Abstract: A method includes receiving a trajectory dataset including a plurality of geospatial points forming a point cloud and acquired along a trajectory wherein for each of the plurality of geospatial points there is a defined an x-coordinate, a y-coordinate and a z-coordinate and at least one mapping device orientation attribute, segmenting the trajectory dataset into a plurality of segments, determining at least one relative constraint for each of the plurality of segments and utilizing, for each of the plurality of segments, at least one of the determined relative constraints to determine a relative position of at least two of the plurality of segments.

Abstract: A method includes receiving a trajectory dataset including a plurality of geospatial points forming a point cloud and acquired along a trajectory wherein for each of the plurality of geospatial points there is a defined an x-coordinate, a y-coordinate and a z-coordinate and at least one mapping device orientation attribute, segmenting the trajectory dataset into a plurality of segments, determining at least one relative constraint for each of the plurality of segments and utilizing, for each of the plurality of segments, at least one of the determined relative constraints to determine a relative position of at least two of the plurality of segments.

Abstract: A method of pose calculation for a portable three-dimensional scanning device including a first sensor and a second sensor the method including utilizing data from the first sensor and data from the second sensor to acquire data defining six degrees of freedom of the scanning device to optimize a first pose calculation, receiving data comprising one of data from the first sensor and data from the second sensor, selecting a subset of the six degrees of freedom of the scanning device, utilizing the data from the first sensor and the received data for the selected subset of six degrees of freedom to optimize a second pose, wherein the unselected degrees of freedom are retained from the first pose and storing received data associated with the second camera pose in a point cloud database.

Abstract: Epitaxial formation support structures and associated methods of manufacturing epitaxial formation support structures and solid state lighting devices are disclosed herein. In several embodiments, a method of manufacturing an epitaxial formation support substrate can include forming an uncured support substrate that has a first side, a second side opposite the first side, and coefficient of thermal expansion substantially similar to N-type gallium nitride. The method can further include positioning the first side of the uncured support substrate on a first surface of a first reference plate and positioning a second surface of a second reference plate on the second side to form a stack. The first and second surfaces can include uniformly flat portions. The method can also include firing the stack to sinter the uncured support substrate. At least side of the support substrate can form a planar surface that is substantially uniformly flat.

Abstract: Epitaxial formation support structures and associated methods of manufacturing epitaxial formation support structures and solid state lighting devices are disclosed herein. In several embodiments, a method of manufacturing an epitaxial formation support substrate can include forming an uncured support substrate that has a first side, a second side opposite the first side, and coefficient of thermal expansion substantially similar to N-type gallium nitride. The method can further include positioning the first side of the uncured support substrate on a first surface of a first reference plate and positioning a second surface of a second reference plate on the second side to form a stack. The first and second surfaces can include uniformly flat portions. The method can also include firing the stack to sinter the uncured support substrate. At least side of the support substrate can form a planar surface that is substantially uniformly flat.

Abstract: In accordance with certain embodiments, a light-emitting element composed of one or more discrete units configured for light emission is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the light-emitting element or non-coplanarity of the semiconductor die contacts.

Abstract: In accordance with certain embodiments, a light-emitting element composed of one or more discrete units configured for light emission is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the light-emitting element or non-coplanarity of the semiconductor die contacts.

Abstract: A method includes acquiring with a scanning device a scan frame comprising a point cloud comprising a first plurality of points, attributing each of the first plurality of points with a selected metric, filtering an existing map comprised of a second plurality of points based, at least in part, on the selected metric and localizing each of the first plurality of points to the filtered second plurality of points.

Abstract: In accordance with certain embodiments, a light-emitting element composed of one or more discrete units configured for light emission is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the light-emitting element or non-coplanarity of the semiconductor die contacts.

Abstract: Epitaxial formation support structures and associated methods of manufacturing epitaxial formation support structures and solid state lighting devices are disclosed herein. In several embodiments, a method of manufacturing an epitaxial formation support substrate can include forming an uncured support substrate that has a first side, a second side opposite the first side, and coefficient of thermal expansion substantially similar to N-type gallium nitride. The method can further include positioning the first side of the uncured support substrate on a first surface of a first reference plate and positioning a second surface of a second reference plate on the second side to form a stack. The first and second surfaces can include uniformly flat portions. The method can also include firing the stack to sinter the uncured support substrate. At least side of the support substrate can form a planar surface that is substantially uniformly flat.

Abstract: A method includes receiving a trajectory dataset including a plurality of geospatial points forming a point cloud and acquired along a trajectory wherein for each of the plurality of geospatial points there is a defined an x-coordinate, a y-coordinate and a z-coordinate and at least one mapping device orientation attribute, segmenting the trajectory dataset into a plurality of segments, determining at least one relative constraint for each of the plurality of segments and utilizing, for each of the plurality of segments, at least one of the determined relative constraints to determine a relative position of at least two of the plurality of segments.

Abstract: In accordance with certain embodiments, a light-emitting element composed of one or more discrete units configured for light emission is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the light-emitting element or non-coplanarity of the semiconductor die contacts.

Abstract: A method of pose calculation for a portable three-dimensional scanning device including a first sensor and a second sensor the method including utilizing data from the first sensor and data from the second sensor to acquire data defining six degrees of freedom of the scanning device to optimize a first pose calculation, receiving data comprising one of data from the first sensor and data from the second sensor, selecting a subset of the six degrees of freedom of the scanning device, utilizing the data from the first sensor and the received data for the selected subset of six degrees of freedom to optimize a second pose, wherein the unselected degrees of freedom are retained from the first pose and storing received data associated with the second camera pose in a point cloud database.

Abstract: Epitaxial formation support structures and associated methods of manufacturing epitaxial formation support structures and solid state lighting devices are disclosed herein. In several embodiments, a method of manufacturing an epitaxial formation support substrate can include forming an uncured support substrate that has a first side, a second side opposite the first side, and coefficient of thermal expansion substantially similar to N-type gallium nitride. The method can further include positioning the first side of the uncured support substrate on a first surface of a first reference plate and positioning a second surface of a second reference plate on the second side to form a stack. The first and second surfaces can include uniformly flat portions. The method can also include firing the stack to sinter the uncured support substrate. At least side of the support substrate can form a planar surface that is substantially uniformly flat.

Abstract: In accordance with certain embodiments, devices are recycled by removing one or more electronic components from a portion of the device and urging one or more regions of the portion of the device toward an abrasion head. The abrasion head mechanically removes at least a portion of patternable material in each of the one or more regions. The steps are repeated for subsequent portions of the device.

Abstract: In accordance with certain embodiments, patterns are formed in composite materials by selectively urging one or more regions of the composite material toward an abrasion head, whereby the abrasion head mechanically removes portions of a patternable material from the composite material in each region.

Abstract: In accordance with certain embodiments, a light-emitting element composed of one or more discrete units configured for light emission is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the light-emitting element or non-coplanarity of the semiconductor die contacts.

Abstract: Epitaxial formation support structures and associated methods of manufacturing epitaxial formation support structures and solid state lighting devices are disclosed herein. In several embodiments, a method of manufacturing an epitaxial formation support substrate can include forming an uncured support substrate that has a first side, a second side opposite the first side, and coefficient of thermal expansion substantially similar to N-type gallium nitride. The method can further include positioning the first side of the uncured support substrate on a first surface of a first reference plate and positioning a second surface of a second reference plate on the second side to form a stack. The first and second surfaces can include uniformly flat portions. The method can also include firing the stack to sinter the uncured support substrate. At least side of the support substrate can form a planar surface that is substantially uniformly flat.

Abstract: In accordance with certain embodiments, a light-emitting element composed of one or more discrete units configured for light emission is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the light-emitting element or non-coplanarity of the semiconductor die contacts.

Abstract: Epitaxial formation support structures and associated methods of manufacturing epitaxial formation support structures and solid state lighting devices are disclosed herein. In several embodiments, a method of manufacturing an epitaxial formation support substrate can include forming an uncured support substrate that has a first side, a second side opposite the first side, and coefficient of thermal expansion substantially similar to N-type gallium nitride. The method can further include positioning the first side of the uncured support substrate on a first surface of a first reference plate and positioning a second surface of a second reference plate on the second side to form a stack. The first and second surfaces can include uniformly flat portions. The method can also include firing the stack to sinter the uncured support substrate. At least side of the support substrate can form a planar surface that is substantially uniformly flat.