Patents by Inventor Byung-Jun An

Byung-Jun An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230103027
    Abstract: In one embodiment, the present application discloses a surface binding compound of the Formula I or Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound of the Formula I or Formula II.
    Type: Application
    Filed: May 10, 2022
    Publication date: March 30, 2023
    Applicant: Envista
    Inventors: Byung Jun Ahn, Bruce H. Lipshutz, Sam L. Nguyen
  • Publication number: 20230096111
    Abstract: According to an embodiment of the present technology, a storage device may include a main memory device, a buffer memory device including a plurality of areas and operating as a buffer of the main memory device, and a memory controller configured to change one or more of respective uses of the plurality of areas in response to a preparation command indicating that one or more read commands for requesting data stored in the main memory device are to be provided, which is received from an external host.
    Type: Application
    Filed: June 21, 2022
    Publication date: March 30, 2023
    Inventor: Byung Jun Kim
  • Publication number: 20230080296
    Abstract: Disclosed are a system and a method for limiting the maximum acceleration of a motor driven vehicle. The system and method can estimate an acceleration from a speed of a motor driven vehicle, and limit the maximum acceleration of the motor driven vehicle to a level to exert constant traveling performance regardless of the total weight of the vehicle and road gradient conditions using the estimated acceleration as a control variable for limiting the maximum acceleration, thereby improving the ride comfort and the fuel efficiency.
    Type: Application
    Filed: September 15, 2022
    Publication date: March 16, 2023
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Chang Eun Na, Hyun Seok Jang, Byung Jun Sung, Seung Ho Choi
  • Patent number: 11604950
    Abstract: The present disclosure relates to a method and an apparatus for classifying data points using convex hulls based on centroids of clusters, and a method for classifying data points according to one embodiment of the present disclosure comprises clustering data points into a plurality of clusters; constructing a hyperplane by using a set of centroids of singular clusters having a single class label from the plurality of clusters and removing singular clusters whose centroids are not used to construct the hyperplane; generating a convex hull for a singular cluster used to construct the hyperplane; removing internal data points except for the vertices of the generated convex hull from the singular cluster whose centroid is used to construct the hyperplane; and classifying a set of remaining data points except for the removed internal data points among the plurality of clusters.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: March 14, 2023
    Assignee: Research & Business Foundation Sungkyunkwan University
    Inventors: Hee Yong Youn, Byung Jun Lee, Kyung Tae Kim, Pardis Birzhandi, Min Woo Kim, Tae Ho Lee
  • Patent number: 11605615
    Abstract: A semiconductor package includes: a substrate including a first bonding pad and a first conductive pattern positioned at the same level and in contact with the first bonding pad; a lower semiconductor chip and an upper semiconductor chip stacked over the substrate, the lower and upper semiconductor chips respectively including a first lower chip pad and a first upper chip pad; a first lower bonding wire with first and second ends respectively connected to the first bonding pad and the first lower chip pad; and a first upper bonding wire with a first end connected to the first bonding pad and a second end connected to the first upper chip pad, the first end of the first upper bonding wire is located farther from the lower and upper semiconductor chips and closer to the first conductive pattern than the first end of the first lower bonding wire.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: March 14, 2023
    Assignee: SK hynix Inc.
    Inventors: Byung Jun Bang, Ju Il Eom
  • Publication number: 20230069562
    Abstract: A bi-stable soft electromagnetic actuator includes a housing including a frame portion formed of a stretchable elastic body, a stretchable coil portion generating an electromagnetic field by applied power, located in the housing, and having a first surface and a second surface facing in mutually opposite directions, and at least a pair of permanent magnet portions respectively facing the first surface and the second surface of the stretchable coil portion and arranged to maintain a distance by the frame portion.
    Type: Application
    Filed: August 26, 2022
    Publication date: March 2, 2023
    Inventors: Yong Lae PARK, Gyo Wook SHIN, Yeongjin CHOI, Byung Jun JEON, Inrak CHOI
  • Publication number: 20230065857
    Abstract: A battery module includes a battery assembly including a plurality of sub-packing units, the plurality of sub-packing units respectively including a cell housing, at least one battery cell accommodated in an internal space of the cell housing, and at least one vent hole disposed in the cell housing and connecting the internal space to an outside of the cell housing, and a flame blocking structure coupled to the battery assembly, and including an inlet hole connected to the vent hole, an inner chamber communicating with the inlet hole, an outlet hole communicating with the inner chamber and the outside, and at least one partition wall protruding into the inner chamber.
    Type: Application
    Filed: August 18, 2022
    Publication date: March 2, 2023
    Inventors: Byung Jun PARK, Tae Hyun CHANG
  • Publication number: 20230057434
    Abstract: An array antenna is proved. The array antenna provides multi-polarization by arranging multiple ports at adjacent positions. Specifically, the array antenna includes a first substrate having a first thickness and a rectangular shape, a second substrate disposed to be in contact with the bottom surface of the first substrate and having a second thickness and a rectangular shape, a ground surface shared by the first substrate and the second substrate, and first ports and second ports disposed to penetrate the ground surface.
    Type: Application
    Filed: September 3, 2021
    Publication date: February 23, 2023
    Inventors: Tae Heung LIM, Byung-Jun JANG, Hosung CHOO
  • Publication number: 20230058485
    Abstract: A semiconductor package includes a second semiconductor die stacked on a first semiconductor die. The first semiconductor die includes a first contact pad connected to a first integrated circuit, and includes a second contact pad connected to a third contact pad by a first interconnection line. The second semiconductor die includes a fourth contact pad connected to the third contact pad and connected to a second integrated circuit. A first bonding wire is connected to the first contact pad, and a second bonding wire is connected to the second contact pad.
    Type: Application
    Filed: February 14, 2022
    Publication date: February 23, 2023
    Applicant: SK hynix Inc.
    Inventors: Ha Gyeong SONG, Byung Jun BANG
  • Patent number: 11584381
    Abstract: Disclosed are an apparatus and method for controlling articulation of an articulated vehicle. The apparatus includes a yaw rate calculator configured to calculate a desired yaw rate based on a steering angle and a speed of the articulated vehicle, a first moment generator configured to generate a yaw rate control moment based on the desired yaw rate and an actual yaw rate of the articulated vehicle, a second moment generator configured to generate a hitch damping control moment based on a hitch angular velocity of the articulated vehicle, an adder configured to output a final moment for controlling the articulation of the articulated vehicle by adding the yaw rate control moment and the hitch damping control moment, and an articulation controller configured to control the articulation of the articulated vehicle based on the final moment.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: February 21, 2023
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventor: Byung Jun Sung
  • Patent number: 11578718
    Abstract: An apparatus for reducing noise of a gear pump through uneven pitch-simulated control includes a calculation unit to calculate different control current values for each tooth of a teeth order by applying a teeth number, the teeth order, and a teeth angle of the gear pump in which a plurality of teeth are evenly formed, a storage unit to map and store the teeth order and the different control current values corresponding to the teeth order for each tooth, and a current controller to variably generate the control current value mapped corresponding to the teeth order when each tooth reaches a reference position when the gear pump rotates by a motor, wherein the control current value is added to a reference current value of a motor control signal and applied to the motor.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: February 14, 2023
    Assignees: Hyundai Motor Company, Kia Corporation, Myunghwa Ind. Co., Ltd.
    Inventors: Sung Wook Jang, Dong Kuk Han, MinSu Kim, Chin Chul Choi, Byung Jun Hwang, Hyung Suk Kim
  • Patent number: 11572269
    Abstract: A semiconductor package using a polymer substrate is disclosed and may include a polymer cavity structure comprising first metal traces, a micro-electro mechanical systems (MEMS) device and a semiconductor die bonded to a first surface within a cavity of the cavity structure, and a substrate coupled to the cavity structure and comprising second metal traces coupled to the first metal traces. The substrate may enclose the MEMS device and the semiconductor die. Ground traces may be on external surfaces of the polymer cavity structure. Ball lands may be on a surface of the substrate opposite to a surface with the second metal traces. The first metal traces may extend from the first surface of the polymer cavity structure up a sidewall of the cavity and to conductive patterns on a top surface of the polymer cavity structure.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: February 7, 2023
    Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
    Inventors: Yung Woo Lee, Byung Jun Kim, Dong Hyun Bang, EunNaRa Cho, Adrian Arcedera, Jae Ung Lee
  • Publication number: 20230033625
    Abstract: A battery rack includes: a housing; a module unit provided in the housing, including a plurality of battery cells, and having at least one vent hole; and a cooling unit provided to face the vent hole in the housing, and including a cooling line in which a coolant is provided, wherein the cooling line is provided so that at least a portion of an outer periphery thereof is melted by heat generated from the module unit to supply the coolant toward the vent hole.
    Type: Application
    Filed: June 20, 2022
    Publication date: February 2, 2023
    Inventors: Yun Hee KIM, Tae Hyun Chang, Suk Chul Kim, Yong Uk Kim, Byung Jun Park, Jong Ho Seok, Dong Hwa Han
  • Publication number: 20230026323
    Abstract: According to an embodiment of the present disclosure, a storage device may include a memory device, and a memory controller configured to receive a read command from an external host and control the memory device according to the read command, wherein the read command may include a basic header segment commonly included in commands transferred between the external host and the memory controller and including information indicating that the read command is a command for requesting data stored in the memory device, a transaction specific field including information indicating that the read command is a read command for at least two or more logical addresses, and an extra header segment including information on the at least two or more logical addresses.
    Type: Application
    Filed: June 14, 2022
    Publication date: January 26, 2023
    Inventors: Byung Jun KIM, Jea Young Zhang, Young Kyu Jeon, Kyoung Ku Cho
  • Patent number: 11527828
    Abstract: The disclosure relates to an array antenna, and specifically, relates to an array antenna which improves performance by using a shorting pin. The array antenna includes a first antenna, a second antenna, the first antenna and the second antenna sharing a ground, and a substrate disposed on an upper portion of the ground, and the second antenna is disposed in contact with an upper portion of the substrate, the first antenna is disposed by penetrating through centers of the substrate and the second antenna, the array antenna includes a plurality of feeding pins disposed by penetrating through the second antenna, the substrate, and the ground, and the array antenna includes a plurality of shorting pins penetrating through the second antenna, the substrate, and the ground to be symmetric with the plurality of feeding pins.
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: December 13, 2022
    Assignees: Hongik University Industry-Academia Cooperation Foundation, Kookmin University Industry Academy Cooperation Foundation
    Inventors: Tae Heung Lim, Byung-Jun Jang, Hosung Choo
  • Publication number: 20220389140
    Abstract: Provided are an ethylene-propylene-diene monomer (EPDM) copolymer and a method of preparing the same. An EPDM copolymer which has more improved miscibility with inorganic fillers such as carbon black, may further facilitate dispersibility in mixing to further decrease the viscosity of a compound composition, and may provide a compound composition having excellent processability and mechanical properties. A method of preparing the same is also provided.
    Type: Application
    Filed: May 26, 2022
    Publication date: December 8, 2022
    Inventors: Byoung Tak Yim, Byung Jun Kim, Jeong Hwan Kim
  • Patent number: 11520519
    Abstract: Provided herein may be a storage device and a method of operating the same. A memory controller may include a command processor configured to generate a flush command in response to a flush request and determine flush data chunks to be stored, a write operation controller configured to control memory devices to perform a first program operation of storing flush data chunks, and to perform a second program operation of storing data corresponding to a write request that is input later than the flush request, regardless of whether a response to the flush command has been provided to a host, and a flush response controller configured to, when the first program operation is completed, provide a response to the flush command to the host depending on whether responses to flush commands, input earlier than the flush command, have been provided to the host.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: December 6, 2022
    Assignee: SK hynix Inc.
    Inventors: Byung Jun Kim, Eu Joon Byun, Hye Mi Kang
  • Publication number: 20220384890
    Abstract: An energy storage system includes: stacked battery modules; and a rack accommodating the battery modules. The rack includes a sidewall disposed on one side of the battery modules, and the sidewall includes a fire-resistant member opposing the battery modules.
    Type: Application
    Filed: May 4, 2022
    Publication date: December 1, 2022
    Inventors: Jong Ho SEOK, Suk Chul KIM, Yong Uk KIM, Yun Hee KIM, Byung Jun PARK, Tae Hyun CHANG, Dong Hwa HAN
  • Publication number: 20220384957
    Abstract: The disclosure relates to an array antenna, and specifically, relates to an array antenna which improves performance by using a shorting pin. The array antenna includes a first antenna, a second antenna, the first antenna and the second antenna sharing a ground, and a substrate disposed on an upper portion of the ground, and the second antenna is disposed in contact with an upper portion of the substrate, the first antenna is disposed by penetrating through centers of the substrate and the second antenna, the array antenna includes a plurality of feeding pins disposed by penetrating through the second antenna, the substrate, and the ground, and the array antenna includes a plurality of shorting pins penetrating through the second antenna, the substrate, and the ground to be symmetric with the plurality of feeding pins.
    Type: Application
    Filed: July 28, 2021
    Publication date: December 1, 2022
    Inventors: Tae Heung LIM, Byung-Jun JANG, Hosung CHOO
  • Publication number: 20220349073
    Abstract: An electrochemical electrode according to the present invention may prevent agglomeration and desorption of a catalyst even when a catalyst in a particle form is used, because a protective layer containing hydrogel is used, such that stability may be secured, thereby implementing an electrode having a long duration.
    Type: Application
    Filed: April 29, 2022
    Publication date: November 3, 2022
    Inventors: Joo Ho MOON, Hyung suk LEE, Byung Jun KANG, Jei Wan TAN, Don Yeong KANG, Kyung Min KIM