Patents by Inventor Byoung Chan Kim

Byoung Chan Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8201324
    Abstract: An electronic component embedded printed circuit board and a method for manufacturing the same are disclosed. The method includes: providing a first carrier having a first circuit pattern formed on one surface thereof; providing a second carrier having a second circuit pattern formed on one surface thereof; flip-chip bonding an electronic component to the first circuit pattern; stacking one side of an insulator on one side of the first carrier to cover the electronic component; compressing the second carrier having the second circuit pattern formed on one surface thereof on an other side of the insulator; and removing the first carrier and the second carrier. The method can improve the degree of conformation for an electrical component by embedding the electrical component using a flip-chip bonding method and can improve the yield by simplifying the production process.
    Type: Grant
    Filed: January 26, 2009
    Date of Patent: June 19, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Byoung-Chan Kim, Young-Hwan Shin, Jong-Jin Lee
  • Publication number: 20120134125
    Abstract: An electronic component embedded printed circuit board and a method for manufacturing the same are disclosed. The method includes: providing a first carrier having a first circuit pattern formed on one surface thereof; providing a second carrier having a second circuit pattern formed on one surface thereof; flip-chip bonding an electronic component to the first circuit pattern; stacking one side of an insulator on one side of the first carrier to cover the electronic component; compressing the second carrier having the second circuit pattern formed on one surface thereof on an other side of the insulator; and removing the first carrier and the second carrier. The method can improve the degree of conformation for an electrical component by embedding the electrical component using a flip-chip bonding method and can improve the yield by simplifying the production process.
    Type: Application
    Filed: February 1, 2012
    Publication date: May 31, 2012
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Byoung-Chan Kim, Young-Hwan Shin, Jong-Jin Lee
  • Publication number: 20120017435
    Abstract: A method of manufacturing a PCB having electronic components embedded therein, including: preparing a copper foil layer including a thin copper foil coated with a resin layer; fixing electronic components onto the resin layer; forming a core layer in which the electronic components are embedded; forming internal layer circuits which are electrically connected to the electronic components; forming an insulating layer on the internal layer circuits; and forming external layer circuits on the insulating layer such that the external layer circuits are electrically connected to the internal layer circuits.
    Type: Application
    Filed: October 6, 2011
    Publication date: January 26, 2012
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD
    Inventors: Seung Hyun Sohn, Yul Kyo Chung, Byoung Chan Kim, Moon Il Kim, Kwan Kyu Kim, Yee Na Shin
  • Publication number: 20110286191
    Abstract: Disclosed herein is a printed circuit board. The printed circuit board includes a base substrate including a first region on which a semiconductor chip is mounted and a second region positioned outside the first region, first insulating patterns covering the base substrate and including trenches formed on the second region, and second insulating patterns protruding from the first insulating patterns on the second region. The trench and the second insulating pattern may be used as a structure defining an underfill forming material in a preset shape during the process of forming an underfill.
    Type: Application
    Filed: November 10, 2010
    Publication date: November 24, 2011
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Byoung Chan Kim, Young Hwan Shin, Chin Kwan Kim, Dong Won Kim, Kui Won Kang
  • Patent number: 7971448
    Abstract: An air conditioner includes a heat-exchanger positioned in an outdoor unit and configured to conduct heat-exchange between air provided from outside of the outdoor unit and a refrigerant. The air conditioner also includes a fan configured to generate a flow of the air that is from the heat-exchanger to an outlet of the outdoor unit. The air conditioner further includes a driving unit configured to provide a driving force to the fan. In addition, the air conditioner includes a first member positioned in the flow of the air generated by the fan and a second member configured to guide a flow of the air to reduce collision between the air and the first member when the fan is operated.
    Type: Grant
    Filed: December 30, 2009
    Date of Patent: July 5, 2011
    Assignee: LG Electronics Inc.
    Inventors: Seung Yup Kim, Byoung Chan Kim, Hyung Tae Kim, Dong Soo Lee
  • Patent number: 7763159
    Abstract: A method for preparation of nanocomposite solution, comprises preparing basic silica colloid aqueous solution; providing an electrolysis apparatus by installing a negative electrode containing aluminum and a positive electrode containing silver into the basic silica colloid aqueous solution; and forming nanocomposite by applying voltage to the respective electrodes of the electrolysis apparatus. With this configuration, the present invention provides a method of manufacturing solution dispersed with nanocomposite, further particularly to, a method of manufacturing nanocomposite solution having excellent storability and thermal stability and containing silver having antibacterial function, far infrared radiation function, deodorization function.
    Type: Grant
    Filed: December 26, 2003
    Date of Patent: July 27, 2010
    Inventors: Chul-sang Jeong, Moon-young Jeong, Byoung-chan Kim, Myung-soo Lee
  • Publication number: 20100175407
    Abstract: An air conditioner includes a heat-exchanger positioned in an outdoor unit and configured to conduct heat-exchange between air provided from outside of the outdoor unit and a refrigerant. The air conditioner also includes a fan configured to generate a flow of the air that is from the heat-exchanger to an outlet of the outdoor unit. The air conditioner further includes a driving unit configured to provide a driving force to the fan. In addition, the air conditioner includes a first member positioned in the flow of the air generated by the fan and a second member configured to guide a flow of the air to reduce collision between the air and the first member when the fan is operated.
    Type: Application
    Filed: December 30, 2009
    Publication date: July 15, 2010
    Applicant: LG ELECTRONICS INC.
    Inventors: Seung Yup Kim, Byoung Chan Kim, Hyung Tae Kim, Dong Soo Lee
  • Publication number: 20100012364
    Abstract: An electronic component embedded printed circuit board and a method for manufacturing the same are disclosed. The method includes: providing a first carrier having a first circuit pattern formed on one surface thereof; providing a second carrier having a second circuit pattern formed on one surface thereof; flip-chip bonding an electronic component to the first circuit pattern; stacking one side of an insulator on one side of the first carrier to cover the electronic component; compressing the second carrier having the second circuit pattern formed on one surface thereof on an other side of the insulator; and removing the first carrier and the second carrier. The method can improve the degree of conformation for an electrical component by embedding the electrical component using a flip-chip bonding method and can improve the yield by simplifying the production process.
    Type: Application
    Filed: January 26, 2009
    Publication date: January 21, 2010
    Inventors: Byoung-Chan KIM, Young-Hwan Shin, Jong-Jin Lee
  • Publication number: 20090277673
    Abstract: Provided is a PCB having electronic components embedded therein, the PCB including a core layer having electronic components embedded therein and a resin layer formed thereon and thereunder; internal layer circuits formed on the resin layer and being electrically connected to the electronic components; an insulating layer formed on the internal layer circuits; and external layer circuits formed on the insulating layer and being electrically connected to the internal layer circuits.
    Type: Application
    Filed: June 27, 2008
    Publication date: November 12, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Hyun Sohn, Yul Kyo Chung, Byoung Chan Kim, Moon Il Kim, Kwan Kyu Kim, Yee Na Shin
  • Patent number: 7501246
    Abstract: Disclosed are a gene coding for L-arabinose isomerase derived from Thermotoga neapolitana 5068, a thermostable arabinose isomerase expressed from the gene, a recombinant expression vector containing the gene, a microorganism transformed with the expression vector, a process for preparing thermostable arabinose isomerase from the transformant ,and a process for preparing D-tagatose employing the arabinose isomerase. Since the recombinant arabinose isomerase is highly thermostable and can produce tagatose with high yield at high temperature, it can be efficiently applied in pharmaceutical and food industries.
    Type: Grant
    Filed: December 22, 2004
    Date of Patent: March 10, 2009
    Assignee: CJ Cheiljedang Corporation
    Inventors: Yu Ryang Pyun, Byoung Chan Kim, Han Seung Lee, Dong Woo Lee, Yoon Hee Lee
  • Publication number: 20080066296
    Abstract: There are provided a method for manufacturing an electric heating mirror and the mirror thereof. An electrode pattern is printed on a metal-coated surface of the mirror in which the metal-coated surface is formed on a rear surface of a glass plate, or printed on a rear surface of the glass plate of the mirror in which the metal-coated surface is formed on a front surface of the glass plate using a conductive paste. Thereafter, a current input terminal is connected to the electrode pattern in parallel after protecting the electrode pattern by a PTC paste. Alternatively, the current input terminal is connected to the electrode pattern in series after forming a passivation layer on the electrode pattern by any of printing, coating, and deposition process. According to the method, the manufacturing process is simplified and the manufacturing cost decreases. In addition, environmental pollutants are not produced at all and the durability of the plane heater is enhanced.
    Type: Application
    Filed: November 15, 2007
    Publication date: March 20, 2008
    Inventors: Chung-kyun Shin, Byoung-chan Kim, Jae-joon Ryou
  • Publication number: 20070221646
    Abstract: There are provided a method for manufacturing an electric heating mirror and the mirror thereof. An electrode pattern is printed on a metal-coated surface of the mirror in which the metal-coated surface is formed on a rear surface of a glass plate, or printed on a rear surface of the glass plate of the mirror in which the metal-coated surface is formed on a front surface of the glass plate using a conductive paste. Thereafter, a current input terminal is connected to the electrode pattern in parallel after protecting the electrode pattern by a PTC paste. Alternatively, the current input terminal is connected to the electrode pattern in series after forming a passivation layer on the electrode pattern by any of printing, coating, and deposition process. According to the method, the manufacturing process is simplified and the manufacturing cost decreases. In addition, environmental pollutants are not produced at all and the durability of the plane heater is enhanced.
    Type: Application
    Filed: August 14, 2006
    Publication date: September 27, 2007
    Inventors: Chung-kyun Shin, Byoung-chan Kim, Jae-joon Ryou
  • Publication number: 20070217520
    Abstract: An apparatus for post-processing a video image may include a filter configured to remove artifacts from pictures decoded by a video decoder; a differential picture encoder configured to produce compressed differential pictures based on the decoded pictures and the pictures filtered by the filter; and a differential picture decoder configured to reconstruct the filtered pictures based on the decoded pictures and the compressed differential pictures. A method for post-processing a video image may include filtering pictures decoded by a video decoder to remove artifacts from the decoded pictures; producing compressed differential pictures based on the decoded pictures and the filtered pictures; and reconstructing the filtered pictures based on the decoded pictures and the compressed differential pictures. A video image system may include a video decoder; a filter; a differential picture encoder; a memory; a differential picture decoder; and a display unit.
    Type: Application
    Filed: March 14, 2007
    Publication date: September 20, 2007
    Inventors: Byoung-Chan Kim, Soon-Jae Cho
  • Publication number: 20070009672
    Abstract: A method for preparation of nanocomposite solution, comprises preparing basic silica colloid aqueous solution; providing an electrolysis apparatus by installing a negative electrode containing aluminum and a positive electrode containing silver into the basic silica colloid aqueous solution; and forming nanocomposite by applying voltage to the respective electrodes of the electrolysis apparatus. With this configuration, the present invention provides a method of manufacturing solution dispersed with nanocomposite, further particularly to, a method of manufacturing nanocomposite solution having excellent storability and thermal stability and containing silver having antibacterial function, far infrared radiation function, deodorization function.
    Type: Application
    Filed: December 26, 2003
    Publication date: January 11, 2007
    Inventors: Chul-sang Jeong, Moon-young Jeong, Byoung-chan Kim, Myung-soo Lee
  • Patent number: 6933138
    Abstract: Disclosed are a novel gene coding for L-arabinose isomease derived from Thermotoga neapolitana 5068, a thermostable arabinose isomerase expressed from the said gene, a recombinant expression vector containing the said gene, a microorganism transformed with the said expression vector, a process for preparing thermostable arabinose isomerase from the said transformant and a process for preparing D-tagatose employing the said enzyme. Since the recombinant arabinose isomerase is highly thermostable and can produce tagatose with high yield at high temperature, it can be efficiently applied in pharmaceutical and food industries.
    Type: Grant
    Filed: June 20, 2003
    Date of Patent: August 23, 2005
    Assignee: CJ Corp.
    Inventors: Yu Ryang Pyun, Byoung Chan Kim, Han Seung Lee, Dong Woo Lee, Yoon Hee Lee
  • Publication number: 20050051895
    Abstract: The present invention relates to a BGA package having center-bonding type semiconductor chips with edge-bonding metal patterns formed thereon wherein the edge-bonding metal patterns are formed on the semiconductor chips in a wafer level, and wire bonding is carried out in the shape of edge bonding so that a plurality of semiconductor chips are stacked, whereby high-density memory performance is obtained, and a method of manufacturing the same.
    Type: Application
    Filed: November 25, 2003
    Publication date: March 10, 2005
    Inventors: Byoung-Chan Kim, Young-Hwan Shin, Kyoung-Ro Yoon
  • Publication number: 20040058419
    Abstract: Disclosed are a novel gene coding for L-arabinose isomease derived from Thermotoga neapolitana 5068, a thermostable arabinose isomerase expressed from the said gene, a recombinant expression vector containing the said gene, a microorganism transformed with the said expression vector, a process for preparing thermostable arabinose isomerase from the said transformant and a process for preparing D-tagatose employing the said enzyme. Since the recombinant arabinose isomerase is highly thermostable and can produce tagatose with high yield at high temperature, it can be efficiently applied in pharmaceutical and food industries.
    Type: Application
    Filed: June 20, 2003
    Publication date: March 25, 2004
    Inventors: Yu Ryang Pyun, Byoung Chan Kim, Han Seung Lee, Dong Woo Lee, Yoon Hee Lee