Patents by Inventor Byoung Hwa Lee

Byoung Hwa Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein
    Patent number: 9226401
    Abstract: There is provided a multilayer ceramic electronic part to be embedded in a board, including: a ceramic body including dielectric layers; first and second internal electrodes having first and second leads; and first and second external electrodes, wherein when lengths from edges of the first or second external electrode formed on first and second side surfaces of the ceramic body to points at which the first or second external electrode contacts the first and second leads are G1, lengths from the edges of the first or second external electrode formed on first and second side surfaces of the ceramic body to a corresponding end surface of the ceramic body are BW1, and lengths from the corresponding end surface of the ceramic body to points at which the first or second external electrode contacts the first and second leads are M1, 30 ?m?G1<BW1?M1 is satisfied.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: December 29, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hai Joon Lee, Doo Young Kim, Byoung Hwa Lee, Eun Hyuk Chae
  • MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING OF THE SAME
    Publication number: 20150373852
    Abstract: A multilayer ceramic capacitor may include three external electrodes disposed on a mounting surface of a ceramic body and spaced apart from each other, and first and second lead-out portions extended from a first internal electrode so as to be exposed through the mounting surface of the ceramic body and spaced apart from each other in a length direction of the ceramic body have one or more space portions, respectively, and a board for mounting thereof is provided.
    Type: Application
    Filed: August 31, 2015
    Publication date: December 24, 2015
    Inventors: Young Ghyu AHN, Doo Young KIM, Min Cheol PARK, Byoung Hwa LEE, Sang Soo PARK
  • MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME
    Publication number: 20150364260
    Abstract: A multilayer ceramic capacitor may include: three external electrodes disposed on a mounting surface of a ceramic body to be spaced apart from one another. When a thickness of an active layer including a plurality of first and second internal electrodes disposed therein is defined as AT, and a gap between a first or second lead part of the first internal electrode and a third lead part of the second internal electrode is defined as LG, the following Equation may be satisfied: 0.00044?LG*log[1/AT]?0.00150.
    Type: Application
    Filed: August 21, 2015
    Publication date: December 17, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byoung Hwa LEE, Kyo Kwang LEE, Min Cheol PARK, Young Ghyu AHN, Sang Soo PARK
  • Multilayer ceramic capacitor
    Patent number: 9208949
    Abstract: A multilayer ceramic capacitor may include a ceramic body having a plurality of dielectric layers; first and second internal electrodes disposed in the ceramic body to be alternately exposed to the first and second end surfaces of the ceramic body, having the dielectric layers interposed therebetween; and first and second external electrodes electrically connected to the first and second internal electrodes, respectively. The first and second external electrodes may include: first and second internal conductive layers; first and second insulating layers; and first and second external conductive layers.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: December 8, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Ghyu Ahn, Sang Soo Park, Hwi Geun Im, Hyun Tae Kim, Soon Ju Lee, Heung Kil Park, Byoung Hwa Lee, Min Cheol Park
  • Multilayer ceramic capacitor and board for mounting the same
    Patent number: 9208950
    Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body in which a plurality of dielectric layers are laminated; a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body with the dielectric layer interposed therebetween; and first and second external electrodes covering both end surfaces of the ceramic body, wherein the ceramic body includes an active layer forming capacitance by including the plurality of first and second internal electrodes and a cover layer formed on an upper portion or a lower portion of the active layer, wherein the active layer includes a first block in which a first region I, and a second region II, and a second block in which a third region III, and a fourth region IV.
    Type: Grant
    Filed: May 21, 2013
    Date of Patent: December 8, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byoung Hwa Lee, Young Ghyu Ahn, Sang Soo Park, Seok Kyoon Woo, Tae Hyeok Kim, Heung Kil Park
  • Multilayer ceramic electronic component
    Patent number: 9196421
    Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body formed by laminating dielectric layers having an average thickness of 0.7 ?m or less; external electrodes formed on external surfaces of the ceramic body; and internal electrodes respectively disposed on the dielectric layer so as to have a gap formed therebetween, wherein, when a narrowest gap between the internal electrode edges adjacent to one another is denoted by Gmin, 10 ?m?Gmin?60 ?m is satisfied.
    Type: Grant
    Filed: October 2, 2014
    Date of Patent: November 24, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hae Sock Chung, Byoung Hwa Lee, Min Cheol Park, Eun Hyuk Chae
  • Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein
    Patent number: 9198297
    Abstract: A multilayer ceramic electronic part to be embedded in a board includes a ceramic body including dielectric layers and having main surfaces, side surfaces, and end surfaces; first and second internal electrodes including first and second leads exposed to the main surfaces; and first and second external electrodes formed on the end surfaces and extending to the main surfaces, wherein when a length from one of ends of the first or second external electrode formed on the main surfaces to a point at which the first or second external electrode contacts the first and second leads is G, a length from one of the ends of the first or second external electrode to the end surfaces is BW, and a length from the end surfaces to a point at which the first or second external electrode contacts the first and second leads is M, 30 ?m?G<BM?M is satisfied.
    Type: Grant
    Filed: November 18, 2013
    Date of Patent: November 24, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hai Joon Lee, Byoung Hwa Lee, Doo Young Kim, Bae Gen Lee, Eun Hyuk Chae
  • Multilayer ceramic electronic part and method of manufacturing the same
    Patent number: 9196423
    Abstract: There is provided a multilayer ceramic electronic part, including: a ceramic element having a plurality of dielectric layers laminated therein; a plurality of first and second internal electrodes each formed on at least one surface of each of the plurality of dielectric layers within the ceramic element, the first and second internal electrodes respectively including first and second lead parts extended therefrom to be exposed through one surface of the ceramic element; and first and second external electrodes formed on one surface of the ceramic element, and electrically connected to the first and second internal electrodes through exposed portions of the first and second lead parts, respectively, wherein a ratio of a width of the first or second lead part to a width of the first or second external electrode is 10 to 85%.
    Type: Grant
    Filed: November 6, 2012
    Date of Patent: November 24, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hae Suk Chung, Min Cheol Park, Hyung Joon Kim, Byoung Hwa Lee
  • Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein
    Patent number: 9196420
    Abstract: There is provided a multilayer ceramic electronic component, including a ceramic body having first and second side surfaces facing each other, and first and second end surfaces facing each other; first and second internal electrodes having first and second lead portions; and first and second external electrodes extended from the first and second end surfaces of the ceramic body to the first and second side surfaces, respectively, wherein when a distance from an end portion of the first or second external electrode formed on the first or second side surface of the ceramic body to a point of the first or second external electrode connected to the first or second lead portion is defined as G, and a width of the first or second external electrode on the first or second side surface of the ceramic body is defined as BW, 30 ?m?G<BW is satisfied.
    Type: Grant
    Filed: November 18, 2013
    Date of Patent: November 24, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Eun Hyuk Chae, Doo Young Kim, Byoung Hwa Lee
  • MULTILAYER CERAMIC CAPACITOR
    Publication number: 20150325370
    Abstract: A multilayer ceramic capacitor may include: a ceramic body; a plurality of first internal electrodes disposed in the ceramic body; a plurality of second internal electrodes stacked alternately with the first internal electrodes in the ceramic body; first and second external electrodes connected to the first internal electrodes, respectively; a third external electrode extended from one side surface of the ceramic body to a portion of a surface opposing a mounting surface of the ceramic body and connected to the second internal electrodes; a fourth external electrode extended from the other side surface of the ceramic body to a portion of the surface opposing the mounting surface of the ceramic body; and an intermitting part disposed on the surface opposing the mounting surface of the ceramic body and connecting the third and fourth external electrodes to each other.
    Type: Application
    Filed: December 2, 2014
    Publication date: November 12, 2015
    Inventors: Byoung Hwa LEE, Young Key KIM, Min Cheol PARK, Young Ghyu AHN
  • MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING THEREOF
    Publication number: 20150325372
    Abstract: A multilayer ceramic capacitor may include three external electrodes disposed on a mounting surface of a ceramic body so as to be spaced apart from each other. When a height of at least one portion of the external electrode formed on one side surface of the ceramic body in a width direction is defined as d, and a thickness of the ceramic body is defined as T, a ratio of d/T satisfies 0.10?d/T.
    Type: Application
    Filed: July 16, 2015
    Publication date: November 12, 2015
    Inventors: Kyo Kwang LEE, Jin KIM, Young Ghyu AHN, Byoung Hwa LEE
  • MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME
    Publication number: 20150318114
    Abstract: A multilayer ceramic capacitor and a board having the same are provided. The multilayer ceramic capacitor includes three external electrodes including a conductive layer, a nickel plating layer, and a tin plating layer sequentially stacked on a mounting surface of the ceramic body, and spaced apart from each other. When an outermost portion of a lead-out portion of an internal electrode exposed to the mounting surface is P, a total thickness of the conductive layer, the nickel plating layer, and the tin plating layer in a normal line direction of the conductive layer from P is a, a thickness of the conductive layer in the normal line direction of the conductive layer from P is b, and a sum of pore heights of pores existing in the conductive layer in the normal line direction of the conductive layer from P is bp, (b?bp)/a satisfies 0.264?(b?bp)/a?0.638.
    Type: Application
    Filed: June 29, 2015
    Publication date: November 5, 2015
    Inventors: Young Ghyu AHN, Hyun Tae KIM, Kyo Kwang LEE, Jin KIM, Byoung Hwa LEE, Hwi Geun IM
  • Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein
    Patent number: 9173294
    Abstract: A multilayer ceramic electronic component to be embedded in a board includes: a ceramic body including dielectric layers; first and second internal electrodes formed in the ceramic body; and first-polarity external electrodes connected to the first internal electrodes, and second-polarity external electrodes connected to the second internal electrodes, wherein the number of the first-polarity external electrodes and the number of the second-polarity external electrodes may be two or more, the first-polarity and second-polarity external electrodes may include first-polarity and second-polarity base electrodes and first-polarity and second-polarity terminal electrodes formed on the first-polarity and second-polarity base electrodes, respectively, when L denotes a length of the ceramic body and W denotes a width thereof, W/L?0.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: October 27, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byoung Hwa Lee, Hai Joon Lee, Eun Hyuk Chae, Bae Gen Lee, Jin Man Jung
  • MULTILAYER CERAMIC CAPACITOR AND CIRCUIT BOARD HAVING THE SAME
    Publication number: 20150302992
    Abstract: There are provided a multilayer ceramic capacitor and a circuit board having the same. The multilayer ceramic capacitor may include: first and second internal electrodes connected to first and second external electrodes, respectively, and disposed to face each other; and third and fourth internal electrodes connected to the first and second external electrodes, respectively, and disposed to face each other, a connection area of the third and fourth internal electrodes with the first and second external electrodes being different from that of the first and second internal electrodes with the first and second external electrodes, and the first and second external electrodes including first and second conductive layers disposed in inner portions thereof and first and second conductive resin layers disposed in outer portions thereof, respectively.
    Type: Application
    Filed: July 18, 2014
    Publication date: October 22, 2015
    Inventors: Byoung Hwa LEE, Jin Man JUNG, Jin Woo LEE, Eun Sang NA, Young Don CHOI
  • MULTILAYERED CERAMIC CAPACITOR, MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING THEREON MULTILAYERED CERAMIC CAPACITOR, PACKING UNIT FOR MULTILAYERED CERAMIC CAPACITOR
    Publication number: 20150279569
    Abstract: There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed below the active layer, the lower cover layer being thicker than the upper cover layer; first and second external electrodes; at least one pair of first and second internal electrodes repeatedly formed inside the lower cover layer, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063?(B+C)/A?1.745.
    Type: Application
    Filed: June 4, 2015
    Publication date: October 1, 2015
    Inventors: Young Ghyu AHN, Sang Soo PARK, Min Cheol PARK, Byoung Hwa LEE
  • Mounting structure of circuit board having multi-layered ceramic capacitor thereon
    Patent number: 9148955
    Abstract: Disclosed herein is a mounting structure of a circuit board having a multi-layered ceramic capacitor thereon. The mounting structure of a circuit board having a multi-layered ceramic capacitor thereon, in which a dielectric layer on which inner electrodes are disposed is stacked and external electrode terminals connecting the inner electrodes in parallel are disposed on both ends thereof, wherein the inner electrodes of the multi-layered ceramic capacitor and the circuit board are disposed so as to be a horizontal direction to connect the external electrode terminals with a land on the circuit board by a conductive material and a ratio of a bonding area ASOLEDER of the conductive material to the area AMLCC of the external electrode terminals AMLCC is set to be less than 1.4, thereby remarkably reducing the vibration noise.
    Type: Grant
    Filed: May 25, 2012
    Date of Patent: September 29, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Ghyu Ahn, Byoung Hwa Lee, Min Cheol Park, Sang Soo Park, Dong Seok Park
  • MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME
    Publication number: 20150243438
    Abstract: A multilayer ceramic capacitor and a board having the same are provided. The multilayer ceramic capacitor includes three external electrodes including a conductive layer, a nickel plating layer, and a tin plating layer sequentially stacked on a mounting surface of the ceramic body, and spaced apart from each other. When an outermost portion of a lead-out portion of an internal electrode exposed to the mounting surface is P, a total thickness of the conductive layer, the nickel plating layer, and the tin plating layer in a normal line direction of the conductive layer from P is a, a thickness of the conductive layer in the normal line direction of the conductive layer from P is b, and a sum of pore heights of pores existing in the conductive layer in the normal line direction of the conductive layer from P is bp, (b?bp)/a satisfies 0.264?(b?bp)/a?0.638.
    Type: Application
    Filed: January 21, 2015
    Publication date: August 27, 2015
    Inventors: Young Ghyu AHN, Hyun Tae KIM, Kyo Kwang LEE, Jin KIM, Byoung Hwa LEE, Hwi Geun IM
  • Multilayer ceramic capacitor and method of manufacturing the same
    Patent number: 9105411
    Abstract: A multilayer ceramic capacitor includes a ceramic body; an active layer including a plurality of first and second internal electrodes alternately exposed to both end surfaces of the ceramic body with a dielectric layer interposed therebetween; upper and lower cover layers formed on upper and lower surfaces of the active layer; and first and second external electrodes formed on the end surfaces of the ceramic body, wherein when a thickness of the ceramic body is defined as T, a thickness of the active layer is defined as S, a thickness of the lower cover layer is defined as C, and a distance from an end of a lowermost internal electrode in a length direction to an end of a band portion of an external electrode close to the end of the lowermost internal electrode is defined A, 0.25?S/T?0.75 and 3?A/C?10 are satisfied.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: August 11, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Eun Hyuk Chae, Byoung Hwa Lee
  • MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD, MANUFACTURING METHOD THEREOF, AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC COMPONENT
    Publication number: 20150223340
    Abstract: In a multilayer ceramic electronic component to be embedded in a board, a thickness of a ceramic body in an overall chip may be increased by not allowing an increase in a thickness of an external electrode to occur, while forming a band surface of the external electrode having a predetermined length or greater for connecting the external electrode to an external wiring through a via hole, thereby improving chip strength and preventing the occurrence of damage such as breakage, or the like, a manufacturing method thereof, and a printed circuit board having the multilayer ceramic electronic component.
    Type: Application
    Filed: April 30, 2014
    Publication date: August 6, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Man JUNG, Doo Young KIM, Byoung Hwa LEE, Young Don CHOI, Eun Hyuk CHAE
  • Multilayered ceramic capacitor, mounting structure of circuit board having multilayered ceramic capacitor thereon, and packing unit for multilayered ceramic capacitor
    Patent number: 9099249
    Abstract: There is provided a multilayered ceramic capacitor, including: a ceramic body having a plurality of dielectric layers laminated therein; an active layer including a plurality of internal electrodes having the respective dielectric layers interposed therebetween; an upper cover layer; a lower cover layer; external electrodes; and a plurality of dummy electrodes, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as the thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as the thickness of the upper cover layer, a ratio of deviation between a center portion of the active layer and a center portion of the ceramic body, (B+C)/A, satisfies 1.063?(B+C)/A?1.745.
    Type: Grant
    Filed: February 11, 2013
    Date of Patent: August 4, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Ghyu Ahn, Tae Hyeok Kim, Min Cheol Park, Byoung Hwa Lee, Sang Soo Park