Abstract: A substrate treatment apparatus according to an aspect of the present invention includes: a support plate that supports a substrate and is provided with a heater member for heating the substrate; and a cooling unit for forcedly cooling the support plate, wherein the cooling unit includes: a cooling housing to provide a cooling space; a plurality of gas feed nozzles that is arranged in the cooling housing and supplies cooling gas toward the heater member; and a plurality of gas feed lines that is directly connected to the gas feed nozzles and supplies the cooling gas transferred from the outside to the gas feed nozzles.

Abstract: Provided are a hole transport material composite including a lead-free perovskite (Cs2SnI6), a liquid ionic conductor and a solvent that is a solid at a room temperature, a solar cell, and a method of manufacturing the lead-free perovskite-based hole transport material composite.

Abstract: Provided are a hole transport material composite including a lead-free perovskite (Cs2SnI6), a liquid ionic conductor and a solvent that is a solid at a room temperature, a solar cell, and a method of manufacturing the lead-free perovskite-based hole transport material composite.

Abstract: A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.

Abstract: A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.

Abstract: The present invention relates to a solar cell module comprising: a transparent plate; a support plate positioned to face the transparent plate; at least one unit cell disposed between the transparent plate and the support plate; a first filler disposed between the transparent plate and the unit cell; a second filler disposed between the support plate and the unit cell; and a reflective layer which is disposed between the second filler and the support plate, and which reflects sunlight that has passed through the transparent plate on the unit cell, wherein the length of the reflective layer is shorter than the length of the second filler and the second filler directly comes in contact with the support plate. According to this configuration, the amount of sunlight irradiated on the unit cell can be increased, thereby enhancing generating efficiency and improving the durability of the solar cell module.

Abstract: A lighting device is provided. The lighting device includes: a light source module mounted on a substrate; a lens unit provided on the light source module and including an accommodating groove accommodating the light source module; a housing unit accommodating the lens unit therein to protect the lens unit from an outside; a supporting unit fixed to the substrate and including a coupling hole having the housing unit coupled thereto to thereby support the housing unit; and a height adjustment unit allowing the housing unit to be vertically-movably coupled to the supporting unit and adjusting a height of the lens unit such that the height of the lens unit is varied.

Abstract: A lighting device is provided. The lighting device includes: a light source module mounted on a substrate; a lens unit provided on the light source module and including an accommodating groove accommodating the light source module; a housing unit accommodating the lens unit therein to protect the lens unit from an outside; a supporting unit fixed to the substrate and including a coupling hole having the housing unit coupled thereto to thereby support the housing unit; and a height adjustment unit allowing the housing unit to be vertically-movably coupled to the supporting unit and adjusting a height of the lens unit such that the height of the lens unit is varied.

Abstract: Disclosed herein is an auxiliary advertisement device (100, 200). The auxiliary advertisement device include a frame (110, 210) secured to a newspaper, a free newspaper, an outer cover of a book, such as a phone book, a paper bag, a cardboard box, or a writing instrument, such as a ball-point pen, and an auxiliary advertisement sheet (230) that contains auxiliary advertisement contents and is continuously unwound from the frame (110, 210) and wound in the frame (110, 210) in the form of a roll, thus overcoming space limitations of the advertising object, and arousing the curiosity of consumers, therefore maximizing the advertising effect.

Abstract: A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.

Abstract: A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.

Abstract: A semiconductor module and a method of manufacturing a semiconductor module including at least one chip package, at least one module board, at least one conductive element provided between the first chip package and the module board and a protector for applying pressure to the conductive element, the module board, and the first chip package and/or acting as a heat sink for the first chip package.

Abstract: A method and arrangement for attaching labels to a plurality of semiconductor modules arranged on a double-sided substrate is described which may shorten a process stream in an effort to reduce equipment costs. An exemplary arrangement may include at least one label attaching unit configured to attach labels to a plurality of semiconductor modules mounted on one of a first surface and a second surface of the double-sided substrate, and may include at least one turner configured to turn over the double-sided substrate to expose one of the first surface and second surface to the label attaching unit.

Abstract: Provided an LED package comprising a first package composed of a first region serving as a first electrode and a second region which is formed so as to overlap a portion of the first region, the second region defining a molding material filling cavity; one or more LED chips mounted on the first region of the first package; a second package formed under the second region of the first package, the second package being insulated by the first region and an insulating member so as to serve as a second electrode; conductive wire for electrically connecting the LED chips and the second package; and a molding material filled inside the second region of the first package so as to protect the LED chips and the conductive wire. The first and second packages are formed of aluminum.

Abstract: In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the board. Furthermore, at least one supporting solder bump is formed on one of the dummy pads and disposed under a portion of the semiconductor chip package. For example, the supporting solder bump may be disposed under a peripheral area of the semiconductor chip package.

Abstract: In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the board. Furthermore, at least one supporting solder bump is formed on one of the dummy pads and disposed under a portion of the semiconductor chip package. For example, the supporting solder bump may be disposed under a peripheral area of the semiconductor chip package.

Abstract: In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the board. Furthermore, at least one supporting solder bump is formed on one of the dummy pads and disposed under a portion of the semiconductor chip package. For example, the supporting solder bump may be disposed under a peripheral area of the semiconductor chip package.

Abstract: A printed circuit board that can be connected with a pin connector and a method of manufacturing the printed circuit board are provided. Solidified solder can be formed on the tap unit without the need for additional processes, by applying solder printing to the tap unit at the same time it is applied to pads of the printed circuit board and, for example, by performing high temperature reflow. In addition, reliability and reduction in cost of a pin connector can be ensured without using a pin connector into which a high-priced wired solder is inserted. Rather a general pin connector can be used because the pin connector and the tap unit are connected to each other through the solidified solder formed on the tap unit.

Abstract: A semiconductor device and a method of fabricating the same may be provided. The semiconductor device may include an insulation material as a base frame of a PCB, including an opening penetrating the insulation material with sidewalls plated with a gold (Au) layer. The semiconductor device may further include a printed circuit board for use in a module, having a pad whose surface may be coated with an organic solderability preservative (OSP) and an opening whose sidewalls may be plated with a nickel (Ni) layer and a gold (Au) layer, and a semiconductor device mounted on the PCB via the pad. During a temperature cycling reliability test on the semiconductor device, no defects, for example, cracks may form inside the opening.

Abstract: Disclosed is a one-step permanent cosmetic composition that comprises 1.0 to 5.5 wt. % of a reducing agent; 0.1 to 9.5 wt. % of an alkaline agent; 0.1 to 7.0 wt. % of a catalyst; 1.0 to 15.0 wt. % of an alcohol; and distilled water or ion exchange water for the residual percentage by weight, using a solvent having an alkalinity (representing a consumption of 0.01 N HCl for 1 mL of a test sample) of 1.0 to 4.6 and having a pH value of less than 9.6; and also a one-step permanent cosmetic composition that comprises 1.0 to 5.5 wt. % of a reducing agent; 0.1 to 9.5 wt. % of an alkaline agent; 0.1 to 7.0 wt. % of a catalyst; 1.0 to 15.0 wt. % of an alcohol and additionally 1.0 to 4.5 wt. % of a viscosity enhancing agent; and distilled water or ion exchange water for the residual percentage by weight, using a solvent having an alkalinity (representing a consumption of 0.01 N HCl for 1 mL of a test sample) of 1.0 to 4.6 and having a pH value of less than 9.6.