Abstract: A semiconductor device includes a semiconductor die and an encapsulant deposited over and around the semiconductor die. A semiconductor wafer includes a plurality of semiconductor die and a base semiconductor material. A groove is formed in the base semiconductor material. The semiconductor wafer is singulated through the groove to separate the semiconductor die. The semiconductor die are disposed over a carrier with a distance of 500 micrometers (?m) or less between semiconductor die. The encapsulant covers a sidewall of the semiconductor die. A fan-in interconnect structure is formed over the semiconductor die while the encapsulant remains devoid of the fan-in interconnect structure. A portion of the encapsulant is removed from a non-active surface of the semiconductor die. The device is singulated through the encapsulant while leaving encapsulant disposed covering a sidewall of the semiconductor die. The encapsulant covering the sidewall includes a thickness of 50 ?m or less.

Abstract: An apparatus and method for collecting an audit trail in a virtual machine boot process, the audit-trail-collecting apparatus including an event detection unit for detecting a software interrupt event, a register state information extraction unit for extracting state information of a CPU register corresponding to a detection time of the software interrupt event, a monitoring unit for monitoring a change in a vector value corresponding to the software interrupt event in an interrupt vector table, a threat occurrence detection unit for detecting a threat occurrence in a virtual machine boot process based on at least one of the CPU register state information and a monitored result, and an audit trail collection unit for storing an audit trail corresponding to at least one of the CPU register state information and the monitored result when the threat occurrence is detected in the virtual machine boot process.

Abstract: Provided is an electronic device that includes a housing at least partially including a metal portion, a glass plate mounted on one surface of the housing, and a buffer disposed at least on the metal portion on one face of the housing and disposed adjacent to an edge of the glass plate.

Abstract: A user terminal using cloud service, an integrated security management server for the user terminal, and an integrated security management method for the user terminal. The integrated security management method includes receiving, by an integrated security management server, authentication information from at least one user terminal that use a cloud service, authenticating, by the integrated security management server, the user terminal using the authentication information, transmitting, by the integrated security management server, task information to the user terminal so as to control the user terminal, receiving, by the integrated security management server, at least one of a result of processing the task information and state information from the user terminal that verifies the task information, and managing, by the integrated security management server, a state of the user terminal based on at least one of the result of processing and the state information.

Abstract: An image sensor chip may include a first sub-chip, a second sub-chip on the first sub-chip, and an interconnector between the first and second sub-chips. The first sub-chip may include a first substrate, a bottom electrode on a first region of the first substrate, and a first capacitor on the bottom electrode. The first capacitor may include a plurality of first electrodes vertically extending from a top surface of the bottom electrode, a second electrode on the first electrodes, and a first dielectric layer between the second electrode and the first electrodes. The second sub-chip may include a pixel array configured to convert incident light into an electrical signal. The pixel array may be electrically connected through the interconnector to the first capacitor.

Abstract: Provided is a target speech signal extraction method for robust speech recognition including: receiving information on a direction of arrival of the target speech source with respect to the microphones; generating a nullformer by using the information on the direction of arrival of the target speech source to remove the target speech signal from the input signals and to estimate noise; setting a real output of the target speech source using an adaptive vector as a first channel and setting a dummy output by the nullformer as a remaining channel; setting a cost function for minimizing dependency between the real output of the target speech source and the dummy output using the nullformer by performing independent component analysis (ICA) or independent vector analysis (IVA); setting an auxiliary function to the cost function; and estimating the target speech signal by using the cost function and the auxiliary function.

Abstract: A semiconductor device includes a standardized carrier. A semiconductor wafer includes a plurality of semiconductor die and a base semiconductor material. The semiconductor wafer is singulated through a first portion of the base semiconductor material to separate the semiconductor die. The semiconductor die are disposed over the standardized carrier. A size of the standardized carrier is independent from a size of the semiconductor die. An encapsulant is deposited over the standardized carrier and around the semiconductor die. An interconnect structure is formed over the semiconductor die while leaving the encapsulant devoid of the interconnect structure. The semiconductor device is singulated through the encapsulant. Encapsulant remains disposed on a side of the semiconductor die.

Abstract: Disclosed herein is a method and apparatus for processing a thermal image. The method includes: performing histogram stretching on thermal image data of the thermal image; and adjusting a histogram stretching scale for thermal image data of a next frame using histogram data of the thermal image data on which the histogram stretching is performed. As a result, it is possible to mitigate that an image becomes less recognizable as thermal image data is deteriorated or saturated.

Abstract: Provided is an electro-spinning apparatus, which can perform spinning uniformly over the entire width of a manufactured fiber. The apparatus includes: a solution distribution unit made of an electrical conductor to distribute and supply a spinning solution to injection lines; spinning nozzles installed to be individually coupled to the injection lines and spinning while adjusting a spinning amount of the spinning solution supplied through the injection lines; a solution supply line installed to be coupled on the top of the solution distribution unit to supply the spinning solution heated to a high temperature to the solution distribution unit; a high voltage supply unit installed on one side of the solution distribution unit to supply high voltage power; and a hot air supply unit for supplying air of hot temperature to each of the spinning nozzles and injecting the hot air through the spinning nozzles together with the spinning solution.

Abstract: The present invention relates to a resin composition for coating, and a coating film comprising a cured product thereof as a coating layer. Particularly, the present invention relates to a resin composition for coating, and a coating film comprising a cured product thereof as a coating layer, wherein the resin composition for coating comprises a siloxane resin that is chemically bonded by compounds comprising alkoxysilane and diol, which comprise epoxy or acryl within the chemical structures thereof.

Abstract: A hard coating film comprising a base layer including: a polymer binder resin; first inorganic particles dispersed in the polymer binder resin and having an average particle size of 5 nm or more and less than 70 nm; and second inorganic particles which are dispersed in the polymer binder resin and have an average particle size of 70 nm to 150 nm is provided.

Abstract: Provided is a method for manufacturing an electromagnetic interference shielding film comprising an electromagnetic interference shielding layer, the method comprising the steps of: preparing a metal nanoplate solution comprising a solvent in which metal nanoplates are dispersed; and coating the metal nanoplate solution on a substrate.

Abstract: An image sensing system includes a pixel array, an analog-to-digital converter circuit, and a memory. The pixel array includes a first pixel, a second pixel, and a third pixel interposed between the first pixel and the second pixel. During a first sensing time, the analog-to-digital converter circuit converts a first image signal received from the first pixel to first image data and converts a second image signal received from the second pixel to second image data. During a second sensing time, the analog-to-digital converter circuit converts a third image signal received from the third pixel to third image data. The first image data and the second image data are written in the memory during a first write time, and the third image data are written in the memory during a second write time.

Abstract: A semiconductor device includes a standardized carrier. A semiconductor wafer includes a plurality of semiconductor die and a base semiconductor material. The semiconductor wafer is singulated through a first portion of the base semiconductor material to separate the semiconductor die. The semiconductor die are disposed over the standardized carrier. A size of the standardized carrier is independent from a size of the semiconductor die. An encapsulant is deposited over the standardized carrier and around the semiconductor die. An interconnect structure is formed over the semiconductor die while leaving the encapsulant devoid of the interconnect structure. The semiconductor device is singulated through the encapsulant. Encapsulant remains disposed on a side of the semiconductor die.

Abstract: A method of noise cancellation comprises providing a first estimated output signal based on an input signal and a first prior far-end channel filter and a second prior far-end channel filter corresponding to a prior frame, updating a first current far-end channel filter corresponding to a current frame according to the first estimated output signal and the first prior far-end channel filter, providing a second estimated output signal based on the input signal, the first current far-end channel filter, and the second prior far-end channel filter, updating a second current far-end channel filter corresponding to the current frame according to the second estimated output signal and the second prior far-end channel filter, and providing a resultant signal based on the input signal, the first current far-end channel filter, and the second current far-end channel filter.

Abstract: According to an embodiment, a noise cancellation method comprises updating a first far-end channel filter according to a first variance yielded based on an input signal and a first far-end signal included in the input signal, providing a first output signal obtained by removing a first far-end noise signal from the input signal through the first far-end channel filter, updating a second far-end channel filter according to a second variance yielded based on the first output signal and a second far-end signal included in the input signal, and providing a second output signal obtained by removing a second far-end noise signal from the first output signal through the second far-end channel filter.

Abstract: A hypervisor-based virtual machine isolation apparatus and method. The hypervisor-based virtual machine isolation method performed by the hypervisor-based virtual machine isolation apparatus includes when a hypervisor starts to run virtual machines, allocating one or more colors to each of the virtual machines, allocating a page frame corresponding to the allocated colors to the corresponding virtual machine, allocating an accessible core depending on the colors of the virtual machine, and performing isolation between virtual machines corresponding to an identical color by changing a temporal/spatial scheduling order between the virtual machines corresponding to the identical color.

Abstract: An image sensor includes a pixel array having a plurality of pixels and a logic circuit receiving a pixel signal from the plurality of pixels to generate image data. The logic circuit generates a preview image from the image data to output the preview image externally. An internal memory stores still images generated by the logic circuit from the image data. The logic circuit selects and outputs a result image corresponding to an event occurrence point of a capturing command from the still images stored in the internal memory, in response to the capturing command received from an external source.

Abstract: A method, performed by an electronic apparatus, of executing an application, based on a voice input of a user, and the electronic apparatus are provided. The method includes performing voice recognition on the voice command for executing the application, determining a target page among a plurality of pages displayable when the application is executed, based on a result of the voice recognition, generating a virtual input sequence for displaying a second screen corresponding to the target page, instead of a first screen currently displayed, and executing the application in response to the virtual input sequence.

Abstract: An image sensor chip may include a first sub-chip, a second sub-chip on the first sub-chip, and an interconnector between the first and second sub-chips. The first sub-chip may include a first substrate, a bottom electrode on a first region of the first substrate, and a first capacitor on the bottom electrode. The first capacitor may include a plurality of first electrodes vertically extending from a top surface of the bottom electrode, a second electrode on the first electrodes, and a first dielectric layer between the second electrode and the first electrodes. The second sub-chip may include a pixel array configured to convert incident light into an electrical signal. The pixel array may be electrically connected through the interconnector to the first capacitor.