Patents by Inventor Byoung Chan Kim

Byoung Chan Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11006795
    Abstract: A robot cleaner includes a body to travel on a floor; an obstacle sensing unit to sense an obstacle approaching the body; an auxiliary cleaning unit pivotably mounted to a bottom of the body, to be extendable and retractable; and a control unit to control extension or retraction of the auxiliary cleaning unit based on a pivot angle formed by the auxiliary cleaning unit with respect to a travel direction of the body when the obstacle is sensed.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: May 18, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang Sik Yoon, Byung Chan Kim, Byoung In Lee, Jun Hwa Lee, Jae Young Jung
  • Publication number: 20210093678
    Abstract: The present invention relates to an Agathobaculum sp. strain having prophylactic or therapeutic effects on autism spectrum disorders, and use thereof. When the intestinal microorganism Agathobaculum sp. strain of the present invention was orally administered to valproic acid (VPA)-induced autism model mice and BTBR autism model mice, the effects of remarkably improving autism spectrum disorders including repetitive behaviors, hyperactivity, social deficiency and cognitive/memory dysfunction of the mice were observed, as compared with a non-treated control. Accordingly, it may be usefully applied to foods, drugs, or feeds for preventing or treating autism spectrum disorders, and thus is very useful in the relevant industries.
    Type: Application
    Filed: December 12, 2018
    Publication date: April 1, 2021
    Inventors: Byoung Chan KIM, Kyoung Shim KIM, Chul Ho LEE, Dong Ho CHANG, Yong-Hoon KIM, Jung-Ran NOH, Dong Hui CHOI, Jung Hwan HWANG, Jun GO, Jaehun KIM, Hye-Yeon PARK, Yun-Jung SEO, Young-Kyoung RYU, In-Bok LEE, Young Keun CHOI, Jung-Hyeon CHOI
  • Patent number: 10923521
    Abstract: The fan-out sensor package includes: a core member having a through-hole; an integrated circuit (IC) for a sensor disposed in the through-hole and having a first surface having a sensor region and first connection pads disposed thereon, a second surface opposing the first surface and having second connection pads disposed thereon, and through-silicon vias (TSVs) penetrating between the first and second surfaces and electrically connecting the first and second connection pads to each other; an encapsulant covering the core member and the second surface of the IC for a sensor and filling at least portions of the through-hole; a redistribution layer disposed on the encapsulant; and vias penetrating through at least portions of the encapsulant and electrically connecting the redistribution layer and the second connection pads to each other.
    Type: Grant
    Filed: October 10, 2019
    Date of Patent: February 16, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byoung Chan Kim, Yong Ho Baek
  • Patent number: 10920266
    Abstract: Provided is a device for real-time measurement of bacteria. The device for real-time measurement of bacteria includes reaction portions, a support portion configured to support the reaction portions, a rotational shaft configured to transfer the support portion, and a sample supply portion configured to supply a sample to each of the reaction portions, and according to the device for real-time measurement of bacteria, bacteria may be measured in real time through the detection of ATP.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: February 16, 2021
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Byoung Chan Kim, Jae Hee Jung, Hye Ri Kim, Yusung Cho, Kang Bong Lee
  • Patent number: 10751359
    Abstract: This invention relates to a nucleic acid aptamer specifically binding to avian influenza virus subtype H5 and a method of detecting avian influenza virus subtype H5 using the same, and more particularly to a method of detecting avian influenza virus subtype H5, which is able to rapidly check the presence and concentration of avian influenza virus subtype H5 using a nucleic acid aptamer specifically binding to hemagglutinin, which is a surface protein of avian influenza virus subtype H5.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: August 25, 2020
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Byoung-Chan Kim, Sang-Kyung Kim, Seok Lee, Chang-Seon Song, Sang-Won Lee, Un-Jung Kim
  • Publication number: 20200043970
    Abstract: The fan-out sensor package includes: a core member having a through-hole; an integrated circuit (IC) for a sensor disposed in the through-hole and having a first surface having a sensor region and first connection pads disposed thereon, a second surface opposing the first surface and having second connection pads disposed thereon, and through-silicon vias (TSVs) penetrating between the first and second surfaces and electrically connecting the first and second connection pads to each other; an encapsulant covering the core member and the second surface of the IC for a sensor and filling at least portions of the through-hole; a redistribution layer disposed on the encapsulant; and vias penetrating through at least portions of the encapsulant and electrically connecting the redistribution layer and the second connection pads to each other.
    Type: Application
    Filed: October 10, 2019
    Publication date: February 6, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byoung Chan KIM, Yong Ho BAEK
  • Patent number: 10474868
    Abstract: A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface with connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first connection member and the semiconductor chip; and a second connection member disposed on the first connection member and the semiconductor chip. The first connection member and the second connection member respectively include first redistribution layers and second redistribution layers electrically connected to the connection pads and formed of one or more layers, at least one of the first redistribution layers is disposed between a plurality of insulating layers of the first connection member, and at least one of the second redistribution layers includes sensor patterns recognizing a fingerprint.
    Type: Grant
    Filed: April 12, 2018
    Date of Patent: November 12, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Ho Baek, Jung Hyun Cho, Byoung Chan Kim
  • Patent number: 10475842
    Abstract: The fan-out sensor package includes: a core member having a through-hole; an integrated circuit (IC) for a sensor disposed in the through-hole and having a first surface having a sensor region and first connection pads disposed thereon, a second surface opposing the first surface and having second connection pads disposed thereon, and through-silicon vias (TSVs) penetrating between the first and second surfaces and electrically connecting the first and second connection pads to each other; an encapsulant covering the core member and the second surface of the IC for a sensor and filling at least portions of the through-hole; a redistribution layer disposed on the encapsulant; and vias penetrating through at least portions of the encapsulant and electrically connecting the redistribution layer and the second connection pads to each other.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: November 12, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byoung Chan Kim, Yong Ho Baek
  • Publication number: 20190314425
    Abstract: The present disclosure relates to an Akkermansia muciniphila strain having a prophylactic or therapeutic effect on a degenerative brain disease and uses thereof. Since the Akkermansia muciniphila strain, the intestinal microorganism of the present disclosure, shows an effect of improving movement control and cognitive abilities as well as memory in an animal model having a degenerative brain disease such as Parkinson's disease and Alzheimer's disease, it can be useful in the prevention or treatment of brain diseases including Alzheimer's disease, Parkinson's disease, mild cognitive impairment, etc. In addition, it was confirmed in the present disclosure that compared to the Akkermansia muciniphila strain cultured in a mucin-containing medium, that cultured in a mucin-free medium showed a remarkable effect of improving hyperlipidemia, fatty liver, obesity, and hyperglycemia induced in a mouse model by high-fat diet when administered orally (in vivo).
    Type: Application
    Filed: July 11, 2017
    Publication date: October 17, 2019
    Inventors: Byoung-Chan KIM, Chul-Ho LEE, Jung-Ran NOH, Kyoung-Shim KIM, Myung-Hee KIM, Yong-Hoon KIM, Sang Jun LEE, Dong-Ho CHANG, Dong-Hee CHOI, Jung Hwan HWANG, Yun-Jung SEO, In-Bok LEE, Young-Keun CHOI, Jung-Hyeon CHOI
  • Publication number: 20190300972
    Abstract: Provided are an Agathobaculum sp. strain having prophylactic or therapeutic effects on degenerative brain diseases, and use thereof. Since the intestinal microorganism Agathobaculum butyriciproducens SR79 strain of the present invention may have effects of inhibiting neuroinflammation and effects of improving movement regulation and cognitive and memory functions in animal models with degenerative brain diseases such as Parkinson's disease and Alzheimer's disease, the strain may be effectively used in foods, medicines, or feeds for preventing or treating brain diseases including Alzheimer's disease, Parkinson's disease, mild cognitive impairment, etc., and therefore, it is very useful in the relevant industries.
    Type: Application
    Filed: June 14, 2017
    Publication date: October 3, 2019
    Applicant: KOREA RESEARCH INSTITUTE OF BIOSCIENCE AND BIOTECH NOLOGY
    Inventors: Byoung-Chan KIM, Chul-Ho LEE, Kyoung-Shim KIM, Myung-Hee KIM, Sang Jun LEE, Dong-Ho CHANG, Doo-Sang PARK, Jung Hwan HWANG, Yong-Hoon KIM, Dong-Hee CHOI, Jung-Ran NOH, In-Bok LEE, Young-Keun CHOI, Yun-Jung SEO, Jung-Hyeon CHOI, Jun GO, Hye-Yeon PARK, Young-Kyoung RYU, Moon-Soo RHEE
  • Publication number: 20190283046
    Abstract: Provided is a wet cyclone apparatus including a body, an inlet installed in the body, and having a passage through which air including airborne particles is sucked in, a wet cyclone connected to the inlet to wet and collect the airborne particles introduced from the inlet, and a water storage installed in the body to store water, wherein the wet cyclone includes an air suction port into which the air introduced from the inlet is sucked, a water inlet through which water is supplied from the water storage, and a sample outlet through which the collected wetted sample is extracted and discharged.
    Type: Application
    Filed: February 21, 2019
    Publication date: September 19, 2019
    Inventors: Jae Hee JUNG, Byoung Chan KIM, Seung Bok LEE, Kang Bong LEE, Yusung CHO
  • Patent number: 10347613
    Abstract: A fan-out semiconductor package includes first and second structures. The first structure includes a first semiconductor chip, a first encapsulant, and a connection member. The second structure includes a second semiconductor chip, a second encapsulant, and conductive bumps. The first and second structures are disposed so that active surfaces of the first and second semiconductor chips face each other. The conductive bumps are electrically connected to a redistribution layer, and connection pads of the first and second semiconductor chips are connected to each other through the redistribution layer in a signal manner. Signal transmission times between one point of the redistribution layer and connection pads of each of the first and second semiconductor chips are substantially the same as each other.
    Type: Grant
    Filed: May 2, 2018
    Date of Patent: July 9, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byoung Chan Kim, Yong Ho Baek, Moon Il Kim, Young Sik Hur, Tae Hee Han
  • Publication number: 20190203260
    Abstract: Provided is a device for real-time measurement of bacteria. The device for real-time measurement of bacteria includes reaction portions, a support portion configured to support the reaction portions, a rotational shaft configured to transfer the support portion, and a sample supply portion configured to supply a sample to each of the reaction portions, and according to the device for real-time measurement of bacteria, bacteria may be measured in real time through the detection of ATP.
    Type: Application
    Filed: December 17, 2018
    Publication date: July 4, 2019
    Inventors: Byoung Chan KIM, Jae Hee JUNG, Hye Ri KIM, Yusung CHO, Kang Bong LEE
  • Publication number: 20190198486
    Abstract: A fan-out semiconductor package includes first and second structures. The first structure includes a first semiconductor chip, a first encapsulant, and a connection member. The second structure includes a second semiconductor chip, a second encapsulant, and conductive bumps. The first and second structures are disposed so that active surfaces of the first and second semiconductor chips face each other. The conductive bumps are electrically connected to a redistribution layer, and connection pads of the first and second semiconductor chips are connected to each other through the redistribution layer in a signal manner. Signal transmission times between one point of the redistribution layer and connection pads of each of the first and second semiconductor chips are substantially the same as each other.
    Type: Application
    Filed: May 2, 2018
    Publication date: June 27, 2019
    Inventors: Byoung Chan KIM, Yong Ho BAEK, Moon Il KIM, Young Sik HUR, Tae Hee HAN
  • Publication number: 20190140011
    Abstract: The fan-out sensor package includes: a core member having a through-hole; an integrated circuit (IC) for a sensor disposed in the through-hole and having a first surface having a sensor region and first connection pads disposed thereon, a second surface opposing the first surface and having second connection pads disposed thereon, and through-silicon vias (TSVs) penetrating between the first and second surfaces and electrically connecting the first and second connection pads to each other; an encapsulant covering the core member and the second surface of the IC for a sensor and filling at least portions of the through-hole; a redistribution layer disposed on the encapsulant; and vias penetrating through at least portions of the encapsulant and electrically connecting the redistribution layer and the second connection pads to each other.
    Type: Application
    Filed: April 25, 2018
    Publication date: May 9, 2019
    Inventors: Byoung Chan KIM, Yong Ho BAEK
  • Patent number: 10256192
    Abstract: A fan-out semiconductor package includes a first connection member having a through-hole, a semiconductor chip disposed in the through-hole, at least one component-embedded substrate disposed adjacent the semiconductor chip in the through-hole and spaced apart from the semiconductor chip by a predetermined distance and having a plurality of passive components embedded therein, an encapsulant encapsulating at least portions of the first connection member, the at least one component-embedded substrate, and the semiconductor chip, and a second connection member disposed on the first connection member, the at least one component-embedded substrate, and the semiconductor chip.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: April 9, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Moon Hee Yi, Byoung Chan Kim, Yong Ho Baek, Jung Hyun Cho
  • Patent number: 10096560
    Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a processor chip disposed in the through-hole; a memory chip disposed in the through-hole and including a plurality of dies stacked on each other; an encapsulant encapsulating at least portions of the first interconnection member, the memory chip, and the processor chip; and a second interconnection member disposed on the first interconnection member, an active surface of the memory chip, and an active surface of the processor chip. The first interconnection member and the second interconnection member respectively include redistribution layers electrically connected to connection pads of the processor chip and connection pads of the memory chip, and the connection pads of the processor chip and the connection pads of the memory chip are electrically connected to each other by the redistribution layer of the second interconnection member.
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: October 9, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byoung Chan Kim, Yong Ho Baek
  • Patent number: 10096559
    Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a processor chip disposed in the through-hole; a memory chip disposed in the through-hole and including a plurality of dies stacked on each other; an encapsulant encapsulating at least portions of the first interconnection member, the memory chip, and the processor chip; and a second interconnection member disposed on the first interconnection member, an active surface of the memory chip, and an active surface of the processor chip. The first interconnection member and the second interconnection member respectively include redistribution layers electrically connected to connection pads of the processor chip and connection pads of the memory chip, and the connection pads of the processor chip and the connection pads of the memory chip are electrically connected to each other by the redistribution layer of the second interconnection member.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: October 9, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byoung Chan Kim, Yong Ho Baek
  • Patent number: 10061967
    Abstract: A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface with connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first connection member and the semiconductor chip; and a second connection member disposed on the first connection member and the semiconductor chip. The first connection member and the second connection member respectively include first redistribution layers and second redistribution layers electrically connected to the connection pads and formed of one or more layers, at least one of the first redistribution layers is disposed between a plurality of insulating layers of the first connection member, and at least one of the second redistribution layers includes sensor patterns recognizing a fingerprint.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: August 28, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Ho Baek, Jung Hyun Cho, Byoung Chan Kim
  • Publication number: 20180232556
    Abstract: A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface with connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first connection member and the semiconductor chip; and a second connection member disposed on the first connection member and the semiconductor chip. The first connection member and the second connection member respectively include first redistribution layers and second redistribution layers electrically connected to the connection pads and formed of one or more layers, at least one of the first redistribution layers is disposed between a plurality of insulating layers of the first connection member, and at least one of the second redistribution layers includes sensor patterns recognizing a fingerprint.
    Type: Application
    Filed: April 12, 2018
    Publication date: August 16, 2018
    Inventors: Yong Ho BAEK, Jung Hyun CHO, Byoung Chan KIM