Patents by Inventor Byung-Gil Jeong

Byung-Gil Jeong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10105060
    Abstract: A breast scanning apparatus which uses photoacoustic ultrasonic waves is provided. The breast scanning apparatus includes a body which includes a first hole and a second hole which are horizontally parallel to each other; a first compression plate and a second compression plate, at least one of which is movable in a vertical direction with respect to the body; a first sliding plate and a second sliding plate, which are respectively installed on surfaces of the first compression plate and the second compression plate and are facing each other and are movable in a first direction; a first ultrasonic transducer array in the first compression plate and facing the first sliding plate; and a first laser head in the first compression plate, which is movable in a second direction which is perpendicular to the first direction.
    Type: Grant
    Filed: July 23, 2014
    Date of Patent: October 23, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-seok Kim, Sung-chan Kang, Hyung-joo Kim, Hyung-jae Shin, Yong-seop Yoon, Byung-gil Jeong, Seok-whan Chung, Chang-jung Kim
  • Patent number: 9319800
    Abstract: An electro-acoustic transducer includes a conductive substrate provided with at least one cell and at least one electrode, and a pad substrate disposed corresponding to the conductive substrate and provided with at least one pad corresponding to the electrode, in which at least one of the electrode and the pad includes an electric pattern for electric connection and at least one dummy pattern that is provided around the electric pattern to be separated the electric pattern.
    Type: Grant
    Filed: June 27, 2014
    Date of Patent: April 19, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seog-woo Hong, Hyung-jae Shin, Dong-sik Shim, Byung-gil Jeong, Seok-whan Chung
  • Patent number: 9233396
    Abstract: A micromachined ultrasonic transducer (MUT) array includes a printed circuit board, an alignment plate formed on the printed circuit board, the alignment plate having a plurality of cavities formed therein and a plurality of protruding portions respectively formed between neighboring cavities of the plurality of cavities, and a plurality of MUT modules formed on the plurality of the cavities and the plurality of the protruding portions of the alignment plate. In the MUT array, each of the plurality of MUT modules includes an application-specific integrated circuit (ASIC) arranged on the alignment plate and an MUT arranged on the ASIC.
    Type: Grant
    Filed: August 2, 2013
    Date of Patent: January 12, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Byung-gil Jeong
  • Patent number: 9206038
    Abstract: A capacitive micro-machined ultrasonic transducer (CMUT) and a method of singulating the same. Singulating CMUTs may include forming first trenches in regions of a device wafer defining a plurality of ultrasonic transducer structures, the device wafer including a plurality of the ultrasonic transducer structures, forming an ultrasonic transducer wafer having a plurality of ultrasonic transducers by bonding an electrode pad wafer supplying electricity to the plurality of ultrasonic transducers and the device wafer, and dicing the ultrasonic transducer wafer to form the plurality of ultrasonic transducers by cutting the plurality of ultrasonic transducer structures on the first trench and the electrode pad wafer below the first trench.
    Type: Grant
    Filed: June 6, 2014
    Date of Patent: December 8, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byung-gil Jeong, Seog-woo Hong
  • Patent number: 9120127
    Abstract: An ultrasonic transducer structure, an ultrasonic transducer, and a method of manufacturing the ultrasonic transducer are provided. The ultrasonic transducer structure includes a driving wafer that includes a driving circuit; and an ultrasonic transducer wafer that is disposed on the driving wafer and includes a first wafer in which a via-hole is formed, a first insulating layer formed on the first wafer, a second wafer spaced apart from the first insulating layer, and a cavity formed between the first insulating layer and the second wafer.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: September 1, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byung-gil Jeong, Seog-woo Hong, Dong-kyun Kim, Seok-whan Chung, Hyung-jae Shin
  • Publication number: 20150230029
    Abstract: An electro-acoustic transducer includes a conductive substrate provided with at least one cell and at least one electrode, and a pad substrate disposed corresponding to the conductive substrate and provided with at least one pad corresponding to the electrode, in which at least one of the electrode and the pad includes an electric pattern for electric connection and at least one dummy pattern that is provided around the electric pattern to be separated the electric pattern.
    Type: Application
    Filed: June 27, 2014
    Publication date: August 13, 2015
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seog-woo HONG, Hyung-jae SHIN, Dong-sik SHIM, Byung-gil JEONG, Seok-whan CHUNG
  • Patent number: 9096418
    Abstract: An ultrasonic transducer and a method of manufacturing the same are disclosed. The ultrasonic transducer includes a first electrode layer which is disposed to cover a conductive substrate and an inner wall and a top of a via hole penetrating a membrane and has a top surface at a same height as a top surface of the membrane; a second electrode layer which is disposed on a bottom surface of the conductive substrate to be spaced apart from the first electrode layer; and a top electrode which is disposed on the top surface of the membrane and which contacts the top surface of the first electrode layer.
    Type: Grant
    Filed: August 28, 2013
    Date of Patent: August 4, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seog-woo Hong, Dong-kyun Kim, Byung-gil Jeong, Seok-whan Chung
  • Publication number: 20150141795
    Abstract: A breast scanning apparatus which uses photoacoustic ultrasonic waves is provided. The breast scanning apparatus includes a body which includes a first hole and a second hole which are horizontally parallel to each other; a first compression plate and a second compression plate, at least one of which is movable in a vertical direction with respect to the body; a first sliding plate and a second sliding plate, which are respectively installed on surfaces of the first compression plate and the second compression plate and are facing each other and are movable in a first direction; a first ultrasonic transducer array in the first compression plate and facing the first sliding plate; and a first laser head in the first compression plate, which is movable in a second direction which is perpendicular to the first direction.
    Type: Application
    Filed: July 23, 2014
    Publication date: May 21, 2015
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-seok KIM, Sung-chan KANG, Hyung-joo KIM, Hyung-jae SHIN, Yong-seop YOON, Byung-gil JEONG, Seok-whan CHUNG, Chang-jung KIM
  • Publication number: 20150054095
    Abstract: A capacitive micro-machined ultrasonic transducer (CMUT) and a method of singulating the same. Singulating CMUTs may include forming first trenches in regions of a device wafer defining a plurality of ultrasonic transducer structures, the device wafer including a plurality of the ultrasonic transducer structures, forming an ultrasonic transducer wafer having a plurality of ultrasonic transducers by bonding an electrode pad wafer supplying electricity to the plurality of ultrasonic transducers and the device wafer, and dicing the ultrasonic transducer wafer to form the plurality of ultrasonic transducers by cutting the plurality of ultrasonic transducer structures on the first trench and the electrode pad wafer below the first trench.
    Type: Application
    Filed: June 6, 2014
    Publication date: February 26, 2015
    Inventors: Byung-gil JEONG, Seog-woo HONG
  • Patent number: 8958595
    Abstract: Provided are a piezoelectric micro speaker having a piston diaphragm and a method of manufacturing the piezoelectric micro speaker. The piezoelectric micro speaker includes: a substrate having a cavity formed therein; a vibrating membrane that is disposed on the substrate and covers at least a center part of the cavity; a piezoelectric actuator disposed on the vibrating membrane so as to vibrate the vibrating membrane; and a piston diaphragm that is disposed in the cavity and performs piston motion by vibration of the vibrating membrane. When the vibrating membrane vibrates by the piezoelectric actuator, the piston diaphragm, which is connected to the vibrating membrane through a piston bar, performs a piston motion in the cavity.
    Type: Grant
    Filed: January 29, 2010
    Date of Patent: February 17, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jun-sik Hwang, Dong-kyun Kim, Seok-whan Chung, Byung-gil Jeong
  • Patent number: 8727994
    Abstract: A cell of an ultrasonic transducer is provided. The cell includes a substrate; a supporting portion disposed on the substrate; a thin film spaced apart from the substrate and the supporting portion; and a connection portion which connects the supporting portion and the thin film. The connection portion may include a deformation portion that is elastically deformable. A channel of the ultrasonic transducer includes a plurality of cells arranged in an array. The ultrasonic transducer includes a plurality of channels arranged in an array.
    Type: Grant
    Filed: June 24, 2011
    Date of Patent: May 20, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong-kyun Kim, Hyung-jae Shin, Seok-whan Chung, Byung-gil Jeong
  • Publication number: 20140070669
    Abstract: A micromachined ultrasonic transducer (MUT) array includes a printed circuit board, an alignment plate formed on the printed circuit board, the alignment plate having a plurality of cavities formed therein and a plurality of protruding portions respectively formed between neighboring cavities of the plurality of cavities, and a plurality of MUT modules formed on the plurality of the cavities and the plurality of the protruding portions of the alignment plate. In the MUT array, each of the plurality of MUT modules includes an application-specific integrated circuit (ASIC) arranged on the alignment plate and an MUT arranged on the ASIC.
    Type: Application
    Filed: August 2, 2013
    Publication date: March 13, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Byung-gil JEONG
  • Publication number: 20140061826
    Abstract: An ultrasonic transducer and a method of manufacturing the same are disclosed. The ultrasonic transducer includes a first electrode layer which is disposed to cover a conductive substrate and an inner wall and a top of a via hole penetrating a membrane and has a top surface at a same height as a top surface of the membrane; a second electrode layer which is disposed on a bottom surface of the conductive substrate to be spaced apart from the first electrode layer; and a top electrode which is disposed on the top surface of the membrane and which contacts the top surface of the first electrode layer.
    Type: Application
    Filed: August 28, 2013
    Publication date: March 6, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Seog-woo HONG, Dong-kyun KIM, Byung-gil JEONG, Seok-whan CHUNG
  • Patent number: 8549715
    Abstract: A piezoelectric microspeaker fabricated by a method including: forming a lower drive unit by forming a first drive electrode by depositing and etching a first thin conductive layer on a substrate, forming a first piezoelectric plate by depositing and etching a first piezoelectric layer on the first drive electrode, and forming a first common electrode by depositing and etching a second conductive layer on the first piezoelectric plate; after forming the lower drive unit, forming a diaphragm by depositing a non-conductive layer on the first common electrode; and forming an upper drive unit by forming a second common electrode by depositing and etching a third conductive layer on the diaphragm, forming a second piezoelectric plate by depositing and etching a second piezoelectric layer on the second common electrode, and forming a second drive electrode by depositing and etching a fourth conductive layer on the second piezoelectric plate.
    Type: Grant
    Filed: April 23, 2009
    Date of Patent: October 8, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong-kyun Kim, Seok-whan Chung, Byung-gil Jeong
  • Patent number: 8526642
    Abstract: Provided are a piezoelectric micro speaker and a method of manufacturing the same. The piezoelectric micro speaker includes: a substrate having a cavity therein; a diaphragm that is disposed on the substrate, the diaphragm including a vibrating membrane that overlaps the cavity; a piezoelectric actuator that is disposed on the vibrating membrane; and a weight that is disposed in the cavity and attached to a center portion of the vibrating membrane.
    Type: Grant
    Filed: January 26, 2010
    Date of Patent: September 3, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seok-whan Chung, Dong-kyun Kim, Byung-gil Jeong, Jun-sik Hwang
  • Patent number: 8520868
    Abstract: A piezoelectric micro speaker and a method of manufacturing the same are provided. The piezoelectric micro speaker includes a device plate, a front plate bonded on a front surface of the device plate, and a rear plate bonded on a rear surface of the device plate. The device plate includes a diaphragm, a piezoelectric actuator that vibrates the diaphragm, and a front cavity disposed in front of the diaphragm. The front plate includes a radiation hole connected to the front cavity. The rear plate includes a rear cavity formed in a surface of the rear plate facing the piezoelectric actuator, and a bent hole connected to the rear cavity. A sound absorption layer is formed on an inner surface of the rear cavity and absorbs sound radiated backward from the diaphragm so as to suppress the sound from being reflected on the rear plate.
    Type: Grant
    Filed: February 3, 2010
    Date of Patent: August 27, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byung-gil Jeong, Seok-whan Chung, Dong-kyun Kim
  • Patent number: 8509462
    Abstract: A piezoelectric micro speaker and a method of manufacturing the same are provided. The piezoelectric micro speaker includes a substrate having a cavity formed therein and a diaphragm that is disposed on the substrate that overlaps the cavity. A plurality of first vibrating membranes having concentric annular ring shapes are disposed in a first region of the diaphragm corresponding to a center of the cavity. A second vibrating membrane including a different material from that of the first vibrating membranes is formed in the second region of the diaphragm corresponding to an edge of the cavity. A piezoelectric actuator for vibrating the first vibrating membranes is formed on and between the concentric annular rings of the first vibrating membranes.
    Type: Grant
    Filed: February 11, 2010
    Date of Patent: August 13, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byung-gil Jeong, Dong-kyun Kim, Seok-whan Chung, Jun-sik Hwang
  • Publication number: 20130169110
    Abstract: An ultrasonic transducer structure, an ultrasonic transducer, and a method of manufacturing the ultrasonic transducer are provided. The ultrasonic transducer structure includes a driving wafer that includes a driving circuit; and an ultrasonic transducer wafer that is disposed on the driving wafer and includes a first wafer in which a via-hole is formed, a first insulating layer formed on the first wafer, a second wafer spaced apart from the first insulating layer, and a cavity formed between the first insulating layer and the second wafer.
    Type: Application
    Filed: September 14, 2012
    Publication date: July 4, 2013
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byung-gil JEONG, Seog-woo HONG, Dong-kyun KIM, Seok-whan CHUNG, Hyung-jae SHIN
  • Patent number: 8401220
    Abstract: A micro speaker includes a substrate having a cavity formed therein, a diaphragm formed on the substrate overlapping the cavity. The diaphragm includes a first vibration membrane formed in a first area corresponding to a center portion of the cavity and a second vibration membrane formed in a second area corresponding to an edge portion of the cavity and formed of material different from that used for the first vibration membrane. A piezoelectric actuator is formed including a first electrode layer formed on the first vibration membrane, a piezoelectric layer formed on the first electrode layer, and a second electrode layer formed on the piezoelectric layer, and first and second curved lead wires, respectively connected to the first and second electrode layers across the second area, which are symmetrical to the center of the piezoelectric actuator.
    Type: Grant
    Filed: March 31, 2010
    Date of Patent: March 19, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong-kyun Kim, Byung-gil Jeong, Seok-whan Chung, Jun-sik Hwang
  • Patent number: 8363864
    Abstract: Provided are a piezoelectric micro-acoustic transducer and a method of fabricating the same. In the piezoelectric micro-acoustic transducer, a diaphragm is divided into a first region and a second region. The first region may be formed of a material capable of maximizing the exciting force, and the second region may be formed of a material having less initial stress and a lower Young's modulus than the first region. Also, the second region has a corrugated shape.
    Type: Grant
    Filed: April 6, 2011
    Date of Patent: January 29, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seok-Whan Chung, Dong-Kyun Kim, Byung-Gil Jeong