Abstract: A bi-stable soft electromagnetic actuator includes a housing including a frame portion formed of a stretchable elastic body, a stretchable coil portion generating an electromagnetic field by applied power, located in the housing, and having a first surface and a second surface facing in mutually opposite directions, and at least a pair of permanent magnet portions respectively facing the first surface and the second surface of the stretchable coil portion and arranged to maintain a distance by the frame portion.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body, wherein the external electrode includes an electrode layer connected to the internal electrode and including Cu, a first plating portion disposed on the electrode layer, and a second plating portion disposed on the first plating portion, and wherein the first plating portion includes a Ni layer in contact with the electrode layer, and an intermetallic compound layer disposed on the Ni layer and including an intermetallic compound including at least one of Ni and Sn.

Abstract: Provided is a multilayer electronic component according to an example embodiment of the present disclosure including: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a first direction, and including Ni; and an external electrode disposed on the body and connected to the internal electrode, wherein the external electrode includes a base electrode layer including Ni and Pd, and the internal electrode includes a first region, and a content of Pd included in the first region is greater than a content of Pd included in a remaining region, excluding the first region in the internal electrode.

Abstract: A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately positioned while having the dielectric layer interposed therebetween; and an external electrode positioned on the body. The external electrode includes an electrode layer connected to one or more of the internal electrodes and including copper (Cu), a first plating layer positioned on the electrode layer and including nickel (Ni), and a second plating layer positioned on the first plating layer and including nickel (Ni). An oxide including nickel (Ni) is positioned on a boundary surface between the first plating layer and the second plating layer. An average thickness of the first plating layer is smaller than an average thickness of the second plating layer.

Abstract: A multilayer electronic component may include: a body including a dielectric layer and internal electrodes; and external electrodes including an electrode layer disposed on the body and a plating layer disposed on the electrode layer, wherein the plating layer includes an extension extending onto the body to contact the body, and the extension includes one or more grains in which an angle between a surface of the body in contact with the extension and a major axis of the grain is 70 degrees or greater and 110 degrees or less.

Abstract: A multilayer electronic component includes a body including a first external electrode including a first base plating layer disposed on a third surface of the body and connected to the first internal electrode and a first electrode layer disposed on the first base plating layer, and a second external electrode including a second base plating layer disposed on a fourth surface of the body and connected to the second internal electrode and a second electrode layer disposed on the second base plating layer, wherein the first and second electrode layers include conductive metal and glass, and a 30 ?m×5 ?m region selected from a cross-section of the first base plating layer in the first and second directions includes three or more Ni grains having a grain size of 4 ?m or greater.

Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body. The external electrode includes a first electrode layer connected to the internal electrode and including Cu, a second electrode layer partially disposed on the first electrode layer and including Ni, an intermediate layer disposed on the second electrode layer and in a region of the first electrode layer, in which the second electrode layer is not disposed, and including a metal oxide, and a first plating layer disposed on the intermediate layer and including Ni.

Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes and including first and second surfaces, third and fourth surfaces, and fifth and sixth surfaces, a first external electrode including a 1-1-th electrode layer disposed on the third surface, and a 1-2-th electrode layer disposed on the first and second surfaces, a second external electrode including a 2-1-th electrode layer disposed on the fourth surface, and a 2-2-th electrode layer disposed on the first and second surfaces, wherein S1-2>S1-1, T1-2?8 ?m, S2-2>S2-1, and T2-2?8 ?m where based on a cross section of the first and second external electrodes, S1-1, S1-2, S2-1, S2-2 are fractions of an area occupied by glass in the 1-1-th, 1-2-th, 2-1-th, and 2-2-th electrode layers, respectively, T1-2 and T2-2 are thicknesses of the 1-2-th and 2-2-th electrode layers, respectively.

Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers and an internal electrode including a conductive material, and an external electrode disposed on the body and connected to the internal electrode. The internal electrode includes a Sn diffusion portion including Sn in a region connected to the external electrode, and a ratio of an average number of atoms of the Sn compared to an average number of atoms of the conductive material other than the Sn of the internal electrode included in the Sn diffusion portion is 3% or more and 50% or less.

Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes stacked in a first direction with the dielectric layer interposed therebetween and external electrodes including a first electrode layer connected to the internal electrodes and including Ni, and a second electrode layer disposed on the first electrode layer and including an Ni—Cu alloy. A Cu content of the second electrode layer is 70 mol to 90 mol compared to 100 mol of the total content of Ni and Cu of the second electrode layer.

Abstract: A bi-stable soft electromagnetic actuator includes a housing including a frame portion formed of a stretchable elastic body, a stretchable coil portion generating an electromagnetic field by applied power, located in the housing, and having a first surface and a second surface facing in mutually opposite directions, and at least a pair of permanent magnet portions respectively facing the first surface and the second surface of the stretchable coil portion and arranged to maintain a distance by the frame portion.

Abstract: A multi-optic vision device includes a dark-vision lighting apparatus illuminating a defect on a subject and leaving regions that surround the defect dark. A bright-vision lighting apparatus illuminates the subject and the regions that surround the defect and leaving the defect dark. A differential-vision lighting apparatus illuminates the subject so as to stereoscopically show the defect on the subject. An area scan camera continuously imaging the subject as the dark-vision lighting apparatus, the bright-vision lighting apparatus, and the differential-vision lighting apparatus simultaneously and respectively provide light. A controller processes the image to respectively obtain a dark-vision image, a bright-vision image, and a differential-vision image of the subject.

Abstract: A ceramic electronic component includes a ceramic body; internal electrodes disposed in the ceramic body; external electrodes disposed on outer surfaces of the ceramic body and electrically connected to the internal electrodes; and tin plating layers disposed on the external electrodes.

Abstract: A multi-optic vision device includes a dark-vision lighting apparatus illuminating a defect on a subject and leaving regions that surround the defect dark. A bright-vision lighting apparatus illuminates the subject and the regions that surround the defect and leaving the defect dark. A differential-vision lighting apparatus illuminates the subject so as to stereoscopically show the defect on the subject. An area scan camera continuously imaging the subject as the dark-vision lighting apparatus, the bright-vision lighting apparatus, and the differential-vision lighting apparatus simultaneously and respectively provide light. A controller processes the image to respectively obtain a dark-vision image, a bright-vision image, and a differential-vision image of the subject.

Abstract: There is provided a multilayer ceramic electronic component including: a ceramic body in which internal electrodes containing a first electrode material and dielectric layers are alternately disposed; external electrodes provided on outer surfaces of the ceramic body and containing a second electrode material; and diffusion parts each disposed to be connected to one end of the internal electrode and the external electrode and containing the first electrode material and the second electrode material mixed with each other, wherein the diffusion part includes an internal diffusion portion disposed within the ceramic body and an external diffusion portion protruding outside of the ceramic body.

Abstract: A multilayer ceramic electronic component is provided including a ceramic body having dielectric layers and a plurality of internal electrodes disposed in the ceramic body. The internal electrodes have exposed portions exposed to the exterior of the ceramic body. An electrode layer is disposed on an outer surface of the ceramic body electrically connected to the exposed portions of the internal electrodes A conductive resin layer is disposed on the electrode layer. The electrode layer has an uneven surface.

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body having internal electrodes formed therein; external electrodes formed on external surfaces of the ceramic body and connected to the internal electrodes; and buffer layers formed on contact surfaces between the internal electrodes and the external electrodes, among external surfaces of the ceramic body, in an interior direction of the ceramic body, wherein when a thickness of the internal electrode is denoted by Te, a number of laminated internal electrodes is denoted by N, a thickness of the buffer layer is denoted by t, and a width of a margin of the ceramic body in a length direction of the ceramic body is denoted by L, Te?0.6 ?m, N>200, and 3 ?m?t<L, so that the occurrence of radial cracks can be prevented and thus reliability can be improved.

Abstract: There is provided a multilayered chip electronic component including: a ceramic body including internal electrodes and dielectric layers; external electrodes covering both end surfaces of the ceramic body in a length direction; first plating layers forming the external electrodes and formed on outer surfaces of the ceramic body; non-conductive layers formed on outer side surfaces of the first plating layers; and second plating layers formed on regions of the first plating layers except for the non-conductive layers.

Abstract: A ceramic electronic component includes a ceramic body; internal electrodes disposed in the ceramic body; external electrodes disposed on outer surfaces of the ceramic body and electrically connected to the internal electrodes; and tin plating layers disposed on the external electrodes.

Abstract: There is provided a conductive paste composition for an external electrode, the conductive paste composition including a polymer resin, spherical first conductive metal particles included in the polymer resin and being hollow in at least a portion thereof, and second conductive metal particles of a flake shape included in the polymer resin and being hollow in at least a portion thereof.