Abstract: Described are methods for patterning a substrate by imprint lithography. Imprint lithography is a process in which a liquid is dispensed onto a substrate. A template is brought into contact with the liquid and the liquid is cured. The cured liquid includes an imprint of any patterns formed in the template. Alignment of the template with the substrate is performed prior to curing the liquid. Alignment of the template with the substrate includes rotational alignment of the template with respect to the substrate.

Abstract: A method of determining and correcting alignment during imprint lithography process is described. During an imprint lithographic process the template may be aligned with the substrate by the use of alignment marks disposed on both the template and substrate. The alignment may be determined and corrected for before the layer is processed.

Abstract: The present invention includes a method of determining a relative position of a substrate and a template spaced-apart therefrom, the substrate having substrate alignment marks disposed thereon and the template having template alignment marks disposed thereon, the method including, impinging first and second fluxes of light upon the substrate and template alignment marks, with the substrate and template alignment marks being responsive to the first flux of light defining a first response, and being responsive to the second flux of light defining a second response differing from the first response; and processing the first and second responses to form a focused image of the substrate and template alignment marks on a common plane, with the focused image indicating the relative position of the substrate and the template.

Abstract: The present invention provides a technique for determining characteristics of substrates, such as the presence of contaminants, shape, as well as the spatial relationships between spaced-apart substrates. The spatial relationships include distance and angular orientation, between first and second spaced apart substrates. The technique includes forming a volume of fluid on the second substrate, with the volume of fluid having an area associated therewith. The volume of fluid is compressed between the first and second substrates to effectuate a change in properties of the area, defining changed properties. The changed properties are sensed, and the characteristics of the first and second substrates are determined as a function of the changed properties.

Abstract: A system of determining and correcting alignment during imprint lithography process is described. During an imprint lithographic process the template may be aligned with the substrate by the use of alignment marks disposed on both the template and substrate. The alignment may be determined and corrected for before the layer is processed.

Abstract: The present invention provides a system for determining characteristics of substrates, such as the presence of contaminants, shape, as well as the spatial relationships between spaced-apart substrates. The spatial relationships include distance and angular orientation between first and second spaced apart substrates.

Abstract: The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate.

Abstract: The present invention includes a method of determining a relative position of a substrate and a template spaced-apart therefrom, the substrate having substrate alignment marks disposed thereon and the template having template alignment marks disposed thereon, the method including, impinging first and second fluxes of light upon the substrate and template alignment marks, with the substrate and template alignment marks being responsive to the first flux of light defining a first response, and being responsive to the second flux of light defining a second response differing from the first response; and processing the first and second responses to form a focused image of the substrate and template alignment marks on a common plane, with the focused image indicating the relative position of the substrate and the template.

Abstract: Disclosed are a method, system and holder for transferring templates during imprint lithography processes. To that end, a method for handling a template, having a patterned mold thereon, in an imprint lithography system having a motion stage with a chucking device coupled thereto, includes providing the template into a template transfer holder. The template transfer holder includes a side coupled to the motion stage and support members extending from the side. The template is disposed within the template transfer holder so as to have the patterned mold facing the side and spaced-apart therefrom. Relative movement is created between the motion stage and an imprint head to place the template transfer holder and the imprint head in superimposition. The template is removed from the template transfer holder, and the template is suspended above the wafer chuck by the imprint head. In another embodiment, a system and a template holder are described that facilitates the method.

Abstract: The present invention includes a method of aligning a substrate and a template spaced-apart from the substrate with an activating light curable liquid disposed therebetween, the substrate having substrate alignment marks and the template having template alignment marks, the method including, reducing a distance between the substrate and the template to cause a spreading of the activating light curable liquid; and varying an overlay placement of the template with respect to the substrate such that the template alignment marks are substantially aligned with the substrate alignment marks before the spreading causes the activating light curable liquid to cover an area between the substrate alignment marks and the template alignment marks.

Abstract: The present invention includes a method of determining an alignment between a substrate and a template spaced-apart from the substrate and having a distance defined therebetween, the substrate having a first pattern disposed thereon and the template having a second pattern disposed thereon, the method including, sensing the first and the second pattern, with the distance being established such that the first and the second pattern form a desired moiré pattern when the template and the substrate are in a desired spatial relationship.

Abstract: The present invention includes a method of moving a liquid between a substrate extending in a first plane and a template extending in a second plane. More specifically, the method may include forming an oblique angle between the first plane and the second plane, reducing a distance between the substrate and the template such that the template is in contact with a portion of the liquid at a desired location, and creating a dispersion of the liquid away from the desired location.

Abstract: The present invention includes a template comprising a plurality of protrusions and a plurality of recessions with a distance between a zenith of any of the plurality of protrusions and a nadir of any one of the plurality of recessions being less than 250 nm.

Abstract: The present invention includes a template to form a recorded pattern on a substrate from a conformable material disposed between the template and the substrate, with the recorded pattern having recorded features with designed dimensions, the template comprising an original pattern having original features with original dimensions, with the original dimensions differing from the designed dimensions sufficient to compensate for volumetric changes of the conformable material that occurs upon the conformable material transitioning between first and second states.

Abstract: A system of determining and correcting alignment during imprint lithography process is described. During an imprint lithographic process the template may be aligned with the substrate by the use of alignment marks disposed on both the template and substrate. The alignment may be determined and corrected for before the layer is processed.

Abstract: Described are imprint lithography templates, methods of forming and using the templates, and a template holder device. An imprint lithography template may include a body with a plurality of recesses on a surface of the body. The body may be of a material that is substantially transparent to activating light. At least a portion of the plurality of recesses may define features having a feature size less than about 250 nm. A template may be formed by obtaining a material that is substantially transparent to activating light and forming a plurality or recesses on a surface of the template. In some embodiments, a template may further include at least one alignment mark. In some embodiments, a template may further include a gap sensing area. An imprint lithography template may be used to form an imprinted layer in a light curable liquid disposed on a substrate. During use, the template may be disposed within a template holder.

Abstract: Described are methods for patterning a substrate by imprint lithography. Imprint lithography is a process in which a liquid is dispensed onto a substrate. A template is brought into contact with the liquid and the liquid is cured. The cured liquid includes an imprint of any patterns formed in the template. In one embodiment, the imprint process is designed to imprint only a portion of the substrate. The remainder of the substrate is imprinted by moving the template to a different portion of the template and repeating the imprint lithography process.

Abstract: The present invention provides a technique for determining characteristics of substrates, such as the presence of contaminants, shape, as well as the spatial relationships between spaced-apart substrates. The spatial relationships include distance and angular orientation, between first and second spaced apart substrates. The technique includes forming a volume of fluid on the second substrate, with the volume of fluid having an area associated therewith. The volume of fluid is compressed between the first and second substrates to effectuate a change in properties of the area, defining changed properties. The changed properties are sensed, and the characteristics of the first and second substrates are determined as a function of the changed properties.

Abstract: The present invention is directed to a method for modulating shapes of a substrate, having first and second opposed surfaces. This is achieved by creating a pressure differential between differing regions of the first opposed surface to attenuate structural distortions in the second opposed surface that results from external forces bearing on the substrate.

Abstract: The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate. The chucking system includes a chuck body having first and second opposed sides. A side surface extends therebetween. The first side includes first and second spaced-apart recesses defining first and second spaced-apart support regions. The first support region cinctures the second support region and the first and second recesses. The second support region cinctures the second recess, with a portion of the body in superimposition with the second recess being transparent to radiation having a predetermined wavelength. The second side and the side surface define exterior surfaces. The body includes throughways placing the first and second recesses in fluid communication with one of the exterior surfaces.