
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Patent number: 11562852Abstract: A coil component includes a body having one surface and the other surface and a plurality of wall surfaces, first and second insulating substrates spaced apart from each other, first and second recesses disposed in both end surfaces of the body and extending to one surface of the body, first and second coil portions disposed on the first and second insulating substrates, one ends and the other ends of the first and second coil portions being exposed to the first and second recesses, first and second external electrodes disposed along an inner surface of the first recess and one surface of the body and connected to one ends of the first and second coil portions, and third and fourth external electrodes disposed along an inner surface of the second recess and one surface of the body and connected to the other ends of the first and second coil portions.Type: GrantFiled: September 13, 2019Date of Patent: January 24, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: No Il Park, Seung Mo Lim, Tai Yon Cho, In Young Kang, Byeong Cheol Moon, Doo Ho Park, Jeong Hoon Ryou, Tae Jun Choi
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Patent number: 11562847Abstract: A coil component includes a body; a support substrate embedded in the body; a coil portion disposed on the support substrate, and having an end portion exposed to a surface of the body; and an external electrode disposed on the surface of the body, and in contact with and connected to the end portion of the coil portion. An interface between the end portion of the coil portion and the external electrode, and an interface between the surface of the body and the external electrode are located on levels different from each other.Type: GrantFiled: January 28, 2020Date of Patent: January 24, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Byung Soo Kang, Yoon Mi Cha, Ju Hwan Yang, Yong Hui Li, Seo Eun Kim, Byeong Cheol Moon
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Patent number: 11562850Abstract: A coil component includes a body, a support substrate embedded in the body, a coil portion including first and second lead-out portions disposed on one surface of a support substrate and spaced apart from each other, slit portions formed along edge portions between both end surfaces of the body, opposing each other, and a first surface of the body, respectively, and exposing the first and second lead-out portions to internal surfaces of the slit portions, respectively, plating prevention portions embedded in the first and second lead-out portions, respectively, and having first surfaces exposed to the internal surfaces of the slit portions, respectively, and first and second external electrodes disposed on the first surface of the body, spaced apart from each other, extending to the internal surfaces of the slit portions, respectively, and connected to the first and second lead-out portions, respectively.Type: GrantFiled: May 15, 2020Date of Patent: January 24, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Byung Soo Kang, Seung Mo Lim, Seung Min Lee, Byeong Cheol Moon, Yong Hui Li, Ju Hwan Yang
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Publication number: 20230015154Abstract: A Fe-based alloy represented by a composition of (Fe(1-a)M1a)100-b-c-d-e-f-gM2bM3cBdPeCufTig, wherein M1 is at least one element selected from the group consisting of Co and Ni, M2 is at least one element selected from the group consisting of Nb, Mo, Zr, Ta, W, Hf, Ti, V, Cr, and Mn, M3 is at least one element selected from the group consisting of Si, Al, Ga, and Ge, and a, b, c, d, e, f, and g satisfy the following content conditions: 0?a?0.5, 0<b?1.5, 0<c?4, 7?d?13, 0.1?e?5, 0.6?f?1.5, and 0<g, is provided, wherein a full width at half maximum of an XRD main peak is 0.172 or more.Type: ApplicationFiled: May 4, 2022Publication date: January 19, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Kyun Kwon, Chul Min Sim, Han Wool Ryu, Byeong Cheol Moon
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Patent number: 11538616Abstract: A coil electronic component includes a body, in which a coil portion is embedded, including a plurality of magnetic particles, and an external electrode connected to the coil portion. Among the plurality of magnetic particles, at least a portion of magnetic particles include a first layer, disposed on a surface of a magnetic particle among the magnetic particles, and a second layer disposed on a surface of the first layer. The first layer is an inorganic coating layer containing a phosphorus (P) component, and the second layer is an atomic layer deposition layer.Type: GrantFiled: April 30, 2019Date of Patent: December 27, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyung Lock Kim, Byeong Cheol Moon, Chang Hak Choi, Jeong Gu Yeo, Young Il Lee
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Publication number: 20220399161Abstract: A coil component including: a body; a coil portion including first and second lead-out terminals and disposed in the body; an insulating film disposed between the coil portion and the body and containing a thermosetting resin having a vinyl group; and an external electrode portion disposed on the body and connected to each of the first and second lead-out terminals of the coil portion.Type: ApplicationFiled: April 27, 2022Publication date: December 15, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ju Hwan YANG, Yoon Mi CHA, Mi Geum KIM, Tai Yon CHO, Byeong Cheol MOON
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Publication number: 20220392697Abstract: A coil component may include a body, a coil portion including first and second lead-out portions spaced apart from each other, first and second slit portions formed at an edge portion and exposing the first and second lead-out portions, first and second external electrodes disposed to be spaced apart from each other on one surface of the body, and extending onto the first and second slit portions, respectively, to be connected to the first and second lead-out portions, a slit insulating layer covering at least portions of the first and second external electrodes in the first and second slit portions, and a surface insulating layer disposed on the slit insulating layer and extending to cover at least portions of the first or second external electrodes disposed on the one surface of the body.Type: ApplicationFiled: April 29, 2022Publication date: December 8, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yoon Mi Cha, Ju Hwan Yang, Seung Mo Lim, No Il Park, Tai Yon Cho, Byeong Cheol Moon
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Patent number: 11521790Abstract: A coil component includes a body and external electrodes. The body includes a support member having through-openings formed in end portions thereof, an internal coil supported by the support member, and an encapsulant encapsulating the support member and the internal coil. The through-openings are filled with end portions of the internal coil. An insulating layer is interposed between the internal coil and the external electrode.Type: GrantFiled: March 26, 2019Date of Patent: December 6, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jeong Gu Yeo, Byeong Cheol Moon
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Publication number: 20220384086Abstract: A coil component includes a body having one surface and another surface opposing each other, opposing end surfaces each connecting the one surface and the other surface to each other, and opposing side surfaces each connecting the end surfaces to each other. An internal insulating layer is embedded in the body, and a coil portion is disposed on at least one surface of the internal insulating layer and includes the first and second lead-out portions. The body has a recess disposed in each end surface of the body to expose the first and second lead-out portions. First and second external electrodes each include a connection portion disposed in the recess to be connected to a respective one of the first and second lead-out portions, and each include a pad portion disposed on the one surface of the body. A filling portion fills the recess and covers the connection portion.Type: ApplicationFiled: August 9, 2022Publication date: December 1, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seung Mo LIM, Byeong Cheol MOON, Dong Sik YOO, Doo Ho PARK, Tae Jun CHOI, Jeong Hoon RYOU, No Il PARK, Tai Yon CHO