Patents by Inventor Byung Jun

Byung Jun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11584381
    Abstract: Disclosed are an apparatus and method for controlling articulation of an articulated vehicle. The apparatus includes a yaw rate calculator configured to calculate a desired yaw rate based on a steering angle and a speed of the articulated vehicle, a first moment generator configured to generate a yaw rate control moment based on the desired yaw rate and an actual yaw rate of the articulated vehicle, a second moment generator configured to generate a hitch damping control moment based on a hitch angular velocity of the articulated vehicle, an adder configured to output a final moment for controlling the articulation of the articulated vehicle by adding the yaw rate control moment and the hitch damping control moment, and an articulation controller configured to control the articulation of the articulated vehicle based on the final moment.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: February 21, 2023
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventor: Byung Jun Sung
  • Patent number: 11578718
    Abstract: An apparatus for reducing noise of a gear pump through uneven pitch-simulated control includes a calculation unit to calculate different control current values for each tooth of a teeth order by applying a teeth number, the teeth order, and a teeth angle of the gear pump in which a plurality of teeth are evenly formed, a storage unit to map and store the teeth order and the different control current values corresponding to the teeth order for each tooth, and a current controller to variably generate the control current value mapped corresponding to the teeth order when each tooth reaches a reference position when the gear pump rotates by a motor, wherein the control current value is added to a reference current value of a motor control signal and applied to the motor.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: February 14, 2023
    Assignees: Hyundai Motor Company, Kia Corporation, Myunghwa Ind. Co., Ltd.
    Inventors: Sung Wook Jang, Dong Kuk Han, MinSu Kim, Chin Chul Choi, Byung Jun Hwang, Hyung Suk Kim
  • Patent number: 11572269
    Abstract: A semiconductor package using a polymer substrate is disclosed and may include a polymer cavity structure comprising first metal traces, a micro-electro mechanical systems (MEMS) device and a semiconductor die bonded to a first surface within a cavity of the cavity structure, and a substrate coupled to the cavity structure and comprising second metal traces coupled to the first metal traces. The substrate may enclose the MEMS device and the semiconductor die. Ground traces may be on external surfaces of the polymer cavity structure. Ball lands may be on a surface of the substrate opposite to a surface with the second metal traces. The first metal traces may extend from the first surface of the polymer cavity structure up a sidewall of the cavity and to conductive patterns on a top surface of the polymer cavity structure.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: February 7, 2023
    Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
    Inventors: Yung Woo Lee, Byung Jun Kim, Dong Hyun Bang, EunNaRa Cho, Adrian Arcedera, Jae Ung Lee
  • Publication number: 20230033625
    Abstract: A battery rack includes: a housing; a module unit provided in the housing, including a plurality of battery cells, and having at least one vent hole; and a cooling unit provided to face the vent hole in the housing, and including a cooling line in which a coolant is provided, wherein the cooling line is provided so that at least a portion of an outer periphery thereof is melted by heat generated from the module unit to supply the coolant toward the vent hole.
    Type: Application
    Filed: June 20, 2022
    Publication date: February 2, 2023
    Inventors: Yun Hee KIM, Tae Hyun Chang, Suk Chul Kim, Yong Uk Kim, Byung Jun Park, Jong Ho Seok, Dong Hwa Han
  • Publication number: 20230026323
    Abstract: According to an embodiment of the present disclosure, a storage device may include a memory device, and a memory controller configured to receive a read command from an external host and control the memory device according to the read command, wherein the read command may include a basic header segment commonly included in commands transferred between the external host and the memory controller and including information indicating that the read command is a command for requesting data stored in the memory device, a transaction specific field including information indicating that the read command is a read command for at least two or more logical addresses, and an extra header segment including information on the at least two or more logical addresses.
    Type: Application
    Filed: June 14, 2022
    Publication date: January 26, 2023
    Inventors: Byung Jun KIM, Jea Young Zhang, Young Kyu Jeon, Kyoung Ku Cho
  • Patent number: 11527828
    Abstract: The disclosure relates to an array antenna, and specifically, relates to an array antenna which improves performance by using a shorting pin. The array antenna includes a first antenna, a second antenna, the first antenna and the second antenna sharing a ground, and a substrate disposed on an upper portion of the ground, and the second antenna is disposed in contact with an upper portion of the substrate, the first antenna is disposed by penetrating through centers of the substrate and the second antenna, the array antenna includes a plurality of feeding pins disposed by penetrating through the second antenna, the substrate, and the ground, and the array antenna includes a plurality of shorting pins penetrating through the second antenna, the substrate, and the ground to be symmetric with the plurality of feeding pins.
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: December 13, 2022
    Assignees: Hongik University Industry-Academia Cooperation Foundation, Kookmin University Industry Academy Cooperation Foundation
    Inventors: Tae Heung Lim, Byung-Jun Jang, Hosung Choo
  • Publication number: 20220389140
    Abstract: Provided are an ethylene-propylene-diene monomer (EPDM) copolymer and a method of preparing the same. An EPDM copolymer which has more improved miscibility with inorganic fillers such as carbon black, may further facilitate dispersibility in mixing to further decrease the viscosity of a compound composition, and may provide a compound composition having excellent processability and mechanical properties. A method of preparing the same is also provided.
    Type: Application
    Filed: May 26, 2022
    Publication date: December 8, 2022
    Inventors: Byoung Tak Yim, Byung Jun Kim, Jeong Hwan Kim
  • Patent number: 11520519
    Abstract: Provided herein may be a storage device and a method of operating the same. A memory controller may include a command processor configured to generate a flush command in response to a flush request and determine flush data chunks to be stored, a write operation controller configured to control memory devices to perform a first program operation of storing flush data chunks, and to perform a second program operation of storing data corresponding to a write request that is input later than the flush request, regardless of whether a response to the flush command has been provided to a host, and a flush response controller configured to, when the first program operation is completed, provide a response to the flush command to the host depending on whether responses to flush commands, input earlier than the flush command, have been provided to the host.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: December 6, 2022
    Assignee: SK hynix Inc.
    Inventors: Byung Jun Kim, Eu Joon Byun, Hye Mi Kang
  • Publication number: 20220384890
    Abstract: An energy storage system includes: stacked battery modules; and a rack accommodating the battery modules. The rack includes a sidewall disposed on one side of the battery modules, and the sidewall includes a fire-resistant member opposing the battery modules.
    Type: Application
    Filed: May 4, 2022
    Publication date: December 1, 2022
    Inventors: Jong Ho SEOK, Suk Chul KIM, Yong Uk KIM, Yun Hee KIM, Byung Jun PARK, Tae Hyun CHANG, Dong Hwa HAN
  • Publication number: 20220384957
    Abstract: The disclosure relates to an array antenna, and specifically, relates to an array antenna which improves performance by using a shorting pin. The array antenna includes a first antenna, a second antenna, the first antenna and the second antenna sharing a ground, and a substrate disposed on an upper portion of the ground, and the second antenna is disposed in contact with an upper portion of the substrate, the first antenna is disposed by penetrating through centers of the substrate and the second antenna, the array antenna includes a plurality of feeding pins disposed by penetrating through the second antenna, the substrate, and the ground, and the array antenna includes a plurality of shorting pins penetrating through the second antenna, the substrate, and the ground to be symmetric with the plurality of feeding pins.
    Type: Application
    Filed: July 28, 2021
    Publication date: December 1, 2022
    Inventors: Tae Heung LIM, Byung-Jun JANG, Hosung CHOO
  • Publication number: 20220349073
    Abstract: An electrochemical electrode according to the present invention may prevent agglomeration and desorption of a catalyst even when a catalyst in a particle form is used, because a protective layer containing hydrogel is used, such that stability may be secured, thereby implementing an electrode having a long duration.
    Type: Application
    Filed: April 29, 2022
    Publication date: November 3, 2022
    Inventors: Joo Ho MOON, Hyung suk LEE, Byung Jun KANG, Jei Wan TAN, Don Yeong KANG, Kyung Min KIM
  • Publication number: 20220341787
    Abstract: A high-sensitive contactless chromaticity measuring device according to the present invention, includes: a lens unit to receive light emitted from a measurement object; a light distribution unit including an optical fiber to receive the light passing through the lens unit and distribute the received light through n paths to output the light to the other side, wherein a numerical aperture is greater than a predetermined reference value, a condensing lens to reduce an incidence angle of the light output to the other side of the optical fiber to a target angle or more, and n color filters to transmit different wavelengths of the light passing through the condensing lens; and a signal conversion unit including a photodiode to convert the light transmitted from the light distribution unit into an electrical signal.
    Type: Application
    Filed: November 12, 2020
    Publication date: October 27, 2022
    Applicant: ANI. Co. Ltd
    Inventors: Byung Jun OH, Kyu Ho LEE, Kyu Seok KIM, Hyun Ho LEE, Ki Beom NA, Sung Hyuk YOON
  • Publication number: 20220336927
    Abstract: A battery module is proposed. The battery module includes a plurality of battery sub-modules, and a front cover part configured to cover an outermost stacking surface of the plurality of stacked battery sub-modules. The front cover part includes a front plate including a contact terminal electrically connected to an outside, a bus bar electrically connecting the plurality of battery sub-modules to each other, and a disconnection induction bus bar coupled to an inside end of the contact terminal to press and contact the bus bar, and a switching slider configured to slide between the bus bar and the disconnection induction bus bar.
    Type: Application
    Filed: April 19, 2022
    Publication date: October 20, 2022
    Inventors: Yong Uk KIM, Byung Jun PARK, Suk Chul KIM, Yun Hee KIM, Jong Ho SEOK, Tae Hyun CHANG, Dong Hwa HAN
  • Publication number: 20220336420
    Abstract: A semiconductor package includes: a substrate including a first bonding pad and a first conductive pattern positioned at the same level and in contact with the first bonding pad; a lower semiconductor chip and an upper semiconductor chip stacked over the substrate, the lower and upper semiconductor chips respectively including a first lower chip pad and a first upper chip pad; a first lower bonding wire with first and second ends respectively connected to the first bonding pad and the first lower chip pad; and a first upper bonding wire with a first end connected to the first bonding pad and a second end connected to the first upper chip pad, the first end of the first upper bonding wire is located farther from the lower and upper semiconductor chips and closer to the first conductive pattern than the first end of the first lower bonding wire.
    Type: Application
    Filed: August 10, 2021
    Publication date: October 20, 2022
    Applicant: SK hynix Inc.
    Inventors: Byung Jun BANG, Ju Il EOM
  • Patent number: 11453790
    Abstract: In one embodiment, the present application discloses a photo-cleavable surface binding compound of the Formula I and Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: September 27, 2022
    Assignee: ENVISTA
    Inventors: Byung Jun Ahn, Bruce H. Lipshutz, Sam L. Nguyen, Roscoe Linstadt
  • Patent number: 11430824
    Abstract: An integrated circuit (IC) device includes a first substrate and a first structure on a front surface of the first substrate. The first structure includes a first interlayer insulating layer structure including a plurality of first conductive pad layers spaced apart from one another at different levels of the first interlayer insulating layer structure. The IC device includes a second substrate on the first substrate and a second structure on a front surface of the second substrate, which faces the front surface of the first substrate. The second structure includes a second interlayer insulating layer structure bonded to the first interlayer insulating layer structure. A through-silicon via (TSV) structure penetrates the second substrate and the second interlayer insulating layer structure. The TSV structure is in contact with at least two first conductive pad layers of the plurality of first conductive pad layers located at different levels.
    Type: Grant
    Filed: April 3, 2020
    Date of Patent: August 30, 2022
    Inventors: Sun-hyun Kim, Sang-il Jung, Byung-jun Park
  • Patent number: 11431400
    Abstract: A 5th generation (5G) or pre-5G communication system for supporting a data transmission rate higher than that of a 4th generation (4G) communication system, such as long term evolution (LTE) is provided. The wireless communication system, includes a plurality of antennas for identifying a plurality of radio signal, a receiver for receiving the plurality of the radio signals via the plurality of the antennas, wherein the receiver may include a coupler circuit for coupling the plurality of the received signals to different signal paths, to generate a first coupling signal by summing the plurality of the received signals and a second coupling signal corresponding to a difference of the plurality of the received signals, and a beam generator for generating a plurality of beamformed signals based on in-phase signals and quadrature-phase signals corresponding to the first coupling signal and the second coupling signal.
    Type: Grant
    Filed: October 6, 2020
    Date of Patent: August 30, 2022
    Assignee: Kookmin University Industry Academy Cooperation Foundation
    Inventor: Byung-Jun Jang
  • Patent number: 11431404
    Abstract: A wireless communication system, an apparatus and a method for integrating communication and sensing functions in the wireless communication system are provided. The communication device includes a communication unit for bi-directional communication, and a radar unit for sensing. The communication unit and the radar unit may commonly include a common transmit chain which generates a transmit signal. The transmit signal may have a first polarization. The communication unit may include a communication receive chain, and if a receive signal has the first polarization in response to the transmit signal, the communication receive chain may receive the receive signal having the first polarization via the hybrid coupler and perform communication and if the receive signal corresponding to the transmit signal has second polarization different from the first polarization, a sensing receive chain of the radar unit may receive the receive signal having the second polarization perform sensing by the radar unit.
    Type: Grant
    Filed: July 23, 2021
    Date of Patent: August 30, 2022
    Assignee: Kookmin University Industry Academy Cooperation Foundation
    Inventor: Byung-Jun Jang
  • Publication number: 20220271372
    Abstract: A battery module includes a battery sub-module including a cell support member, at least one battery cell accommodated in the cell support member, and a case provided to partially surround the at least one battery cell, and a first barrier disposed on a first side of the battery sub-module, wherein the at least one battery cell is enclosed and sealed by the cell support member and the case, and the first barrier includes a first protrusion configured to press a part of the case inwardly of the battery sub-module
    Type: Application
    Filed: February 9, 2022
    Publication date: August 25, 2022
    Inventors: Suk Chul KIM, Yong Uk KIM, Yun Hee KIM, Byung Jun PARK, Jong Ho SEOK, Tae Hyun CHANG, Dong Hwa HAN
  • Patent number: 11422942
    Abstract: A memory system includes a memory device configured to store a piece of data in a location which is distinguished by a physical address and a controller configured to generate a piece of map data associating a logical address, inputted along with a request from an external device, with the physical address and to transfer a response including the piece of map data to the external device.
    Type: Grant
    Filed: April 2, 2020
    Date of Patent: August 23, 2022
    Assignee: SK hynix Inc.
    Inventors: Eu-Joon Byun, Jong-Hwan Lee, Byung-Jun Kim