Abstract: There are provided a multilayer ceramic electronic component, and a method of fabricating the same. The multilayer ceramic electronic component includes: a ceramic main body including a dielectric layer; first and second internal electrodes disposed to face each other within the ceramic main body; and a first external electrode and a second external electrode, wherein the first and second external electrodes include a conductive metal and glass, and when at least one of the first and second external electrodes is divided into three equal parts in a thickness direction, an area of the glass in a central part thereof is 35% to 80% of the total area of the central part. A multilayer ceramic electronic component having improved reliability may be implemented by enhancing chip air-tightness.

Abstract: There is provided a multilayered ceramic electronic component having a reduced thickness and exhibiting hermetic sealing. In multilayered ceramic electronic component, an external electrode includes two layers, that is, first and second layers, and the first and second layers contain glass with different compositions, respectively. Therefore, the multilayered ceramic electronic component having high reliability, such as strong adhesion between the external electrode and the internal electrode, prevention of glass exudation, or the like, may be obtained.

Abstract: There are provided a conductive paste composition for a termination electrode, and a multilayer ceramic capacitor including the same and a manufacturing method thereof. The conductive paste composition includes 100 parts by weight of conductive metal powder and 0.1 to 10 parts by weight of ceramic powder having an average particle size of 50 to 500 nm. The conductive paste composition described above may achieve a high firing density even in the case that it is used in the manufacturing of a thin film, and inhibit the occurrence of blisters, a delamination failure of the termination electrode during calcination of the electrode, thereby producing a compact and thin film.

Abstract: Disclosed herein is an apparatus for forming an electrode on a surface of a ceramic laminate. The apparatus for forming an electrode includes: a blast surface plate having ruggedness to which an electrode material paste is applied; and a moving device moving a ceramic laminate so that the ceramic laminate contacts the blast surface plate.

Abstract: Provided are a multilayer ceramic capacitor and a manufacturing method thereof, which can stably secure capacitance and prevent cracking caused by the diffusion of an electrode material. The multilayer ceramic capacitor includes a capacitor body where an inner electrode including a first electrode material and a dielectric layer are alternately laminated, and an outer electrode disposed on an outer surface of the capacitor body and electrically connected to the inner electrode, the outer electrode including a second electrode material. A diffusion layer having a length exceeding 1 ?m in which the first and second electrode materials are mixed is provided at a region where the inner electrode and the outer electrode are connected to each other.

Abstract: Provided are a conductive paste for an external electrode, a multilayer ceramic capacitor including the same, and a manufacturing method thereof. The conductive paste compound for an external electrode includes a first powder and a second powder. The first powder includes copper and has a mean grain size of 3 ?m or less, and the second powder has a lower diffusion speed and a higher melting point than the copper and has a mean grain size of 180 nm or less.