Patents by Inventor Byung Jun

Byung Jun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230218209
    Abstract: An apparatus for analyzing an in vivo component is provided. The apparatus for analyzing an in vivo component may include an impedance sensor including a first electrode and a second electrode configured to contact a fluid channel of a fluid to be analyzed. The apparatus may include an impedance measurement device configured to apply a current to the first electrode and the second electrode, measure a voltage between the first electrode and the second electrode based on applying the current, and measure an impedance of the fluid based on the measured voltage. The apparatus may include a processor configured to model the measured impedance using an equivalent circuit; and analyze the in vivo component based on modeling the measured impedance using the equivalent circuit.
    Type: Application
    Filed: March 8, 2023
    Publication date: July 13, 2023
    Applicants: SAMSUNG ELECTRONICS CO., LTD., GWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Sung YANG, Kun Sun Eom, Myoung Hoon Jung, Byung Jun Kim, Alexander Zhbanov, Seung Yeob Lee, Ye Sung Lee
  • Publication number: 20230198380
    Abstract: A device for protecting a converter and a control method thereof, the device including: a voltage detection unit that detects at least one of an input-stage voltage and an output-stage voltage of a converter; a switching device that connects an output stage of the converter and a load connected to the output stage, or blocks a connection; a controller that determines whether the detected input-stage voltage or output-stage voltage is out of a preset voltage range, and, when the voltage is out of the range, controls the switching device to cut off the connection between the output stage of the converter and the load; and a driving unit that controls an operation of at least one of the fuel cell and the battery so that a driving force of the vehicle is not generated by the fuel cell and the battery when the connection is cut off.
    Type: Application
    Filed: November 14, 2022
    Publication date: June 22, 2023
    Inventor: Byung Jun Sung
  • Publication number: 20230197687
    Abstract: A semiconductor package includes a substrate including a first bonding pad and a first conductive pattern positioned at the same level and in contact with the first bonding pad; a lower semiconductor chip and an upper semiconductor chip stacked over the substrate, the lower and upper semiconductor chips respectively including a first lower chip pad and a first upper chip pad; a first lower bonding wire with first and second ends respectively connected to the first bonding pad and the first lower chip pad; and a first upper bonding wire with a first end connected to the first bonding pad and a second end connected to the first upper chip pad, the first end of the first upper bonding wire is located farther from the lower and upper semiconductor chips and closer to the first conductive pattern than the first end of the first lower bonding wire.
    Type: Application
    Filed: February 10, 2023
    Publication date: June 22, 2023
    Applicant: SK hynix Inc.
    Inventors: Byung Jun BANG, Ju Il EOM
  • Publication number: 20230178770
    Abstract: Disclosed is a power control system and method of a fuel cell including a fuel cell that generates electricity; a load device that is electrically connected to the fuel cell; a DC/DC converter that is disposed between the fuel cell and the load device, and converts power between a low side of the DC/DC converter electrically connected to the fuel cell and a high side of the DC/DC converter electrically connected to the load device; a battery that is electrically connected to the high side of the DC/DC converter in parallel with the load device; and a controller that monitors a voltage of the high side of the DC/DC converter or a voltage of the low side of the DC/DC converter, and controls output power of the fuel cell or power consumption of the load device based on the monitored voltage of the high side or the monitored voltage of the low side.
    Type: Application
    Filed: July 20, 2022
    Publication date: June 8, 2023
    Inventor: Byung Jun Sung
  • Patent number: 11670871
    Abstract: An array antenna is proved. The array antenna provides multi-polarization by arranging multiple ports at adjacent positions. Specifically, the array antenna includes a first substrate having a first thickness and a rectangular shape, a second substrate disposed to be in contact with the bottom surface of the first substrate and having a second thickness and a rectangular shape, a ground surface shared by the first substrate and the second substrate, and first ports and second ports disposed to penetrate the ground surface.
    Type: Grant
    Filed: September 3, 2021
    Date of Patent: June 6, 2023
    Assignees: Hongik University Iudustry—Academia Cooperation Foundation, Kookmin University industry Academy Cooperation Foundation
    Inventors: Tae Heung Lim, Byung-Jun Jang, Hosung Choo
  • Publication number: 20230136229
    Abstract: According to an embodiment of the present technology, a storage device may include a memory device including a secure storage area for storing therein data to be accessed according to authentication; an access mode memory configured to store therein information of device access mode regarding an operation mode for the secure storage area; and a memory controller configured to receive a command regarding the secure storage area from an external host and process the command according to whether information of host access mode included in the command matches the information of the device access mode.
    Type: Application
    Filed: September 12, 2022
    Publication date: May 4, 2023
    Inventors: Hui Won LEE, Byung Jun KIM, Taek Gyu LEE, Young Kyu JEON
  • Publication number: 20230134534
    Abstract: A memory controller to control a memory device including a secure storage area may include a host interface configured to receive a command from a host, the command including information for authentication requesting access to the secure storage area; a processor configured to generate a device authentication code based on the information for the authentication; and a memory interface configured to access the secure storage area under control of the processor, and the processor may perform at least a portion of an operation of the device authentication code while the host interface or the memory interface receives data, following the command.
    Type: Application
    Filed: November 3, 2022
    Publication date: May 4, 2023
    Inventors: Hui Won LEE, Byung Jun KIM, Taek Gyu LEE, Young Kyu JEON
  • Patent number: 11638736
    Abstract: Provided herein are compositions for treating a disorder or a disease associated with or characterized by neuro-inflammation, neuro-apoptosis, or neuro-oxidative damage in a subject, pharmaceutical compositions comprising the compositions and pharmaceutically acceptable excipients, and nutraceutical compositions comprising the compositions and nutraceutically acceptable excipients. Provided also herein are methods of treating a disorder or a disease associated with or characterized by neuro-inflammation, neuro-apoptosis, or neuro-oxidative damage in a subject in need thereof, methods of reducing, alleviating, or delaying a sign or a symptom of a disorder characterized by neuro-inflammation, neuro-apoptosis, or neuro-oxidative damage in a subject in need thereof, and methods of regulating inflammation, antioxidant enzymes, and apoptosis in a subject having a disorder or a disease associated with or characterized by neuro-inflammation, neuro-apoptosis, or neuro-oxidative damage.
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: May 2, 2023
    Inventor: Byung-Jun Park
  • Patent number: 11633132
    Abstract: An apparatus for analyzing an in vivo component is provided. The apparatus for analyzing an in vivo component may include an impedance sensor including a first electrode and a second electrode configured to contact a fluid channel of a fluid to be analyzed. The apparatus may include an impedance measurement device configured to apply a current to the first electrode and the second electrode, measure a voltage between the first electrode and the second electrode based on applying the current, and measure an impedance of the fluid based on the measured voltage. The apparatus may include a processor configured to model the measured impedance using an equivalent circuit; and analyze the in vivo component based on modeling the measured impedance using the equivalent circuit.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: April 25, 2023
    Assignees: SAMSUNG ELECTRONICS CO., LTD., GWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Sung Yang, Kun Sun Eom, Myoung Hoon Jung, Byung Jun Kim, Alexander Zhbanov, Seung Yeob Lee, Ye Sung Lee
  • Publication number: 20230112086
    Abstract: In one embodiment, the present application discloses a photo-cleavable surface binding compound of the Formula I and Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound.
    Type: Application
    Filed: July 15, 2022
    Publication date: April 13, 2023
    Inventors: Byung Jun Ahn, Bruce H. Lipshutz, Sam L. Nguyen, Roscoe Linstadt
  • Patent number: 11623643
    Abstract: An apparatus and method for controlling articulation of an articulated vehicle may prevent jackknifing of the articulated vehicle driven backwards. The apparatus includes a hitch angle calculator configured to calculate a desired hitch angle based on a steering angle and a speed of the articulated vehicle, an error calculator configured to calculate an error between the desired hitch angle and an actual hitch angle of the articulated vehicle, a moment generator configured to generate a moment for controlling the articulation of the articulated vehicle based on the error, and an articulation controller configured to control the articulation of the articulated vehicle based on the moment.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: April 11, 2023
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventor: Byung Jun Sung
  • Publication number: 20230103027
    Abstract: In one embodiment, the present application discloses a surface binding compound of the Formula I or Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound of the Formula I or Formula II.
    Type: Application
    Filed: May 10, 2022
    Publication date: March 30, 2023
    Applicant: Envista
    Inventors: Byung Jun Ahn, Bruce H. Lipshutz, Sam L. Nguyen
  • Publication number: 20230096111
    Abstract: According to an embodiment of the present technology, a storage device may include a main memory device, a buffer memory device including a plurality of areas and operating as a buffer of the main memory device, and a memory controller configured to change one or more of respective uses of the plurality of areas in response to a preparation command indicating that one or more read commands for requesting data stored in the main memory device are to be provided, which is received from an external host.
    Type: Application
    Filed: June 21, 2022
    Publication date: March 30, 2023
    Inventor: Byung Jun Kim
  • Publication number: 20230080296
    Abstract: Disclosed are a system and a method for limiting the maximum acceleration of a motor driven vehicle. The system and method can estimate an acceleration from a speed of a motor driven vehicle, and limit the maximum acceleration of the motor driven vehicle to a level to exert constant traveling performance regardless of the total weight of the vehicle and road gradient conditions using the estimated acceleration as a control variable for limiting the maximum acceleration, thereby improving the ride comfort and the fuel efficiency.
    Type: Application
    Filed: September 15, 2022
    Publication date: March 16, 2023
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Chang Eun Na, Hyun Seok Jang, Byung Jun Sung, Seung Ho Choi
  • Patent number: 11604950
    Abstract: The present disclosure relates to a method and an apparatus for classifying data points using convex hulls based on centroids of clusters, and a method for classifying data points according to one embodiment of the present disclosure comprises clustering data points into a plurality of clusters; constructing a hyperplane by using a set of centroids of singular clusters having a single class label from the plurality of clusters and removing singular clusters whose centroids are not used to construct the hyperplane; generating a convex hull for a singular cluster used to construct the hyperplane; removing internal data points except for the vertices of the generated convex hull from the singular cluster whose centroid is used to construct the hyperplane; and classifying a set of remaining data points except for the removed internal data points among the plurality of clusters.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: March 14, 2023
    Assignee: Research & Business Foundation Sungkyunkwan University
    Inventors: Hee Yong Youn, Byung Jun Lee, Kyung Tae Kim, Pardis Birzhandi, Min Woo Kim, Tae Ho Lee
  • Patent number: 11605615
    Abstract: A semiconductor package includes: a substrate including a first bonding pad and a first conductive pattern positioned at the same level and in contact with the first bonding pad; a lower semiconductor chip and an upper semiconductor chip stacked over the substrate, the lower and upper semiconductor chips respectively including a first lower chip pad and a first upper chip pad; a first lower bonding wire with first and second ends respectively connected to the first bonding pad and the first lower chip pad; and a first upper bonding wire with a first end connected to the first bonding pad and a second end connected to the first upper chip pad, the first end of the first upper bonding wire is located farther from the lower and upper semiconductor chips and closer to the first conductive pattern than the first end of the first lower bonding wire.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: March 14, 2023
    Assignee: SK hynix Inc.
    Inventors: Byung Jun Bang, Ju Il Eom
  • Publication number: 20230069562
    Abstract: A bi-stable soft electromagnetic actuator includes a housing including a frame portion formed of a stretchable elastic body, a stretchable coil portion generating an electromagnetic field by applied power, located in the housing, and having a first surface and a second surface facing in mutually opposite directions, and at least a pair of permanent magnet portions respectively facing the first surface and the second surface of the stretchable coil portion and arranged to maintain a distance by the frame portion.
    Type: Application
    Filed: August 26, 2022
    Publication date: March 2, 2023
    Inventors: Yong Lae PARK, Gyo Wook SHIN, Yeongjin CHOI, Byung Jun JEON, Inrak CHOI
  • Publication number: 20230065857
    Abstract: A battery module includes a battery assembly including a plurality of sub-packing units, the plurality of sub-packing units respectively including a cell housing, at least one battery cell accommodated in an internal space of the cell housing, and at least one vent hole disposed in the cell housing and connecting the internal space to an outside of the cell housing, and a flame blocking structure coupled to the battery assembly, and including an inlet hole connected to the vent hole, an inner chamber communicating with the inlet hole, an outlet hole communicating with the inner chamber and the outside, and at least one partition wall protruding into the inner chamber.
    Type: Application
    Filed: August 18, 2022
    Publication date: March 2, 2023
    Inventors: Byung Jun PARK, Tae Hyun CHANG
  • Publication number: 20230057434
    Abstract: An array antenna is proved. The array antenna provides multi-polarization by arranging multiple ports at adjacent positions. Specifically, the array antenna includes a first substrate having a first thickness and a rectangular shape, a second substrate disposed to be in contact with the bottom surface of the first substrate and having a second thickness and a rectangular shape, a ground surface shared by the first substrate and the second substrate, and first ports and second ports disposed to penetrate the ground surface.
    Type: Application
    Filed: September 3, 2021
    Publication date: February 23, 2023
    Inventors: Tae Heung LIM, Byung-Jun JANG, Hosung CHOO
  • Publication number: 20230058485
    Abstract: A semiconductor package includes a second semiconductor die stacked on a first semiconductor die. The first semiconductor die includes a first contact pad connected to a first integrated circuit, and includes a second contact pad connected to a third contact pad by a first interconnection line. The second semiconductor die includes a fourth contact pad connected to the third contact pad and connected to a second integrated circuit. A first bonding wire is connected to the first contact pad, and a second bonding wire is connected to the second contact pad.
    Type: Application
    Filed: February 14, 2022
    Publication date: February 23, 2023
    Applicant: SK hynix Inc.
    Inventors: Ha Gyeong SONG, Byung Jun BANG