Abstract: A three-dimensional (3D) storage device using wafer-to-wafer bonding is disclosed. In the storage device, a first chip including a peripheral circuit region including a first control logic circuit configured to control operation modes of a nonvolatile memory (NVM) device is wafer-bonded with a second chip including 3D arrays of NVM cells, and a memory controller includes a third chip including a control circuit region. The control circuit region of the third chip includes a second control logic circuit associated with operation conditions of the NVM device, and the second control logic circuit includes a serializer/deserializer (SERDES) interface configured to share random access memory (RAM) in the memory controller and transmit and receive data to and from the NVM device.

Abstract: A storage device includes a non-volatile memory device. The non-volatile memory device includes a first substrate including a first peripheral circuit region including a row decoder selecting one word line from among a plurality of word lines of a three-dimensional (3D) memory cell array and a second substrate including a second peripheral circuit region, including a page buffer unit selecting at least one bit line from among a plurality of bit lines of the 3D memory cell array, and a cell region including the 3D memory cell array formed in the second peripheral circuit region. The 3D memory cell array is disposed between the first peripheral circuit region and the second peripheral circuit region by vertically stacking and bonding the second substrate on and to the first substrate.

Abstract: A method of operating a memory system that comprises a memory device including a plurality of memory blocks and a memory controller, includes detecting a first memory block having a degradation count greater than or equal to a first reference value by the memory controller. A first command for the first memory block is transmitted to the memory device by the memory controller. A first voltage is applied to all of a plurality of word lines connected to the first memory block and a second voltage to a bit line connected to the first memory block in response to the first command by the memory device. The first voltage is greater than a voltage applied to turn on memory cells connected to all of the plurality of word lines. The second voltage is greater than a voltage applied to the bit line during program, read or erase operations.

Abstract: A method of operating a memory system includes programming, in a memory device, K logical pages stored in a page buffer circuit into a memory cell array, reading, from the memory device, the K logical pages programmed into the memory cell array into the page buffer circuit after a first delay time elapses, transmitting, in a memory controller, N?K logical pages to the memory device, and programming, in the memory device, N logical pages into the memory cell array based on the read K logical pages and the N?K logical pages, wherein K is a positive integer and N is a positive integer greater than K.

Abstract: A non-volatile memory device includes a substrate, a stack structure that includes a first gate layer that extends in a horizontal direction and a second gate layer that extends in the horizontal direction and is disposed apart from the first gate layer in a vertical direction, a plurality of first channel structures that penetrate in the vertical direction through a first channel region of the stack structure, a plurality of second channel structures that penetrate in the vertical direction through a second channel region of the stack structure, a first anti-fuse structure and a second anti-fuse structure that each penetrate in the vertical direction through an anti-fuse region of the stack structure, a first anti-fuse transistor that is electrically connected to the first gate layer through the first anti-fuse structure, and a second anti-fuse transistor that is electrically connected to the second gate layer through the second anti-fuse structure.

Abstract: A storage device includes a nonvolatile memory device including a memory cell array and a storage controller to control the nonvolatile memory device. The memory cell array includes word-lines, memory cells and word-line cut regions dividing the word-lines into memory blocks. The storage controller includes an error correction code (ECC) engine including an ECC encoder and a memory interface. The ECC encoder performs a first ECC encoding operation on each of sub data units in user data to generate parity bits and generate a plurality of ECC sectors, selects outer cell bits to be stored in outer cells to constitute an outer ECC sector including the outer cell bits and performs a second ECC encoding operation on the outer ECC sector to generate outer parity bits. The memory interface transmits, to the nonvolatile memory device, a codeword set including the ECC sectors and the outer parity bits.

Abstract: A storage device, including a nonvolatile memory device and a storage controller configured to control the nonvolatile memory device. The nonvolatile memory device includes a memory cell array including a plurality of word-lines stacked on a substrate, a plurality of memory cells provided in a plurality of channel holes, and a word-line cut region dividing the plurality of word-lines into a plurality of memory blocks. The storage controller groups a plurality of target memory cells into outer cells and inner cells. The storage controller includes an error correction code (ECC) decoder configured to perform an ECC decoding operation by obtaining outer cell bits and inner cell bits during a read operation on the plurality of target memory cells, and applying different log likelihood ratio (LLR) values to the outer cell bits and the inner cell bits.

Abstract: A three-dimensional (3D) storage device using wafer-to-wafer bonding is disclosed. In the storage device, a first chip including a peripheral circuit region including a first control logic circuit configured to control operation modes of a nonvolatile memory (NVM) device is wafer-bonded with a second chip including 3D arrays of NVM cells, and a memory controller includes a third chip including a control circuit region. The control circuit region of the third chip includes a second control logic circuit associated with operation conditions of the NVM device, and the second control logic circuit includes a serializer/deserializer (SERDES) interface configured to share random access memory (RAM) in the memory controller and transmit and receive data to and from the NVM device.

Abstract: A storage device includes a NAND flash memory device, an auxiliary memory device and a storage controller to control the NAND flash memory device and the auxiliary memory device. The storage controller includes a processor, an error correction code (ECC) engine and a memory interface. The processor executes a flash translation layer (FTL) loaded onto an on-chip memory. The ECC engine generates first parity bits for user data to be stored in a target page of the NAND flash memory device based on error attribute of a target memory region associated with the target page, and selectively generates additional parity bits for the user data under control of the processor. The memory interface transmits the user data and the first parity bits to the NAND flash memory device, and selectively transmits the additional parity bits to the auxiliary memory device.

Abstract: In a method of operating one or more nonvolatile memory devices including one or more memory blocks, each memory block includes a plurality of memory cells and a plurality of pages arranged in a vertical direction. Pages arranged in a first direction of a channel hole are set as first to N-th pages. A size of the channel hole increases in the first direction and decreases in the second direction. Pages arranged in a second direction of the channel hole are set as (N+1)-th to 2N-th pages. First to N-th page pairs are set such that a K-th page among the first to the N-th pages and an (N+K)-th page among the (N+1)-th to 2N-th pages form one page pair. Parity regions of two pages included in at least one page pair are shared by the two pages included in the at least one page pair.

Abstract: Provided is a three-dimensional storage device using wafer-to-wafer bonding. A storage device includes a first chip including a first substrate and a peripheral circuit region including a first control logic circuit configured to control operation modes of the non-volatile memory device and a second chip including a second substrate and three-dimensional arrays of non-volatile memory cells. The second chip may be vertically stacked on the first chip so that a first surface of the first substrate faces a first surface of the second substrate, and a second control logic circuit is configured to control operation conditions of the non-volatile memory device and is arranged on a second surface of the second substrate, the second surface of the second substrate being opposite to the first surface of the second substrate of the second chip.

Abstract: A nonvolatile memory (NVM) device includes a plurality of memory blocks and a control logic receiving a specific command and an address. The control logic may perform a cell count-based dynamic read (CDR) operation on memory cells connected to one of wordlines of a selected block, among the plurality of memory blocks, in response to the address. The control logic includes a cell count comparator circuit configured to compare: (1) a first cell count value for a highest state among a plurality of states with at least one reference value according to the CDR operation and (2) a second cell count value for an erase state among the plurality of states with the at least one reference value. Additionally, the control logic includes a read level selector configured to select a read level according to a result of the comparison of the cell count comparator circuit.

Abstract: Provided is a semiconductor device. The semiconductor device includes: a plurality of insulating layers and a plurality of gate electrodes alternately arranged in a first direction; and a plurality of channel structures passing through the plurality of gate electrodes and the plurality of insulating layers in the first direction, wherein each of the plurality of gate electrodes includes: a first conductive layer including an inner wall surrounding the plurality of channel structures; and a second conductive layer that is separated from the plurality of channel structures in a second direction perpendicular to the first direction, wherein resistivity of the second conductive layer is less than resistivity of the first conductive layer.

Abstract: An apparatus includes a transistor coupled between an input pin and an output pin and an overvoltage detection circuit configured to receive a serial interface signal from the input pin and generate an enable signal in response to a voltage of the serial interface signal exceeding a voltage threshold. The apparatus also includes a first circuit configured to apply a clamping voltage to a gate of the transistor based on the enable signal to regulate a voltage provided at the output pin.

Abstract: Frequency lock loop (FLL) circuits, low voltage dropout regulator circuits, and related methods are disclosed. An example gate driver integrated circuit includes a first die including a FLL circuit to generate a first clock signal having a first phase and a first frequency, a second clock signal having the first frequency and a second phase different from the first phase, and control a plurality of switching networks to increase the first frequency to a second frequency, and generate a feedback voltage based on the second frequency, and a second die coupled to the first die, the second die including a low dropout (LDO) circuit and a driver, the driver configured to control a transistor based on the first frequency, the second die configured to be coupled to the transistor, the LDO circuit to generate a pass-gate voltage based on an output current of the LDO circuit satisfying a current threshold.

Abstract: Frequency lock loop (FLL) circuits, low voltage dropout regulator circuits, and related methods are disclosed. An example gate driver integrated circuit includes a first die including a FLL circuit to generate a first clock signal having a first phase and a first frequency, a second clock signal having the first frequency and a second phase different from the first phase, and control a plurality of switching networks to increase the first frequency to a second frequency, and generate a feedback voltage based on the second frequency, and a second die coupled to the first die, the second die including a low dropout (LDO) circuit and a driver, the driver configured to control a transistor based on the first frequency, the second die configured to be coupled to the transistor, the LDO circuit to generate a pass-gate voltage based on an output current of the LDO circuit satisfying a current threshold.

Abstract: An apparatus includes a transistor coupled between an input pin and an output pin and an overvoltage detection circuit configured to receive a serial interface signal from the input pin and generate an enable signal in response to a voltage of the serial interface signal exceeding a voltage threshold. The apparatus also includes a first circuit configured to apply a clamping voltage to a gate of the transistor based on the enable signal to regulate a voltage provided at the output pin.

Abstract: USB controllers, systems and methods are presented to conserve power in a USB controller, in which a transmitter transmits data to a line of a connected USB cable according to a transmit data signal, and a pull down circuit selectively sinks current from a supply node of the transmitter when the transmit data signal is in a first state, refrains from sinking the first current from the supply node when the transmit data signal is in a different second state.

Abstract: A Charge Pump Buck Converter (CPBC) includes a BC including an inductor and a CP coupled in parallel. Control logic is coupled to a switch driver coupled to a power switch(es). Control circuitry includes a voltage sensor sensing Vout and a voltage level generator for generating a first voltage level coupled to the CP stage and a second voltage level coupled to a duty cycle/rate generator block providing an input to an under voltage (UV) monitor coupled between OUT and the control logic. The control circuitry disables the CP when Vout>a first Vout level and controls the BC to regulate to a second Vout level>the first Vout level. During handoff between CP and BC during power up if Vout drops below a UV threshold, the UV monitor block modifies an input applied to the control logic for increasing charging supplied to the inductor.

Abstract: A switch-mode DC-DC voltage converter including a boost stage in the form of a charge pump and a buck stage. Control circuitry is provided that enables the operation of the buck stage while the charge pump stage is also enabled, followed by disabling of the charge pump stage as the input voltage and output voltage increase. The buck converter stage is constructed so that it regulates the output voltage at a voltage above that which disables the charge pump stage. Conduction losses in the main current path, due to the necessity of a power FET or other switching device, are avoided.