Patents by Inventor Byung-Jun An

Byung-Jun An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220341787
    Abstract: A high-sensitive contactless chromaticity measuring device according to the present invention, includes: a lens unit to receive light emitted from a measurement object; a light distribution unit including an optical fiber to receive the light passing through the lens unit and distribute the received light through n paths to output the light to the other side, wherein a numerical aperture is greater than a predetermined reference value, a condensing lens to reduce an incidence angle of the light output to the other side of the optical fiber to a target angle or more, and n color filters to transmit different wavelengths of the light passing through the condensing lens; and a signal conversion unit including a photodiode to convert the light transmitted from the light distribution unit into an electrical signal.
    Type: Application
    Filed: November 12, 2020
    Publication date: October 27, 2022
    Applicant: ANI. Co. Ltd
    Inventors: Byung Jun OH, Kyu Ho LEE, Kyu Seok KIM, Hyun Ho LEE, Ki Beom NA, Sung Hyuk YOON
  • Publication number: 20220336927
    Abstract: A battery module is proposed. The battery module includes a plurality of battery sub-modules, and a front cover part configured to cover an outermost stacking surface of the plurality of stacked battery sub-modules. The front cover part includes a front plate including a contact terminal electrically connected to an outside, a bus bar electrically connecting the plurality of battery sub-modules to each other, and a disconnection induction bus bar coupled to an inside end of the contact terminal to press and contact the bus bar, and a switching slider configured to slide between the bus bar and the disconnection induction bus bar.
    Type: Application
    Filed: April 19, 2022
    Publication date: October 20, 2022
    Inventors: Yong Uk KIM, Byung Jun PARK, Suk Chul KIM, Yun Hee KIM, Jong Ho SEOK, Tae Hyun CHANG, Dong Hwa HAN
  • Publication number: 20220336420
    Abstract: A semiconductor package includes: a substrate including a first bonding pad and a first conductive pattern positioned at the same level and in contact with the first bonding pad; a lower semiconductor chip and an upper semiconductor chip stacked over the substrate, the lower and upper semiconductor chips respectively including a first lower chip pad and a first upper chip pad; a first lower bonding wire with first and second ends respectively connected to the first bonding pad and the first lower chip pad; and a first upper bonding wire with a first end connected to the first bonding pad and a second end connected to the first upper chip pad, the first end of the first upper bonding wire is located farther from the lower and upper semiconductor chips and closer to the first conductive pattern than the first end of the first lower bonding wire.
    Type: Application
    Filed: August 10, 2021
    Publication date: October 20, 2022
    Applicant: SK hynix Inc.
    Inventors: Byung Jun BANG, Ju Il EOM
  • Patent number: 11453790
    Abstract: In one embodiment, the present application discloses a photo-cleavable surface binding compound of the Formula I and Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: September 27, 2022
    Assignee: ENVISTA
    Inventors: Byung Jun Ahn, Bruce H. Lipshutz, Sam L. Nguyen, Roscoe Linstadt
  • Patent number: 11430824
    Abstract: An integrated circuit (IC) device includes a first substrate and a first structure on a front surface of the first substrate. The first structure includes a first interlayer insulating layer structure including a plurality of first conductive pad layers spaced apart from one another at different levels of the first interlayer insulating layer structure. The IC device includes a second substrate on the first substrate and a second structure on a front surface of the second substrate, which faces the front surface of the first substrate. The second structure includes a second interlayer insulating layer structure bonded to the first interlayer insulating layer structure. A through-silicon via (TSV) structure penetrates the second substrate and the second interlayer insulating layer structure. The TSV structure is in contact with at least two first conductive pad layers of the plurality of first conductive pad layers located at different levels.
    Type: Grant
    Filed: April 3, 2020
    Date of Patent: August 30, 2022
    Inventors: Sun-hyun Kim, Sang-il Jung, Byung-jun Park
  • Patent number: 11431400
    Abstract: A 5th generation (5G) or pre-5G communication system for supporting a data transmission rate higher than that of a 4th generation (4G) communication system, such as long term evolution (LTE) is provided. The wireless communication system, includes a plurality of antennas for identifying a plurality of radio signal, a receiver for receiving the plurality of the radio signals via the plurality of the antennas, wherein the receiver may include a coupler circuit for coupling the plurality of the received signals to different signal paths, to generate a first coupling signal by summing the plurality of the received signals and a second coupling signal corresponding to a difference of the plurality of the received signals, and a beam generator for generating a plurality of beamformed signals based on in-phase signals and quadrature-phase signals corresponding to the first coupling signal and the second coupling signal.
    Type: Grant
    Filed: October 6, 2020
    Date of Patent: August 30, 2022
    Assignee: Kookmin University Industry Academy Cooperation Foundation
    Inventor: Byung-Jun Jang
  • Patent number: 11431404
    Abstract: A wireless communication system, an apparatus and a method for integrating communication and sensing functions in the wireless communication system are provided. The communication device includes a communication unit for bi-directional communication, and a radar unit for sensing. The communication unit and the radar unit may commonly include a common transmit chain which generates a transmit signal. The transmit signal may have a first polarization. The communication unit may include a communication receive chain, and if a receive signal has the first polarization in response to the transmit signal, the communication receive chain may receive the receive signal having the first polarization via the hybrid coupler and perform communication and if the receive signal corresponding to the transmit signal has second polarization different from the first polarization, a sensing receive chain of the radar unit may receive the receive signal having the second polarization perform sensing by the radar unit.
    Type: Grant
    Filed: July 23, 2021
    Date of Patent: August 30, 2022
    Assignee: Kookmin University Industry Academy Cooperation Foundation
    Inventor: Byung-Jun Jang
  • Publication number: 20220271372
    Abstract: A battery module includes a battery sub-module including a cell support member, at least one battery cell accommodated in the cell support member, and a case provided to partially surround the at least one battery cell, and a first barrier disposed on a first side of the battery sub-module, wherein the at least one battery cell is enclosed and sealed by the cell support member and the case, and the first barrier includes a first protrusion configured to press a part of the case inwardly of the battery sub-module
    Type: Application
    Filed: February 9, 2022
    Publication date: August 25, 2022
    Inventors: Suk Chul KIM, Yong Uk KIM, Yun Hee KIM, Byung Jun PARK, Jong Ho SEOK, Tae Hyun CHANG, Dong Hwa HAN
  • Patent number: 11422942
    Abstract: A memory system includes a memory device configured to store a piece of data in a location which is distinguished by a physical address and a controller configured to generate a piece of map data associating a logical address, inputted along with a request from an external device, with the physical address and to transfer a response including the piece of map data to the external device.
    Type: Grant
    Filed: April 2, 2020
    Date of Patent: August 23, 2022
    Assignee: SK hynix Inc.
    Inventors: Eu-Joon Byun, Jong-Hwan Lee, Byung-Jun Kim
  • Patent number: 11422035
    Abstract: Disclosed is a color and luminance measuring device including a filter unit including a case which covers the entire device and has a light incident part formed on one side thereof through which measured light emitted from an object to be measured is incident, a measurement unit which measures luminance and a color by receiving the measured light in the case, and a filter unit which is disposed on a movement path of the measured light in the case to selectively control the luminance of the measured light transmitted to the measurement unit and transmit the measured light, wherein the filter unit reduces the luminance of the measured light to a predetermined level when the measured light has luminance of a predetermined level or higher and transmits the measured light to the measurement unit.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: August 23, 2022
    Assignee: ANI. Co. Ltd
    Inventors: Byung Jun Oh, Kyu Ho Lee, Kyu Seok Kim, Chang Hun Lim, Seung Yub Choi, Hyun Seock Oh, Taek Gyu Song
  • Publication number: 20220263199
    Abstract: A battery module includes a housing; a first battery cell and a second battery cell accommodated inside the housing; a first conductive member electrically connecting the first battery cell and the second battery cell, partially embedded in the housing to be fixed to the housing, and not exposed to the outside of the housing, and a second conductive member electrically connected to the first conductive member and partially exposed to the outside of the housing.
    Type: Application
    Filed: February 11, 2022
    Publication date: August 18, 2022
    Inventors: Byung Jun PARK, Suk Chul KIM, Yong Uk KIM, Yun Hee KIM, Moo Han BAEK, Jong Ho SEOK, Tae Hyun CHANG, Dong Hwa HAN
  • Patent number: 11416408
    Abstract: A memory controller, a memory system including the memory controller and a method for operating the memory system are disclosed. The memory controller updates a reference parameter for a memory area in which at least part of the mapping information is stored and determines whether to activate the memory area based on the reference parameter to effectively execute commands received from a host.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: August 16, 2022
    Assignee: SK hynix Inc.
    Inventor: Byung Jun Kim
  • Patent number: 11403512
    Abstract: Disclosed herein are an apparatus and method for detecting a broadcast signal. The apparatus includes a bootstrap detection unit for detecting whether a bootstrap signal is included in a received broadcast signal based on a preset first bootstrap window and a machine-learning method, a bootstrap offset estimation unit for searching the broadcast signal for the start point of the bootstrap signal using a preset second bootstrap window, estimating a bootstrap offset based on the machine-learning method, and estimating bootstrap symbols from the bootstrap offset, and a demodulation unit for demodulating information included in the broadcast signal from the bootstrap symbols based on the machine-learning method.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: August 2, 2022
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Myung-Sun Baek, Jin-Hyuk Song, Byung-Jun Bae, Dong-Joon Choi
  • Publication number: 20220230675
    Abstract: An electronic device includes a memory controller and a memory device. The memory controller that controls the memory device includes a write buffer to temporarily store write data received from a host, a write timing controller to receive temperature information indicating a temperature of the memory device and generate write timing information based on the temperature information, the write timing information indicating a write timing at which the write data is transferred to and stored in the memory device, and a write operation controller to control the write buffer and the memory device based on the write timing information such that the write data stored in the write buffer is transferred to and stored in the memory device.
    Type: Application
    Filed: April 5, 2022
    Publication date: July 21, 2022
    Inventor: Byung Jun KIM
  • Patent number: 11366733
    Abstract: A method for controlling temperature of a memory system which includes a memory device suitable for storing memory map data including a logical address of an external device and a physical address of a memory device, corresponding to the logical address; and a controller suitable for downloading at least a part of the memory map data and storing and managing the downloaded data as controller map data, and uploading at least a part of the controller map data to the external device, the method comprising: measuring temperature of the memory device; and performing a map downloading for the memory map data from the memory device in response to the measured temperature.
    Type: Grant
    Filed: April 1, 2020
    Date of Patent: June 21, 2022
    Assignee: SK hynix Inc.
    Inventor: Byung-Jun Kim
  • Patent number: 11362043
    Abstract: A memory package includes a package substrate including power wiring and ground wiring. The memory package also includes a memory controller disposed over an upper surface of the package substrate and electrically connected to the power wiring and the ground wiring. The memory package further includes a memory chip disposed over the memory controller and electrically connected to the power wiring and the ground wiring. The memory package additionally includes a band pass filter disposed at one side of the memory controller over the upper surface of the package substrate and including an inductor and a capacitor which are connected in series. The inductor and the capacitor connected in series are electrically connected between the power wiring and the ground wiring.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: June 14, 2022
    Assignee: SK hynix Inc.
    Inventors: Byung Jun Bang, Sun Kyu Kong
  • Patent number: 11358322
    Abstract: To solve the above problems, a pouch molding method according to an embodiment of the present invention includes: a seating step of seating a pouch film on a top surface of a die; a stripper descending step of allowing a stripper disposed above the die to descend; a fixing step of fixing the pouch film using the stripper; a molding preparation step of allowing a Blank holder disposed at a central portion of the die to ascend to contact one surface of the pouch film and allowing a punch disposed at a central portion of the stripper to descend to contact the other surface of the pouch film; and a molding step of allowing the punch and the Blank holder to descend along with each other to form a cup part in the pouch film.
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: June 14, 2022
    Inventors: Sung Hyun Kim, Woo Yong Lee, Kieun Sung, Hyun II Kim, Byung Jun Ahn, Tae Hyun Kim, Sung Gyu Kim
  • Patent number: 11352512
    Abstract: In one embodiment, the present application discloses a surface binding compound of the Formula I or Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound of the Formula I or Formula II.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: June 7, 2022
    Assignee: ENVISTA
    Inventors: Byung Jun Ahn, Bruce H. Lipshutz, Sam L. Nguyen
  • Publication number: 20220167933
    Abstract: The present invention relates to an X-ray imaging apparatus which obtains an X-ray image of a subject placed between a generator and a detector by means of the rotation of the generator and the detector. The X-ray imaging apparatus comprises: the generator and the detector, which are disposed to face each other while having an object to be imaged therebetween, for irradiating and detecting an X-ray; a rotation drive unit for rotating the generator and the detector while having the object to be imaged therebetween; and a bed in which a first portion for supporting the object to be imaged is disposed between the generator and the detector. When the height of at least one from among the generator and the detector is T1, the height of the other is T2, and the height of the first portion is T3, said T1, T2, and T3 are T1>T3>T2.
    Type: Application
    Filed: March 9, 2020
    Publication date: June 2, 2022
    Applicants: Woorien Co., Ltd., VATECH EWOO Holdings Co., Ltd.
    Inventors: Byung Jun AHN, Jiye YANG, Jongbo YOON, Sung-il CHOI
  • Patent number: 11342689
    Abstract: The disclosure relates to an array antenna, and more specifically, the array antenna configured by arranging a plurality of antenna elements at close positions. An array antenna is provided. The array antenna includes a first antenna operating in a first mode, and a second antenna operating in a second mode, wherein a correlation between an electric field of the first mode and an electric field of the second mode falls below a first threshold which is predetermined, or a correlation between a magnetic field of the first mode and a magnetic field of the second mode falls below a second threshold which is predetermined.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: May 24, 2022
    Assignees: Hongik University Industry-Academia Cooperation Foundation, Kookmin University Industry Academy Cooperation Foundation
    Inventors: Tae Heung Lim, Byung-Jun Jang, Hosung Choo