Abstract: A planarization system, comprising a superstrate chuck including a holding surface configured to hold a superstrate, an inflatable membrane having an inner diameter defining an inner edge, an outer diameter defining an outer edge, and, a midpoint between the inner edge and the outer edge in a radial direction, wherein the inflatable membrane is disposed radially outward of the holding surface of the superstrate chuck, and a purge gas channel disposed radially inward of the midpoint of the inflatable membrane and radially outward of the holding surface of the superstrate chuck.

Abstract: The present invention is directed to methods for patterning a substrate by imprint lithography. Imprint lithography is a process in which a liquid is dispensed onto a substrate. A template is brought into contact with the liquid and the liquid is cured. The cured liquid includes an imprint of any patterns formed in the template. In one embodiment, the imprint process is designed to imprint only a portion of the substrate. The remainder of the substrate is imprinted by moving the template to a different portion of the template and repeating the imprint lithography process.

Abstract: Described are flexure-based high precision positioning stages. The stages are constrained to motion along each axis by a system of symmetrical flexure linkages. The linkages may be formed of link coupled by flexure joints. Magnetic linear servomotors may provide motive force for the stages. In some embodiments, the stages may have no frictional contact joints.

Abstract: Methods of forming continuous layers on regions of a substrate are described. Generally, an imprint lithography template may contact liquid positioned on the substrate. The liquid may be cured forming a masking layer, and the imprint lithography template separated from the masking layer. Prior to separation, pressurized gas and/or vacuum may be applied between the template and the substrate. Additionally, during separation, pressurized gas and/or vacuum may be applied between the template and the substrate.

Abstract: An imprint lithography template may be used to form an imprinted layer in a light curable liquid disposed on a substrate. During use, the template may be disposed within a template holder. The template holder may include a body with an opening configured to receive the template, a support plate, and an actuator system coupled to the body. The actuator system may be configured to alter a physical dimension of the template during use.

Abstract: The present invention is directed to a method of forming a layer on a region of a substrate, the method including, inter alia, positioning a liquid on the substrate; and contacting the liquid with the mold, defining a gap between the mold and the substrate, with the gap enabling positioning of the liquid by capillary forces to generate the layer over the region.

Abstract: Disclosed herein is an automatic fluid dispensing method and system for dispensing fluid on the surface of a plate-like material, or substrate, including a semiconductor wafer for imprint lithography processes. The dispensing method uses fluid dispenser and a substrate stage that may generate relative lateral motions between a fluid dispenser tip a substrate. Also described herein are methods and devices for creating a planar surface on a substrate using a substantially unpatterned planar template.

Abstract: The present invention includes a conforming template for patterning liquids disposed on substrates. The template includes a body having opposed first and second surfaces. The first surface includes a plurality of recessed regions with a patterning region being disposed between adjacent recessed regions. Specifically, the recessed regions define flexure regions about which each patterning region may move independent of the remaining patterning regions of the template. In one embodiment the template is mounted to a fluid chamber having an inlet and a throughway. The template is connected to the throughway and the inlet is connected to a fluid source to facilitate deformation of the template to conform to a profile of a surface adjacent thereto.

Abstract: The present invention is directed to methods for patterning a substrate by imprint lithography. Imprint lithography is a process in which a liquid is dispensed onto a substrate. A template is brought into contact with the liquid and the liquid is cured. The cured liquid includes an imprint of any patterns formed in the template. In one embodiment, the imprint process is designed to imprint only a portion of the substrate. The remainder of the substrate is imprinted by moving the template to a different portion of the template and repeating the imprint lithography process.

Abstract: The present invention includes a method of moving a liquid between a substrate extending in a first plane and a template extending in a second plane. More specifically, the method may include forming an oblique angle between the first plane and the second plane, reducing a distance between the substrate and the template such that the template is in contact with a portion of the liquid at a desired location, and creating a dispersion of the liquid away from the desired location.

Abstract: The present invention provides a system for determining characteristics of substrates, such as the presence of contaminants, shape, as well as the spatial relationships between spaced-apart substrates. The spatial relationships include distance and angular orientation between first and second spaced apart substrates.

Abstract: The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate. The chucking system includes a chuck body having first and second opposed sides. A side surface extends therebetween. The first side includes first and second spaced-apart recesses defining first and second spaced-apart support regions. The first support region cinctures the second support region and the first and second recesses. The second support region cinctures the second recess, with a portion of the body in superimposition with the second recess being transparent to radiation having a predetermined wavelength. The second side and the side surface define exterior surfaces. The body includes throughways placing the first and second recesses in fluid communication with one of the exterior surfaces.

Abstract: The present invention provides a technique for determining characteristics of substrates, such as the presence of contaminants, shape, as well as the spatial relationships between spaced-apart substrates. The spatial relationships include distance and angular orientation, between first and second spaced apart substrates. The technique includes forming a volume of fluid on the second substrate, with the volume of fluid having an area associated therewith. The volume of fluid is compressed between the first and second substrates to effectuate a change in properties of the area, defining changed properties. The changed properties are sensed, and the characteristics of the first and second substrates are determined as a function of the changed properties.

Abstract: The present invention includes a method of determining an alignment between a substrate and a template spaced-apart from the substrate and having a distance defined therebetween, the substrate having a first pattern disposed thereon and the template having a second pattern disposed thereon, the method including, sensing the first and the second pattern, with the distance being established such that the first and the second pattern form a desired moiré pattern when the template and the substrate are in a desired spatial relationship.

Abstract: The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate.

Abstract: The present invention is directed to a method for modulating shapes of a substrate, having first and second opposed surfaces. This is achieved by creating a pressure differential between differing regions of the first opposed surface to attenuate structural distortions in the second opposed surface that results from external forces bearing on the substrate.

Abstract: Described are high precision gap and orientation measurement methods between a template and a substrate used in imprint lithography processes. Gap and orientation measurement methods presented here include uses of broad-band light based measuring techniques.

Abstract: Disclosed is a template transfer assembly and method that features a template transfer substrate, and a template having first and second sides, with the first side facing away from the template transfer substrate and the second side facing the template transfer substrate and having mold pattern formed thereon. Polymerized imprint material is disposed between the second side and the template transfer substrate to fixedly attach the template to the template transfer substrate. The method of transferring an imprint lithography template includes dispensing a selected volume of imprinting fluid onto the template transfer substrate, placing the template upon the selected volume; and converting the imprinting fluid to solid imprint material. The selected volume of imprint material is of sufficient quantity to fixedly attach the template to the template transfer substrate while maintaining a space between the mold and the template transfer substrate.

Abstract: A method of determining and correcting alignment during imprint lithography process is described. During an imprint lithographic process the template may be aligned with the substrate by the use of alignment marks disposed on both the template and substrate. The alignment may be determined and corrected for before the layer is processed.

Abstract: A system of determining and correcting alignment during imprint lithography process is described. During an imprint lithographic process the template may be aligned with the substrate by the use of alignment marks disposed on both the template and substrate. The alignment may be determined and corrected for before the layer is processed.