Patents by Inventor Byung Il Min

Byung Il Min has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220312124
    Abstract: A speaker unit is provided. The speaker unit may include a frame; a yoke elongated on the frame along a front-to-rear direction; a first magnet disposed on one side of the yoke; a first plate disposed on one side of the first magnet; a first diaphragm disposed on one side of the first plate; a first coil fixed to the first diaphragm; a second magnet disposed on the other side of the yoke; a second plate disposed on the other side of the second magnet; a second diaphragm disposed on the other side of the second plate; a substrate disposed on the frame; a microphone electrically connected to the substrate; and a second coil fixed to the second diaphragm, wherein the first magnet and the second magnet are both in contact with the yoke, the frame includes a seating portion, and the microphone is disposed in the seating portion.
    Type: Application
    Filed: July 27, 2021
    Publication date: September 29, 2022
    Inventors: Ju Heon KO, Byung Il MIN, Jeong Kwon PARK, Yun Uk HA, JongWon LEE, Seo Young KIM, Soon Hyuk HONG
  • Publication number: 20220310718
    Abstract: Embodiments disclosed herein relate to a flexible display suitable for an under-display sensor. The flexible display may include: a display layer including a thin film transistor driven by an applied electrical signal and a light emitting layer that generates light by means of the thin film transistor; a cover window including an optically clear flexible material to protect the display layer and laminated on the display layer; and a flexible lower layer arranged below the display layer to support and protect the display layer and having optical isotropy.
    Type: Application
    Filed: March 25, 2022
    Publication date: September 29, 2022
    Applicant: ArcSoft Corporation Limited
    Inventor: Byung Il Min
  • Publication number: 20220312097
    Abstract: A speaker unit for an earphone is provided. The speaker unit for an earphone may include a frame; a magnet; a plate fixed to the frame and in contact with the magnet; a diaphragm; a coil disposed to overlap the magnet and the plate in a radial direction; and a flexible printed circuit board (FPCB), wherein the magnet includes a first surface and a second surface arranged on an outer surface of the magnet, the first surface is a surface in contact with an inner surface of the frame, the second surface is a surface spaced apart from the inner surface of the frame, and the frame forms a first sound emission path defined by a space between the inner surface thereof and the second surface of the magnet in the radial direction.
    Type: Application
    Filed: May 20, 2021
    Publication date: September 29, 2022
    Inventors: Ju Heon KO, Byung Il MIN, Jeong Kwon PARK, Yun Uk HA, JongWon LEE, Seo Young KIM, Soon Hyuk HONG
  • Patent number: 11423864
    Abstract: Under-display sensor disclosed. The under-display sensor includes a light selection layer, having a first optical path and a second optical path through which a display circularly-polarized light generated by an ambient light and an unpolarized light generated by a pixel pass, and an optical sensor, having a first receiver configured for measuring light that has passed the first optical path and a second receiver configured for measuring light that has passed the second optical path, wherein the first optical path passes all of the display circularly-polarized light and the unpolarized light, wherein the second optical path blocks the display circularly-polarized light and passes the unpolarized light.
    Type: Grant
    Filed: January 20, 2021
    Date of Patent: August 23, 2022
    Assignee: HANGZHOU SINGLE MICRO ELECTRONIC CO., LTD.
    Inventor: Byung Il Min
  • Patent number: 11412330
    Abstract: A speaker unit for an earphone is provided. The speaker unit for an earphone includes a frame including a first hole in a front thereof and a second hole in a rear thereof; a yoke disposed on the frame and elongated along a front-to-rear direction; a first magnet disposed on one side of the yoke; a first plate disposed on one side of the first magnet; a first diaphragm disposed on one side of the first plate; a second magnet disposed on the other side of the yoke; a second plate disposed on the other side of the second magnet; and a second diaphragm disposed on the other side of the second plate, wherein the first magnet and the second magnet are together in contact with the yoke, and the yoke includes a first passage that connects the first hole and the second hole.
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: August 9, 2022
    Assignee: Almus Corp.
    Inventors: Ju Heon Ko, Jong Won Lee, Byung Il Min, Yun Uk Ha, Jeong Kwon Park
  • Patent number: 11381897
    Abstract: Disclosed is an eartip for an earphone. The eartip includes a fixing portion formed to have a cylindrical shape with a bottom fixedly coupled to a nozzle of an earphone, a variable portion formed to have a cylindrical shape with a bottom coupled to a top of the fixing portion and to have a length and bending which are variable, and a contact portion formed of a flexible material and including an inner section having a cylindrical shape with a bottom coupled to a top of the variable portion and an outer section extending to be rounded downward from a top end of the inner section to surround at least parts of the inner section, the variable portion, and the fixing portion and to come into contact with an external auditory meatus of a user's ear.
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: July 5, 2022
    Assignee: ALMUS Corp.
    Inventors: Ju Heon Ko, Jong Won Lee, Byung Il Min, Yun Uk Ha, Jeong Kwon Park, Won Kil Yang
  • Patent number: 11378253
    Abstract: A fingerprint sensor is disclosed. An embodiment according to an aspect of the present invention provides a display having a fingerprint recognition function. The display having a fingerprint recognition function may comprise: a display panel, which is disposed under a cover glass and allows rays to pass therethrough, the rays having various incident angles indicating ridges and troughs of a fingerprint that is in contact with the cover glass; and an image sensor layer, which is disposed under the display panel and detects a ray to be detected in the rays having the various incident angles to generate a fingerprint image.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: July 5, 2022
    Assignee: ARCSOFT CORPORATION LIMITED
    Inventors: Kwang Sue Park, Dong Wook Nam, Byung Il Min
  • Publication number: 20220210570
    Abstract: Disclosed is a speaker unit for an earphone. The speaker unit includes a frame, a magnet, a plate fixed to the frame and coming into contact with the magnet, a diaphragm, a coil disposed to be radially overlapped with the magnet and the plate, and a flexible printed circuit board (FPCB). Here, the FPCB includes a first area fixed to the diaphragm, a second area connected to the frame, and a plurality of third areas configured to connect the first area to the second area. The third area includes a contact point connected to the coil. The third areas each include at least one bent area, and a space is disposed between the third areas adjacent to each other.
    Type: Application
    Filed: February 18, 2021
    Publication date: June 30, 2022
    Inventors: Ju Heon KO, Jong Won LEE, Byung Il MIN, Yun Uk HA, Jeong Kwon PARK
  • Publication number: 20220199576
    Abstract: The present invention relates to a tiled image sensor. The tiled image sensor includes: a substrate on which conductive wiring is formed; and a plurality of image sensor dies arranged on the substrate to be spaced apart from each other by a first distance and electrically connected to the conductive wiring. The image sensor die includes: a plurality of light receiving sub-regions formed to be spaced apart from each other by a second distance; a peripheral circuit that is formed between the plurality of light receiving sub-regions, converts pixel current generated for each pixel included in the plurality of light receiving sub-regions into image data, and outputs the image data in block units; and a contact pad, the contact pad formed on a surface of the image sensor die to electrically connect the image sensor die to the substrate.
    Type: Application
    Filed: March 19, 2020
    Publication date: June 23, 2022
    Applicant: ArcSoft Corporation Limited
    Inventor: Byung Il Min
  • Publication number: 20220150641
    Abstract: A speaker unit for an earphone is provided. The speaker unit for an earphone includes a frame including a first hole in a front thereof and a second hole in a rear thereof; a yoke disposed on the frame and elongated along a front-to-rear direction; a first magnet disposed on one side of the yoke; a first plate disposed on one side of the first magnet; a first diaphragm disposed on one side of the first plate; a second magnet disposed on the other side of the yoke; a second plate disposed on the other side of the second magnet; and a second diaphragm disposed on the other side of the second plate, wherein the first magnet and the second magnet are together in contact with the yoke, and the yoke includes a first passage that connects the first hole and the second hole.
    Type: Application
    Filed: February 10, 2021
    Publication date: May 12, 2022
    Inventors: Ju Heon KO, Jong Won LEE, Byung Il MIN, Yun Uk HA, Jeong Kwon PARK
  • Publication number: 20220138449
    Abstract: Under-display fingerprint sensor of generating a fingerprint image disclosed. Under-display fingerprint sensor includes a light selection layer, being disposed under a display panel, configured for converting a downward circularly-polarized light into a downward linearly-polarized light, and configured for converting an unpolarized light into a sensor linearly-polarized light, a plurality of lenses, being disposed apart from the light selection layer and configured for refracting the downward linearly-polarized light and the sensor linearly-polarized light that propagate in a perpendicular direction toward each focal point, and an image sensor having a plurality of light receiving units disposed at each focal point of the plurality of lenses to receive the downward linearly-polarized light and the sensor linearly-polarized light that are refracted toward each focal point.
    Type: Application
    Filed: October 28, 2021
    Publication date: May 5, 2022
    Inventor: Byung Il Min
  • Patent number: 11290825
    Abstract: A speaker unit for an earphone may include a frame; a magnet; a first plate fixed to the frame and in contact with one side of the magnet; a second plate fixed to the frame and in contact with the other side of the magnet; a first coil and a second coil that are disposed to overlap the magnet and the plate in a radial direction; a first diaphragm disposed in front of the magnet and having the first coil fixed thereto; a second diaphragm disposed behind the magnet; and a flexible printed circuit board (FPCB), wherein the FPCB includes a first region including a first contact point connected to the first coil and a second region including a second contact point connected to the second coil and in a front-to-rear direction, the first region is disposed to overlap the first diaphragm in a front-to-rear direction.
    Type: Grant
    Filed: February 1, 2021
    Date of Patent: March 29, 2022
    Assignee: ALMUS Corp.
    Inventors: Ju Heon Ko, Jong Won Lee, Byung Il Min, Yun Uk Ha, Jeong Kwon Park
  • Publication number: 20220090960
    Abstract: The present disclosure relates to an optical sensor assembly. According to one aspect of the present disclosure, an embodiment of the optical sensor assembly is provided. The optical sensor assembly includes a plurality of optical fibers, wherein one ends of the plurality of optical fibers are configured in a row, and the other ends of the plurality of optical fibers are stacked in at least two rows, such that a width of a first surface formed by the one ends of the plurality of optical fibers is greater than a width of a second surface formed by the other ends of the plurality of optical fibers, and the optical sensor assembly further includes a sensor connector optically coupled with the second surface. And the sensor connector can be separated from the first surface and configured inside the electronic device.
    Type: Application
    Filed: January 23, 2020
    Publication date: March 24, 2022
    Inventor: Byung, Il MIN
  • Publication number: 20220070572
    Abstract: Disclosed is an eartip for an earphone. The eartip includes a fixing portion formed to have a cylindrical shape with a bottom fixedly coupled to a nozzle of an earphone, a variable portion formed to have a cylindrical shape with a bottom coupled to a top of the fixing portion and to have a length and bending which are variable, and a contact portion formed of a flexible material and including an inner section having a cylindrical shape with a bottom coupled to a top of the variable portion and an outer section extending to be rounded downward from a top end of the inner section to surround at least parts of the inner section, the variable portion, and the fixing portion and to come into contact with an external auditory meatus of a user's ear.
    Type: Application
    Filed: February 10, 2021
    Publication date: March 3, 2022
    Inventors: Ju Heon KO, Jong Won LEE, Byung Il MIN, Yun Uk HA, Jeong Kwon PARK, Won Kil YANG
  • Patent number: 11234066
    Abstract: Disclosed is an earphone including a housing, a speaker unit accommodated in the housing, and a printed circuit board (PCB) accommodated in the housing, disposed below the speaker unit, and configured to provide an electrical signal to the speaker unit. Here, the speaker unit includes a first diaphragm, a first voice coil fixed to the first diaphragm, at least one magnet disposed below the first diaphragm, a frame which accommodates the first diaphragm, the first voice coil, and the magnet, and a substrate which receives and transmits an electrical signal from the PCB to the first voice coil. The substrate is disposed on an upper side of the speaker unit. The earphone further includes a connection pin.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: January 25, 2022
    Assignee: ALMUS CORP.
    Inventors: Ju Heon Ko, Byung Il Min, Yun Uk Ha, Jeong Kwon Park, Yeong Jae Lee
  • Publication number: 20220007097
    Abstract: Disclosed is a microphone-mounted earphone including a housing, a speaker unit accommodated in the housing, and a microphone. Here, the housing includes a sound emission path formed in front of the speaker unit to emit a sound generated by the speaker unit toward the outside. The housing includes a microphone installation groove recessed from an outer surface of a front of the speaker unit toward the sound emission path. The microphone is installed in the microphone installation groove. Also, the microphone-mounted earphone further includes a cover configured to cover the microphone installation groove not to allow the microphone to be exposed outward.
    Type: Application
    Filed: August 10, 2020
    Publication date: January 6, 2022
    Inventors: Ju Heon KO, Jong Won LEE, Byung Il MIN, Yun Uk HA, Jeong Kwon PARK, Yeong Jae LEE
  • Patent number: 11218789
    Abstract: Disclosed is a microphone-mounted earphone including a housing, a speaker unit accommodated in the housing, and a microphone. Here, the housing includes a sound emission path formed in front of the speaker unit to emit a sound generated by the speaker unit toward the outside. The housing includes a microphone installation groove recessed from an outer surface of a front of the speaker unit toward the sound emission path. The microphone is installed in the microphone installation groove. Also, the microphone-mounted earphone further includes a cover configured to cover the microphone installation groove not to allow the microphone to be exposed outward.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: January 4, 2022
    Assignee: ALMUS Corp.
    Inventors: Ju Heon Ko, Jong Won Lee, Byung Il Min, Yun Uk Ha, Jeong Kwon Park, Yeong Jae Lee
  • Patent number: 11218793
    Abstract: An earphone includes a housing, a speaker unit disposed in the housing, a cover coupled with the housing and including a nozzle, a first space portion disposed in front of the speaker unit, and a second space portion disposed in the rear of the speaker unit and partitioned off from the first space portion. Here, the speaker unit includes a cylindrical yoke with an open top, a magnet fixed to a bottom surface of an inside of the yoke, a plate fixed to a top surface of the magnet, a voice coil disposed between an inner circumference of the yoke and outer circumferences of the magnet and the plate, a vibration plate disposed above the plate and to which the voice coil is fixed, a cap coupled with the yoke, and a frame coupled with the yoke and the cap.
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: January 4, 2022
    Assignee: ALMUS CORP.
    Inventors: Ju Heon Ko, Byung Il Min, Jeong Kwon Park, Yeong Jae Lee
  • Patent number: 11202139
    Abstract: A speaker unit includes a magnet, an upper plate fixed to a top surface of the magnet, a voice coil disposed to surround outer circumferences of the magnet and the upper plate, a vibration plate to which the voice coil is fixed, a fixing ring on which an edge of the vibration plate is mounted, and a frame having an open top and configured to accommodate the magnet, the upper plate, and the voice coil. Here, a pipe conduit is formed in the frame along a circumferential direction. A first hole configured to come into contact and communicates with a 1_1 space disposed in front of the speaker unit and to allow a 1_2 space disposed on a side of the speaker unit to communicate with the pipe conduit is formed in at least one first position of a side surface of the frame in a circumferential direction.
    Type: Grant
    Filed: June 3, 2020
    Date of Patent: December 14, 2021
    Assignee: ALMUS CORP.
    Inventors: Ju Heon Ko, Byung Il Min, Yun Uk Ha, Jeong Kwon Park, Yeong Jae Lee
  • Publication number: 20210326568
    Abstract: Semiconductor package having self-aligned structure disclosed. Semiconductor package includes a semiconductor chip having an active area and at least one marginal area that is located around the active area, wherein at least one alignment bar is arranged on the marginal area and a top structure being arranged on the semiconductor chip and having a groove being formed on a bottom surface, wherein the groove is configured for accommodating the alignment bar.
    Type: Application
    Filed: June 28, 2021
    Publication date: October 21, 2021
    Inventors: Kwang Sue PARK, Dong Wook NAM, Byung Il MIN, Bong Seok KIM