Patents by Inventor Byung-Taek Kim

Byung-Taek Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7026740
    Abstract: Disclosed is a motor stator assembly comprising: a plurality of yokes manufactured by laminating a plurality of steel sheets having a predetermined length; and a plurality of poles engaged between the yokes and formed by molding magnetic material in a mold, on which coil is wound. In the assembly, material loss can be reduced at the time of blanking operation, and additional protector is not required. According to this, a winding radius of coil is reduced thus to reduce coil amount on the basis of a constant number of times of winding. Also, by using magnetic powder material and silicon steel, productivity is enhanced and motor efficiency is enhanced.
    Type: Grant
    Filed: July 14, 2003
    Date of Patent: April 11, 2006
    Assignee: LG Electronics Inc.
    Inventors: Jin-Soo Park, Byung-Taek Kim
  • Patent number: 6952065
    Abstract: Disclosed is a motor stator assembly comprising: a plurality of yokes manufactured by laminating a plurality of steel sheets having a predetermined length; and a plurality of poles engaged between the yokes and formed by molding magnetic material in a mold, on which coil is wound. In the assembly, material loss can be reduced at the time of blanking operation, and additional protector is not required. According to this, a winding radius of coil is reduced thus to reduce coil amount on the basis of a constant number of times of winding. Also, by using magnetic powder material and silicon steel, productivity is enhanced and motor efficiency is enhanced.
    Type: Grant
    Filed: July 8, 2003
    Date of Patent: October 4, 2005
    Assignee: LG Electronics Inc.
    Inventors: Jin-Soo Park, Byung-Taek Kim
  • Publication number: 20050200226
    Abstract: Disclosed is a method for manufacturing a stator of a brushless direct current electric motor which can cut down the unit cost of production and improve the B-H property and the core loss property, by forming a band-shaped back yoke by using a silicon steel plate sheet, helically stacking the back yoke, and inserting poles formed by a magnetic iron powder into the inner circumferential surface of the back yoke, and a stator of a brushless direct current electric motor manufactured by the method.
    Type: Application
    Filed: December 15, 2004
    Publication date: September 15, 2005
    Inventors: Young-Kwan Kim, Byung-Taek Kim, Jang-Ho Shim
  • Publication number: 20040169433
    Abstract: Disclosed is a motor stator assembly comprising: a plurality of yokes manufactured by laminating a plurality of steel sheets having a predetermined length; and a plurality of poles engaged between the yokes and formed by molding magnetic material in a mold, on which coil is wound. In the assembly, material loss can be reduced at the time of blanking operation, and additional protector is not required. According to this, a winding radius of coil is reduced thus to reduce coil amount on the basis of a constant number of times of winding. Also, by using magnetic powder material and silicon steel, productivity is enhanced and motor efficiency is enhanced.
    Type: Application
    Filed: July 14, 2003
    Publication date: September 2, 2004
    Applicant: LG ELECTRONICS INC.
    Inventors: Jin-Soo Park, Byung-Taek Kim
  • Publication number: 20040169432
    Abstract: Disclosed is a motor stator assembly comprising: a plurality of yokes manufactured by laminating a plurality of steel sheets having a predetermined length; and a plurality of poles engaged between the yokes and formed by molding magnetic material in a mold, on which coil is wound. In the assembly, material loss can be reduced at the time of blanking operation, and additional protector is not required. According to this, a winding radius of coil is reduced thus to reduce coil amount on the basis of a constant number of times of winding. Also, by using magnetic powder material and silicon steel, productivity is enhanced and motor efficiency is enhanced.
    Type: Application
    Filed: July 8, 2003
    Publication date: September 2, 2004
    Applicant: LG Electronics Inc.
    Inventors: Jin-Soo Park, Byung-Taek Kim
  • Patent number: 6781480
    Abstract: A duplexer dielectric filter is disclosed. This filter has a dielectric block, with reception and transmission areas formed on the dielectric block and respectively having a resonator formed by a resonating hole. This resonating hole is at least partially coated with a conductive material on its internal surface. Reception and transmission terminals are formed on the upper and side surfaces of the dielectric block at positions corresponding to the reception and transmission areas and are insulated from the conductive material of the side surface of the dielectric block. An antenna terminal is arranged between the reception and transmission areas. An open area, free from a conductive material, is formed on at least a part of the side surface of the dielectric block at a position corresponding to the reception area.
    Type: Grant
    Filed: August 24, 2000
    Date of Patent: August 24, 2004
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Byung Taek Kim, Byoung HWA Lee
  • Patent number: 6714101
    Abstract: Disclosed herein is an array type noise reduction filter. The array type noise reduction filter has a plurality of noise reduction filters horizontally arranged within a single chip. A plurality of noise reduction filters each have an inductance portion, a ground portion, and a capacitance portion. The inductance portion is comprised of first and second coils approximately vertically connected in the chip. The ground portion is arranged over or under the inductance portion. The capacitance portion is arranged over or under the ground portion. A second coil of any inductance portion is constructed to be wound in a direction opposite to a second coil of another adjacent inductance portion.
    Type: Grant
    Filed: January 25, 2002
    Date of Patent: March 30, 2004
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Byung Taek Kim, Jeong Ho Yoon, Byeung Gyu Chang, Dae Hyeong Lee, Min Cheol Park, Moon Soo Park
  • Publication number: 20030085777
    Abstract: Disclosed herein is an array type noise reduction filter. The array type noise reduction filter has a plurality of noise reduction filters horizontally arranged within a single chip. A plurality of noise reduction filters each have an inductance portion, a ground portion, and a capacitance portion. The inductance portion is comprised of first and second coils approximately vertically connected in the chip. The ground portion is arranged over or under the inductance portion. The capacitance portion is arranged over or under the ground portion. A second coil of any inductance portion is constructed to be wound in a direction opposite to a second coil of another adjacent inductance portion.
    Type: Application
    Filed: January 25, 2002
    Publication date: May 8, 2003
    Applicant: Samsung Electro-Mechanics Co. Ltd.
    Inventors: Byung Taek Kim, Jeong Ho Yoon, Byeung Gyu Chang, Dae Hyeong Lee, Min Cheol Park, Moon Soo Park
  • Publication number: 20030085776
    Abstract: Disclosed herein is an array type noise reduction filter. The array type noise reduction filter has a plurality of noise reduction filters horizontally arranged within a single chip. A plurality of noise reduction filters each have a conductor layer and an inductance portion. The conductor layer is comprised of a ground portion arranged at approximately the center portion within the chip, and at least one capacitance portion arranged at at least one position over or under the ground portion. The inductance portion is arranged over or under the conductor layer. An inductance portion of another noise reduction filter adjacent to a noise reduction filter having an inductance portion arranged over the conductor layer is arranged under the conductor layer.
    Type: Application
    Filed: January 25, 2002
    Publication date: May 8, 2003
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Byung Taek Kim, Jeong Ho Yoon, Sung Yeol Park, Min Kyu Park, Min Cheol Park