Patents by Inventor Byung Joon AN
Byung Joon AN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11649854Abstract: A rotation induction device for a vehicle includes: an upper case having a piston rod disposed therethrough; a lower case disposed adjacent to the upper case and having the piston rod disposed therethrough; a center plate disposed between the upper case and the lower case such that the piston rod passes through the center plate, to induce rotation of one or both of the upper case and the lower case; and a friction restraint part formed on one or both of the upper case and the lower case, to restrain friction with the center plate.Type: GrantFiled: August 24, 2021Date of Patent: May 16, 2023Assignee: HYUNDAI MOBIS CO., LTD.Inventors: Jun Mo Kang, Byung Joon Choi
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Patent number: 11629753Abstract: A rotation induction device for a vehicle, includes an upper case member, a lower case member, a center plate, and an inflow prevention part. The upper case member has a piston rod disposed therethrough. The lower case member, disposed under the upper case member, has the piston rod disposed therethrough. The center plate, disposed between the upper and lower case members such that the piston rod passes through the center plate, is configured to induce either one or both of the upper and lower case members to rotate. The inflow prevention part, formed in the upper and lower case members, is configured to block the inflow of foreign matters. Each of the upper case member, the lower case member, and the center plate is composed of a synthetic resin material.Type: GrantFiled: June 3, 2021Date of Patent: April 18, 2023Assignees: HYUNDAI MOBIS CO., LTD, ILJIN CO., LTDInventors: Byung Joon Choi, Jun Mo Kang, Byung Hwan Kim, Tae Ho Hong
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Patent number: 11629754Abstract: A rotation induction device for a vehicle includes an upper case member, a lower case member, a center plate, and a lubricant storage part. The upper case member has a piston rod disposed therethrough. The lower case member, disposed under the upper case member, has the piston rod disposed therethrough. The center plate, disposed between the upper and lower case members such that the piston rod passes through the center plate, is configured to induce either one or both of the upper and lower case members to rotate. The lubricant storage part is formed in the center plate and configured to store lubricant therein. Each of the upper case member, the lower case member, and the center plate is composed of a synthetic resin material.Type: GrantFiled: June 3, 2021Date of Patent: April 18, 2023Assignees: HYUNDAI MOBIS CO., LTD, ILJIN CO., LTDInventors: Byung Joon Choi, Jun Mo Kang, Byung Hwan Kim, Tae Ho Hong
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Patent number: 11597247Abstract: A rotation induction device for a vehicle includes an upper case member, a lower case member, a center plate, and a friction reduction part. The upper case member has a piston rod disposed therethrough. The lower case member, disposed under the upper case member, has the piston rod disposed therethrough. The center plate, disposed between the upper and lower case members such that the piston rod passes through the center plate, is configured to induce either one or both of the upper and lower case members to rotate. The friction reduction part, configured to reduce friction, is selectively disposed at a contact surface between the upper case member and the center plate, and a contact surface between the center plate and the lower case member. Each of the upper case member, the lower case member, and the center plate is composed of a synthetic resin material.Type: GrantFiled: June 3, 2021Date of Patent: March 7, 2023Assignees: HYUNDAI MOBIS CO., LTD, ILJIN CO., LTDInventors: Byung Joon Choi, Jun Mo Kang, Byung Hwan Kim, Tae Ho Hong
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Patent number: 11597248Abstract: A rotation induction device for a vehicle includes: an upper case formed of a synthetic resin material, and having a piston rod passing therethrough; a lower case formed of a synthetic resin material and disposed under the upper case, wherein the piston rod passes through the lower case; a center plate formed of a synthetic resin material, disposed between the upper case and the lower case such that the piston rod passes through the center plate, and configured to induce rotation of either one or both of the upper case and the lower case; and a ring-shaped installation space disposed between the upper and lower cases, wherein the center plate is inserted in the ring-shaped installation space.Type: GrantFiled: August 24, 2021Date of Patent: March 7, 2023Assignee: HYUNDAI MOBIS CO., LTD.Inventors: Jun Mo Kang, Byung Joon Choi
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Patent number: 11578755Abstract: A rotation induction device for a vehicle includes: an upper case having a piston rod disposed therethrough; a lower case disposed adjacent to the upper case and having the piston rod disposed therethrough; a center plate between the upper case and the lower case such that the piston rod passes through the center plate, and to induce rotation of one or both of the upper case and the lower case; and a lubricant retention part disposed on the lower case, and to store a lubricant therein.Type: GrantFiled: August 24, 2021Date of Patent: February 14, 2023Assignee: HYUNDAI MOBIS CO., LTD.Inventors: Jun Mo Kang, Byung Joon Choi
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Patent number: 11577568Abstract: A rotation induction device for a vehicle includes: an upper case member composed of a synthetic resin material and having a piston rod disposed therethrough; a lower case member composed of a synthetic resin material, disposed under the upper case member, and having the piston rod disposed therethrough; a center plate composed of a synthetic resin material, disposed between the upper and lower case members such that the piston rod passes through the center plate, and configured to induce either one or both of the upper and lower case members to rotate; and a stress distribution part formed on the center plate, and configured to distribute stress caused by a vertical load.Type: GrantFiled: June 3, 2021Date of Patent: February 14, 2023Assignees: Hyundai Mobis Co., Ltd., ILJIN Co., LTD.Inventors: Byung Joon Choi, Jun Mo Kang, Byung Hwan Kim, Tae Ho Hong
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Patent number: 11571881Abstract: The present invention relates to a hard coating film having a multilayer-structure and, specifically, to a hard coating film having a multilayer-structure, which has a low Vickers hardness (Hv) value while having an excellent scratch resistance together with flexibility.Type: GrantFiled: May 16, 2021Date of Patent: February 7, 2023Inventors: Pil Rye Yang, Dong Hee Lee, Sang Hyun Ahn, Hang Geun Kim, Seong Hoon Baek, Byung Joon An
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Patent number: 11566668Abstract: A rotation induction device for a vehicle includes: an upper case having a piston rod disposed therethrough; a lower case disposed adjacent to the upper case and having the piston rod disposed therethrough; a center plate disposed between the upper case and the lower case such that the piston rod passes through the center plate, to induce rotation of one or both of the upper case and the lower case; and a position guide part formed on one or both of the upper case and the lower case, to guide a position of the center plate.Type: GrantFiled: August 24, 2021Date of Patent: January 31, 2023Assignee: HYUNDAI MOBIS CO., LTD.Inventors: Jun Mo Kang, Byung Joon Choi
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Patent number: 11560925Abstract: A rotation induction device for a vehicle includes: an upper case having a piston rod disposed therethrough; a lower case disposed adjacent to the upper case and having the piston rod disposed therethrough; and a center plate disposed between the upper case and the lower case such that the piston rod passes through the center plate, and to be brought into line contact with the upper case and the lower case to induce rotation.Type: GrantFiled: August 24, 2021Date of Patent: January 24, 2023Assignee: HYUNDAI MOBIS CO., LTD.Inventors: Jun Mo Kang, Byung Joon Choi
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Publication number: 20230016571Abstract: Disclosed herein are an apparatus and method for preventing a security threat to a virtual machine. The apparatus includes one or more processors and executable memory for storing at least one program executed by the one or more processors. The at least one program is configured such that a hypervisor for virtualization in a host kernel executes a virtualization instruction corresponding to the service requested by a virtual machine of a host application and such that a hypervisor for monitoring interrupts the virtualization instruction in response to a security threat event occurring in the monitoring area of the hypervisor for virtualization and controls the process and thread of the host kernel. The hypervisor for monitoring is located in an area separate from the area in which the hypervisor for virtualization is located in the host kernel.Type: ApplicationFiled: September 29, 2021Publication date: January 19, 2023Inventors: Seung-Hun HAN, Seong-Joong KIM, Gak-Soo LIM, Byung-Joon KIM
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Publication number: 20230015504Abstract: A semiconductor device includes a standardized carrier. A semiconductor wafer includes a plurality of semiconductor die and a base semiconductor material. The semiconductor wafer is singulated through a first portion of the base semiconductor material to separate the semiconductor die. The semiconductor die are disposed over the standardized carrier. A size of the standardized carrier is independent from a size of the semiconductor die. An encapsulant is deposited over the standardized carrier and around the semiconductor die. An interconnect structure is formed over the semiconductor die while leaving the encapsulant devoid of the interconnect structure. The semiconductor device is singulated through the encapsulant. Encapsulant remains disposed on a side of the semiconductor die.Type: ApplicationFiled: September 26, 2022Publication date: January 19, 2023Applicant: STATS ChipPAC Pte. Ltd.Inventors: Byung Joon Han, Il Kwon Shim, Yaojian Lin, Pandi C. Marimuthu
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Publication number: 20230012958Abstract: A semiconductor device includes a semiconductor die and an encapsulant deposited over and around the semiconductor die. A semiconductor wafer includes a plurality of semiconductor die and a base semiconductor material. A groove is formed in the base semiconductor material. The semiconductor wafer is singulated through the groove to separate the semiconductor die. The semiconductor die are disposed over a carrier with a distance of 500 micrometers (?m) or less between semiconductor die. The encapsulant covers a sidewall of the semiconductor die. A fan-in interconnect structure is formed over the semiconductor die while the encapsulant remains devoid of the fan-in interconnect structure. A portion of the encapsulant is removed from a non-active surface of the semiconductor die. The device is singulated through the encapsulant while leaving encapsulant disposed covering a sidewall of the semiconductor die. The encapsulant covering the sidewall includes a thickness of 50 ?m or less.Type: ApplicationFiled: September 29, 2022Publication date: January 19, 2023Applicant: STATS ChipPAC Pte. Ltd.Inventors: Yaojian Lin, Pandi C. Marimuthu, Il Kwon Shim, Byung Joon Han
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Publication number: 20220394015Abstract: Disclosed herein are a method for establishing a remote work environment for ensuring the security of a user terminal for remote work and an apparatus using the method. The method, performed by the apparatus, includes acquiring media image creation information from a user; creating a certificate for VPN access based on the media image creation information and creating a media image using the media image creation information and the certificate for VPN access; and providing the media image to the user such that the user is able to create a medium for remote work. The user terminal for remote work is booted through the medium for remote work, thereby configuring a runtime environment for remote work in which security is ensured.Type: ApplicationFiled: September 7, 2021Publication date: December 8, 2022Inventors: Seung-Hun HAN, Ju-Hyung SON, Tae-Ho NAM, Ara JO, Gak-Soo LIM, Byung-Joon KIM
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Patent number: 11488932Abstract: A semiconductor device includes a standardized carrier. A semiconductor wafer includes a plurality of semiconductor die and a base semiconductor material. The semiconductor wafer is singulated through a first portion of the base semiconductor material to separate the semiconductor die. The semiconductor die are disposed over the standardized carrier. A size of the standardized carrier is independent from a size of the semiconductor die. An encapsulant is deposited over the standardized carrier and around the semiconductor die. An interconnect structure is formed over the semiconductor die while leaving the encapsulant devoid of the interconnect structure. The semiconductor device is singulated through the encapsulant. Encapsulant remains disposed on a side of the semiconductor die.Type: GrantFiled: March 23, 2020Date of Patent: November 1, 2022Assignee: STATS ChipPAC Pte. Ltd.Inventors: Byung Joon Han, Il Kwon Shim, Yaojian Lin, Pandi C. Marimuthu
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Patent number: 11488933Abstract: A semiconductor device includes a semiconductor die and an encapsulant deposited over and around the semiconductor die. A semiconductor wafer includes a plurality of semiconductor die and a base semiconductor material. A groove is formed in the base semiconductor material. The semiconductor wafer is singulated through the groove to separate the semiconductor die. The semiconductor die are disposed over a carrier with a distance of 500 micrometers (?m) or less between semiconductor die. The encapsulant covers a sidewall of the semiconductor die. A fan-in interconnect structure is formed over the semiconductor die while the encapsulant remains devoid of the fan-in interconnect structure. A portion of the encapsulant is removed from a non-active surface of the semiconductor die. The device is singulated through the encapsulant while leaving encapsulant disposed covering a sidewall of the semiconductor die. The encapsulant covering the sidewall includes a thickness of 50 ?m or less.Type: GrantFiled: July 1, 2020Date of Patent: November 1, 2022Assignee: STATS ChipPAC Pte. Ltd.Inventors: Yaojian Lin, Pandi C. Marimuthu, Il Kwon Shim, Byung Joon Han
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Publication number: 20220313215Abstract: Disclosed is an ultrasonic image presentation device comprising: an ultrasonic scanner having a probe which is a part coming into direct contact with an object and a marker; a photographing unit configured to photograph the marker; an ultrasonic image presentation unit configured to acquire an ultrasonic image as a two-dimensional depth cross-sectional image for a part coming into contact with the probe of the ultrasonic scanner, estimate a position and posture of the marker in a three-dimensional image on the basis of an image photographed by the photographing unit; estimate a position and posture of the probe in the three-dimensional image from the estimated marker position and posture information, create a point cloud by converting pixels of the ultrasonic image into points of the three-dimensional image on the basis of the estimated probe position and posture information, and restore the three-dimensional ultrasonic image on the basis of the created point cloud; and a display unit configured to display thType: ApplicationFiled: April 29, 2020Publication date: October 6, 2022Applicant: DECASIGHT CORPORATIONInventors: Byung Joon PARK, Soo Ho CHOI, Tae Hyun KIM
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Publication number: 20220233247Abstract: A medical instrument positioning tracking system according to the present invention comprises: a bar-type medical instrument of which the front end part is formed in a bar shape including needle and syringe shapes and which has an identification segment formed, on the rear end part thereof, in the longitudinal direction of the bar shape; a tracking multi-camera including a plurality of cameras provided at a plurality of locations so that the identification segment can be photographed in a plurality of time points; a display device for displaying an augmented reality image with the bar-type medical instrument as an augmented object and also displaying relevant information including location and angle information of the bar-type medical instrument; and a control device for acquiring, in real time, a tracking image capture by the tracking multi-camera for every frame, estimating a three-dimensional segment by using the acquired image, estimating the actual three-dimensional positioning of the bar-type medical inType: ApplicationFiled: April 29, 2020Publication date: July 28, 2022Applicant: DECASIGHT CORPORATIONInventors: Byung Joon PARK, Soo Ho CHOI, Tae Hyun KIM
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Patent number: 11393081Abstract: Disclosed herein is a method and apparatus for processing a thermal image. The method includes: performing histogram stretching on thermal image data of the thermal image; and adjusting a histogram stretching scale for thermal image data of a next frame using histogram data of the thermal image data on which the histogram stretching is performed. As a result, it is possible to mitigate that an image becomes less recognizable as thermal image data is deteriorated or saturated.Type: GrantFiled: May 28, 2019Date of Patent: July 19, 2022Assignee: HANWHA TECHWIN CO., LTD.Inventors: Seung Jin Han, Geon Hyoung Lee, Byung Joon Song, Han Seok Seo, Bo A Jung, Jin Wook Huh, Ki Rim Lee
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Publication number: 20220140340Abstract: The present invention relates to a carbon nanotube having an La(100) of less than 7.0 nm when measured by XRD and a specific surface area of 100 m2/g to 196 m2/g, and an electrode and a secondary battery including the carbon nanotube.Type: ApplicationFiled: March 6, 2020Publication date: May 5, 2022Applicant: LG Energy Solution, Ltd.Inventors: Tae Gon Kim, Wang Mo Jung, Kwang Woo Yoon, Seung Yong Son, Byung Joon Chae, Sin Young Park, Se Hui Sohn, Dae Jin Lee, Bo Ram Lee, Hak Yoon Kim, Seul Ki Kim, Jin Young Hwang