Abstract: A speaker unit for an earphone may include a frame; a magnet; a first plate fixed to the frame and in contact with one side of the magnet; a second plate fixed to the frame and in contact with the other side of the magnet; a first coil and a second coil that are disposed to overlap the magnet and the plate in a radial direction; a first diaphragm disposed in front of the magnet and having the first coil fixed thereto; a second diaphragm disposed behind the magnet; and a flexible printed circuit board (FPCB), wherein the FPCB includes a first region including a first contact point connected to the first coil and a second region including a second contact point connected to the second coil and in a front-to-rear direction, the first region is disposed to overlap the first diaphragm in a front-to-rear direction.

Abstract: The present disclosure relates to an optical sensor assembly. According to one aspect of the present disclosure, an embodiment of the optical sensor assembly is provided. The optical sensor assembly includes a plurality of optical fibers, wherein one ends of the plurality of optical fibers are configured in a row, and the other ends of the plurality of optical fibers are stacked in at least two rows, such that a width of a first surface formed by the one ends of the plurality of optical fibers is greater than a width of a second surface formed by the other ends of the plurality of optical fibers, and the optical sensor assembly further includes a sensor connector optically coupled with the second surface. And the sensor connector can be separated from the first surface and configured inside the electronic device.

Abstract: Disclosed is an eartip for an earphone. The eartip includes a fixing portion formed to have a cylindrical shape with a bottom fixedly coupled to a nozzle of an earphone, a variable portion formed to have a cylindrical shape with a bottom coupled to a top of the fixing portion and to have a length and bending which are variable, and a contact portion formed of a flexible material and including an inner section having a cylindrical shape with a bottom coupled to a top of the variable portion and an outer section extending to be rounded downward from a top end of the inner section to surround at least parts of the inner section, the variable portion, and the fixing portion and to come into contact with an external auditory meatus of a user's ear.

Abstract: Disclosed is an earphone including a housing, a speaker unit accommodated in the housing, and a printed circuit board (PCB) accommodated in the housing, disposed below the speaker unit, and configured to provide an electrical signal to the speaker unit. Here, the speaker unit includes a first diaphragm, a first voice coil fixed to the first diaphragm, at least one magnet disposed below the first diaphragm, a frame which accommodates the first diaphragm, the first voice coil, and the magnet, and a substrate which receives and transmits an electrical signal from the PCB to the first voice coil. The substrate is disposed on an upper side of the speaker unit. The earphone further includes a connection pin.

Abstract: Disclosed is a microphone-mounted earphone including a housing, a speaker unit accommodated in the housing, and a microphone. Here, the housing includes a sound emission path formed in front of the speaker unit to emit a sound generated by the speaker unit toward the outside. The housing includes a microphone installation groove recessed from an outer surface of a front of the speaker unit toward the sound emission path. The microphone is installed in the microphone installation groove. Also, the microphone-mounted earphone further includes a cover configured to cover the microphone installation groove not to allow the microphone to be exposed outward.

Abstract: An earphone includes a housing, a speaker unit disposed in the housing, a cover coupled with the housing and including a nozzle, a first space portion disposed in front of the speaker unit, and a second space portion disposed in the rear of the speaker unit and partitioned off from the first space portion. Here, the speaker unit includes a cylindrical yoke with an open top, a magnet fixed to a bottom surface of an inside of the yoke, a plate fixed to a top surface of the magnet, a voice coil disposed between an inner circumference of the yoke and outer circumferences of the magnet and the plate, a vibration plate disposed above the plate and to which the voice coil is fixed, a cap coupled with the yoke, and a frame coupled with the yoke and the cap.

Abstract: Disclosed is a microphone-mounted earphone including a housing, a speaker unit accommodated in the housing, and a microphone. Here, the housing includes a sound emission path formed in front of the speaker unit to emit a sound generated by the speaker unit toward the outside. The housing includes a microphone installation groove recessed from an outer surface of a front of the speaker unit toward the sound emission path. The microphone is installed in the microphone installation groove. Also, the microphone-mounted earphone further includes a cover configured to cover the microphone installation groove not to allow the microphone to be exposed outward.

Abstract: A speaker unit includes a magnet, an upper plate fixed to a top surface of the magnet, a voice coil disposed to surround outer circumferences of the magnet and the upper plate, a vibration plate to which the voice coil is fixed, a fixing ring on which an edge of the vibration plate is mounted, and a frame having an open top and configured to accommodate the magnet, the upper plate, and the voice coil. Here, a pipe conduit is formed in the frame along a circumferential direction. A first hole configured to come into contact and communicates with a 1_1 space disposed in front of the speaker unit and to allow a 1_2 space disposed on a side of the speaker unit to communicate with the pipe conduit is formed in at least one first position of a side surface of the frame in a circumferential direction.

Abstract: Semiconductor package having self-aligned structure disclosed. Semiconductor package includes a semiconductor chip having an active area and at least one marginal area that is located around the active area, wherein at least one alignment bar is arranged on the marginal area and a top structure being arranged on the semiconductor chip and having a groove being formed on a bottom surface, wherein the groove is configured for accommodating the alignment bar.

Abstract: Disclosed is an earphone including a housing, a speaker unit accommodated in the housing, and a printed circuit board (PCB) accommodated in the housing, disposed below the speaker unit, and configured to provide an electrical signal to the speaker unit. Here, the speaker unit includes a first diaphragm, a first voice coil fixed to the first diaphragm, at least one magnet disposed below the first diaphragm, a frame which accommodates the first diaphragm, the first voice coil, and the magnet, and a substrate which receives and transmits an electrical signal from the PCB to the first voice coil. The substrate is disposed on an upper side of the speaker unit. The earphone further includes a connection pin.

Abstract: Under-display sensor provided. The under-display sensor includes an optical sensor, having an emitter configured for emitting a sensing light and a receiver configured for detecting an externally-reflected light reflected from an object and returned by the sensing light, a sensor polarization layer, being disposed over the optical sensor and having a polarization axis inclined at a first angle, and a sensor retardation layer, being disposed over the sensor polarization layer and having a slow axis inclined at the first angle with respect to the polarization axis.

Abstract: A speaker unit includes a magnet, an upper plate fixed to a top surface of the magnet, a voice coil disposed to surround outer circumferences of the magnet and the upper plate, a vibration plate to which the voice coil is fixed, a fixing ring on which an edge of the vibration plate is mounted, and a frame having an open top and configured to accommodate the magnet, the upper plate, and the voice coil. Here, a pipe conduit is formed in the frame along a circumferential direction. A first hole configured to come into contact and communicates with a 1_1 space disposed in front of the speaker unit and to allow a 1_2 space disposed on a side of the speaker unit to communicate with the pipe conduit is formed in at least one first position of a side surface of the frame in a circumferential direction.

Abstract: An earphone includes a housing, a speaker unit disposed in the housing, a cover coupled with the housing and including a nozzle, a first space portion disposed in front of the speaker unit, and a second space portion disposed in the rear of the speaker unit and partitioned off from the first space portion. Here, the speaker unit includes a cylindrical yoke with an open top, a magnet fixed to a bottom surface of an inside of the yoke, a plate fixed to a top surface of the magnet, a voice coil disposed between an inner circumference of the yoke and outer circumferences of the magnet and the plate, a vibration plate disposed above the plate and to which the voice coil is fixed, a cap coupled with the yoke, and a frame coupled with the yoke and the cap.

Abstract: Disclosed is a speaker unit for an earphone. The speaker unit includes a magnet, a voice coil, a vibration plate, a fixing ring on which an edge of the vibration plate is mounted, and a frame configured to accommodate the magnet, the upper plate, and the voice coil. Here, a pipe conduit is formed in the frame along a circumferential direction. A first hole configured to allow the pipe conduit and a first space disposed in front of the speaker unit to communicate with each other is formed in at least one first position at a top of the frame in a circumferential direction. A second hole configured to allow the pipe conduit and a second space disposed in the rear of the speaker unit to communicate with each other is formed in at lest one second position at a bottom of the frame in a circumferential direction.

Abstract: Under-display sensor disclosed. The under-display sensor includes a light selection layer, having a first optical path and a second optical path through which a display circularly-polarized light generated by an ambient light and an unpolarized light generated by a pixel pass, and an optical sensor, having a first receiver configured for measuring light that has passed the first optical path and a second receiver configured for measuring light that has passed the second optical path, wherein the first optical path passes all of the display circularly-polarized light and the unpolarized light, wherein the second optical path blocks the display circularly-polarized light and passes the unpolarized light.

Abstract: Disclosed is an earphone including an internal duct. The earphone includes a housing, a cover coupled to the housing and including a nozzle, and a speaker unit disposed in the cover. Here, the housing and the cover include, in common, a first space portion disposed in front of the speaker unit and a second space portion disposed in the rear of the speaker unit and partitioned from the first space portion. The speaker unit includes a yoke, a magnet fixed to the yoke, a plate disposed on a top surface of the magnet, a voice coil, a diaphragm disposed above the plate and to which the voice coil is fixed, a frame disposed outside the magnet, a first grill coupled to the frame and disposed above the diaphragm, and a second grill coupled to the frame and disposed on a front surface of the diaphragm and outside the frame.

Abstract: Disclosed is a speaker unit for an earphone. The speaker unit includes a magnet, a voice coil, a vibration plate, a fixing ring on which an edge of the vibration plate is mounted, and a frame configured to accommodate the magnet, the upper plate, and the voice coil. Here, a pipe conduit is formed in the frame along a circumferential direction. A first hole configured to allow the pipe conduit and a first space disposed in front of the speaker unit to communicate with each other is formed in at least one first position at a top of the frame in a circumferential direction. A second hole configured to allow the pipe conduit and a second space disposed in the rear of the speaker unit to communicate with each other is formed in at lest one second position at a bottom of the frame in a circumferential direction.

Abstract: A semiconductor package including a prism sheet having dam structure disclosed. The semiconductor package includes a case having a wall configured for surrounding a space in which a semiconductor chip is installed, and a prism sheet having a prism surface consisting of a plurality of prism peaks and a plurality of prism valleys and a flat surface facing the prism surface, wherein the prism surface faces the semiconductor chip and the flat surface is coupled to a cover, wherein a dam extending in a direction different from an extending direction of the prism peak is formed on the prism surface.

Abstract: A semiconductor package including a prism sheet having dam structure disclosed. The semiconductor package includes a case having a wall configured for surrounding a space in which a semiconductor chip is installed, and a prism sheet having a prism surface consisting of a plurality of prism peaks and a plurality of prism valleys and a flat surface facing the prism surface, wherein the prism surface faces the semiconductor chip and the flat surface is coupled to a cover, wherein a dam extending in a direction different from an extending direction of the prism peak is formed on the prism surface.

Abstract: An earphone includes a housing, the speaker unit disposed in the housing, a cover coupled with the housing and including a nozzle, a first space portion disposed in front of the speaker unit, and a second space portion disposed in the rear of the speaker unit and partitioned off from the first space portion. Here, the speaker unit includes a cylindrical yoke with an open top, a magnet fixed to a bottom surface of an inside of the yoke, a plate fixed to a top surface of the magnet, a voice coil disposed between an inner circumference of the yoke and outer circumferences of the magnet and the plate, a vibration plate disposed above the plate and to which the voice coil is fixed, a cap coupled with the yoke, and a frame coupled with the yoke and the cap.