Abstract: An apparatus for processing the substrate includes a substrate stage and a source. The substrate stage is configured to support a substrate thereon. The substrate stage includes a substrate support formed with a first opening therein. The first opening is an annular opening. The source is coupled to the first opening and is configured to supply first gas/air to a bottom surface of the substrate through the first opening.

Abstract: A reticle stage for holding a reticle assembly is provided. The reticle assembly has a reticle and a pellicle covering the reticle. The reticle stage includes a reticle stage base, a reticle holder disposed on the reticle stage base and for holding the reticle assembly over the reticle stage base, and an electrostatic generator coupled to the reticle assembly. The electrostatic generator is configured to generate static electricity to the reticle assembly. The static electricity alternates between positive electricity and negative electricity.

Abstract: A stocker for holding a plurality of reticle pods is provided. Each of the reticle pods is configured to accommodate a reticle assembly. The reticle assembly includes a reticle and a pellicle covering the reticle. The stocker includes a main frame and an electrostatic generator. The main frame has an inner space and at least one pod support disposed in the inner space. The pod support divides the inner space into a plurality of chambers configured to respectively accommodate the plurality of reticle pods. The electrostatic generator is coupled to the reticle assembly and configured to generate static electricity to the reticle assembly. The static electricity alternates between positive electricity and negative electricity.

Abstract: An exposure apparatus for transferring a pattern of a reticle onto a wafer is provided. The exposure apparatus includes an illumination module, a reticle stage, a projection module, a wafer stage, and a control unit. The control unit is configured to calculate an alignment setting of the reticle. The wafer includes a first layer and a second layer disposed on the first layer. The first layer includes a first alignment parameter. The second layer includes a second alignment parameter. The control unit obtains a first weighting factor predetermined according to a property of the first layer, and a second weighting factor predetermined according to a property of the second layer. The alignment setting of the reticle is calculated according to the first alignment parameter, the first weighting factor, the second alignment parameter, and the second weighting factor.

Abstract: The present disclosure provides an air control cabinet (ACC) module for a clean room system. The clean room system has a clean fab and a clean sub-fab. The clean fab of the clean room system is configured to be disposed with at least one wafer processing apparatus. The ACC module includes an ACC inlet tube, a main cabinet, and an ACC pipeline. The ACC inlet tube is configured to supply air from the clean fab of the clean room system to the ACC module. The main cabinet is connected to the ACC inlet tube and configured to generate clean air from the air supplied from the ACC inlet tube. The ACC pipeline is connected to the main cabinet and configured to supply the clean air generated by the main cabinet to the wafer processing apparatus in the clean fab of the clean room system.

Abstract: A substrate processing apparatus includes a vessel providing a processing space for processing a substrate, a substrate support supporting the substrate loaded in the processing space, and a barrier between a side wall of the vessel and the substrate support and surrounding an edge of the substrate supported by the substrate support.

Abstract: Techniques, devices, and systems are disclosed and include LEDs with a first flat region, at a first height from an LED base and including a plurality of epitaxial layers including a first n-layer, a first active layer, and a first p-layer. A second flat region is provided, at a second height from the LED base and parallel to the first flat region, and includes at least a second n-layer. A sloped sidewall connecting the first flat region and the second flat region is provided and includes at least a third n-layer, the first n-layer being thicker than at least a portion of third n-layer. A p-contact is formed on the first p-layer and an n-contact formed on the second n-layer.

Abstract: The present invention provides a random number generation system comprising: an image sensor module for outputting dark noise generated from each unit pixel region respectively that is shielded from external light as digital data; and a control unit for classifying the respective pieces of digital data output from the image sensor module, for allocating random numbers to the same using a database in which a plurality of reference values are stored for each unit pixel, and for collating the same so as to generate a first random number.

Abstract: Provided are an optical lens assembly and an electronic device including the optical lens assembly. The optical lens assembly includes a front group closest to an object side and including a first lens having a positive refractive power and an image side surface that is concave, and a second lens having a negative refractive power, a third lens having a negative refractive power, and a fourth lens having a positive refractive power. Other embodiments may be provided.

Abstract: Techniques, devices, and systems are disclosed and include LEDs with a first flat region, at a first height, including a plurality of epitaxial layers such as a first n-layer, a first p-layer, and a first active layer. A second flat region at a second height and parallel to the first flat region includes at least a second n-layer. Sloped sidewalls connect the first flat region and the second flat region and include at least a third n-layer. The p-layer of the first flat region is thicker that at least a portion of the third region. A p-contact is formed on the first p-layer and an n-contact is formed on the second n-layer.

Abstract: Techniques, devices, and systems are disclosed and include LEDs with a first flat region, at a first height from an LED base and including a plurality of epitaxial layers including a first n-layer, a first active layer, and a first p-layer. A second flat region is provided, at a second height from the LED base and parallel to the first flat region, and includes at least a second n-layer. A sloped sidewall connecting the first flat region and the second flat region is provided and includes at least a third n-layer, the first n-layer being thicker than at least a portion of third n-layer. A p-contact is formed on the first p-layer and an n-contact formed on the second n-layer.

Abstract: Techniques, devices, and systems are disclosed and include LEDs with a first flat region, at a first height from an LED base and including a plurality of epitaxial layers including a first n-layer, a first active layer, and a first p-layer. A second flat region is provided, at a second height from the LED base and parallel to the first flat region, and includes at least a second n-layer. A sloped sidewall connecting the first flat region and the second flat region is provided and includes at least a third n-layer, the first n-layer being thicker than at least a portion of third n-layer. A p-contact is formed on the first p-layer and an n-contact formed on the second n-layer.

Abstract: The present invention relates to a photoelectric smoke detector having a double-bulkhead darkroom structure and, more particularly, to a photoelectric smoke detector having a double-bulkhead darkroom structure, comprising: a base having, on one side thereof, a light emitting element receiving part in which a light emitting element for irradiating light to the inside thereof is mounted and, on the other side thereof, a light receiving element part in which a light element for receiving scattered light generated by smoke particles from the light irradiated by the light emitting element is mounted; an outer bulkhead which protrudes toward a lower side of the base to form an outer wall of the smoke detector and in which a smoke inlet having a specific height is formed in a circumferential direction; a lower end surface coupled to a lower end of the outer bulkhead; and an inner bulkhead which protrudes from the lower end surface to an upper side, is disposed to be spaced apart from the outer bulkhead at a specific

Abstract: A method for generating and processing extended instructions and an apparatus using the method are provided. The method includes: transmitting, by a first device, a request packet according to an extended instruction that is generated based on a Gen-Z interface standard to a second device; and receiving, by the first device, a response packet including a result of performing the request packet from the second device. The extended instruction is generated based on a vendor-defined instruction set of the Gen-Z interface.

Abstract: Provided are an optical lens assembly and an electronic device including the optical lens assembly. The optical lens assembly includes a front group closest to an object side and including a first lens having a positive refractive power and an image side surface that is concave, and a second lens having a negative refractive power, a third lens having a negative refractive power, and a fourth lens having a positive refractive power. Other embodiments may be provided.

Abstract: Disclosed are a supercritical process chamber and an apparatus having the same. The process chamber includes a body frame having a protrusion protruding in an upward vertical direction from a first surface of the body frame and a recess defined by the protrusion and the first surface of the body frame; a cover frame; a buffer chamber arranged between the body frame and the cover frame; and a connector. The buffer chamber includes an inner vessel detachably coupled to the body frame providing a chamber space in the recess and an inner cover detachably coupled to the cover frame. The inner cover is in contact with a first surface of the inner vessel enclosing the chamber space from surroundings. The connector couples the body frame and the cover frame having the buffer chamber arranged therebetween such that the enclosed chamber space is transformed into a process space in which the supercritical process is performed.

Abstract: Disclosed is a walking assist method including acquiring arm motion data; creating walking data based on the arm motion data; and assisting a walking based on the created walking data.

Abstract: A uLED and method for regrowth with thinner deposition on sidewall are disclosed. The uLED and method include a growth substrate including flat first and second regions, where the growth substrate is thicker in the first region as compared to the second region, and a third region of sloped sidewalls connecting the first and second regions, the topography forming a regular geometric pattern, a plurality of semiconductor epitaxial layers covering the first, second, and third regions including at least a p-n junction layer including a light emitting active region of direct bandgap semiconductor, sandwiched between n-type and p-type layers, each of the plurality of semiconductor epitaxial layers being thicker on the first and second regions as compared to the corresponding semiconductor epitaxial layers on the third region, and a plurality of electrical contacts forming an anode and cathode on part of the first and second regions, respectively.

Abstract: An apparatus and method for processing an image are disclosed. The method includes preprocessing an image, recognizing an object in the preprocessed image, determining whether to use a recognition result of the object based on a quality of the recognition result, selecting, in response to a determination that the recognition result is not to be used, one of a first process for postprocessing the preprocessed image and a second process for predicting the object based on a set operation mode, and operating according to the selected process.

Abstract: A supercritical drying apparatus and a method of drying a substrate, the apparatus including a drying chamber configured to receive a supercritical fluid and to dry a substrate; a chuck in the drying chamber, the chuck being configured to receive the substrate; and a particle remover in the drying chamber, the particle remover being configured to remove dry particles from the substrate by heating the substrate with radiant heat.