Patents by Inventor C. Willson

C. Willson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080095878
    Abstract: The present invention includes a template comprising a plurality of protrusions and a plurality of recessions with a distance between a zenith of any of the plurality of protrusions and a nadir of any one of the plurality of recessions being less than 250 nm.
    Type: Application
    Filed: June 11, 2007
    Publication date: April 24, 2008
    Applicant: BOARD OF REGENTS, UNIVERSITY OF TEXAS SYSTEM
    Inventors: Todd Bailey, Byung Choi, Matthew Colburn, S.V. Sreenivasan, C. Willson, John Ekerdt
  • Publication number: 20070034600
    Abstract: The present invention includes a method for forming a pattern on a substrate with a composition by forming a cross-linked polymer from the composition upon exposing the same to radiation. The method includes depositing the composition to function as a planarization layer. Thereafter, a layer of polymerizable material into which a pattern is to be recorded is deposited.
    Type: Application
    Filed: September 27, 2006
    Publication date: February 15, 2007
    Applicant: BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM
    Inventors: C. Willson, Britain Smith, Nicholas Stacey
  • Publication number: 20060261518
    Abstract: In some embodiments, the present invention is directed to methods that involve the combination of step-and-flash imprint lithography (SFIL) with a multi-tier template to simultaneously pattern multiple levels of, for example, an integrated circuit device. In such embodiments, the imprinted material generally does not serve or act as a simple etch mask or photoresist, but rather serves as the insulation between levels and lines, i.e., as a functional dielectric material. After imprinting and a multiple step curing process, the imprinted pattern is filled with metal, as in dual damascene processing. Typically, the two printed levels will comprise a “via level,” which is used to make electrical contact with the previously patterned under-level, and a “wiring level.” The present invention provides for the direct patterning of functional materials, which represents a significant departure from the traditional approach to microelectronics manufacturing.
    Type: Application
    Filed: February 27, 2006
    Publication date: November 23, 2006
    Inventors: C. Willson, Frank Palmieri, Yukio Nishimura, Stephen Johnson, Michael Stewart
  • Publication number: 20050156357
    Abstract: The present invention includes a method for forming a pattern on a substrate with a composition by forming a cross-linked polymer from the composition upon exposing the same to radiation. The method includes depositing the composition to function as a planarization layer. Thereafter, a layer of polymerizable material into which a pattern is to be recorded is deposited.
    Type: Application
    Filed: December 30, 2004
    Publication date: July 21, 2005
    Inventors: C. Willson, Britain Smith, Nicholas Stacey
  • Publication number: 20050064452
    Abstract: A system and method for the detection of an analyte using multiplexing of the sensing elements is described. In one embodiment, a sensor array includes sensing elements, and probes bound to one or more sensing elements. The sensor array is formed from a supporting member to which a plurality of sensing elements may be coupled. The sensing element may have a predefined shape, size or location. A signal may be produced when a target analyte interacts with a probe. In one embodiment, the identity of the target may be determined by the detection of the signals produced and the shapes of the sensing elements. Each analyte may be given a unique code that is represented by one or more sensing elements.
    Type: Application
    Filed: April 26, 2004
    Publication date: March 24, 2005
    Inventors: Matthew Schmid, C. Willson
  • Publication number: 20050019796
    Abstract: A system and method for recognition of images may include the use of alignment markers. The image recognized may be a pattern from an array, a character, a number, a shape, and/or irregular shapes. The pattern may be formed by elements in an array such as an identification marking and/or a sensor array. More particularly, the system and method relate to discriminating between images by accounting for the orientation of the image. The size and/or location of alignment markers may provide information about the orientation of an image. Information about the orientation of an image may reduce false recognitions. The system and method of image recognition may be used with identification markings, biosensors, micro-fluidic arrays, and/or optical character recognition systems.
    Type: Application
    Filed: May 17, 2004
    Publication date: January 27, 2005
    Inventors: Jason Meiring, Timothy Michaelson, C. Willson