Abstract: In accordance with certain embodiments, lighting systems include flexible light sheets having light-emitting elements with first luminous intensity distributions disposed thereover, and the light sheets are curved or folded to produce a second luminous intensity distribution different from the first luminous intensity distribution.

Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.

Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.

Abstract: In accordance with certain embodiments, devices are recycled by removing one or more electronic components from a portion of the device and urging one or more regions of the portion of the device toward an abrasion head. The abrasion head mechanically removes at least a portion of patternable material in each of the one or more regions. The steps are repeated for subsequent portions of the device.

Abstract: In accordance with certain embodiments, patterns are formed in composite materials by selectively urging one or more regions of the composite material toward an abrasion head, whereby the abrasion head mechanically removes portions of a patternable material from the composite material in each region.

Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.

Abstract: Epitaxial formation support structures and associated methods of manufacturing epitaxial formation support structures and solid state lighting devices are disclosed herein. In several embodiments, a method of manufacturing an epitaxial formation support substrate can include forming an uncured support substrate that has a first side, a second side opposite the first side, and coefficient of thermal expansion substantially similar to N-type gallium nitride. The method can further include positioning the first side of the uncured support substrate on a first surface of a first reference plate and positioning a second surface of a second reference plate on the second side to form a stack. The first and second surfaces can include uniformly flat portions. The method can also include firing the stack to sinter the uncured support substrate. At least side of the support substrate can form a planar surface that is substantially uniformly flat.

Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.

Abstract: Epitaxial formation support structures and associated methods of manufacturing epitaxial formation support structures and solid state lighting devices are disclosed herein. In several embodiments, a method of manufacturing an epitaxial formation support substrate can include forming an uncured support substrate that has a first side, a second side opposite the first side, and coefficient of thermal expansion substantially similar to N-type gallium nitride. The method can further include positioning the first side of the uncured support substrate on a first surface of a first reference plate and positioning a second surface of a second reference plate on the second side to form a stack. The first and second surfaces can include uniformly flat portions. The method can also include firing the stack to sinter the uncured support substrate. At least side of the support substrate can form a planar surface that is substantially uniformly flat.

Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.

Abstract: In accordance with certain embodiments, an illumination system comprising a plurality of power strings features elements facilitating compensation for failure of one or more light-emitting elements connected along each power string.

Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.

Abstract: In accordance with certain embodiments, an illumination system comprising a plurality of power strings features elements facilitating compensation for failure of one or more light-emitting elements connected along each power string.

Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.

Abstract: In accordance with certain embodiments, lighting systems include flexible light sheets having light-emitting elements with first luminous intensity distributions disposed thereover, and the light sheets are curved or folded to produce a second luminous intensity distribution different from the first luminous intensity distribution.

Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.

Abstract: In accordance with certain embodiments, an illumination system comprising a plurality of power strings features elements facilitating compensation for failure of one or more light-emitting elements connected along each power string.

Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.

Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.

Abstract: In accordance with certain embodiments, an illumination system comprising a plurality of power strings features elements facilitating compensation for failure of one or more light-emitting elements connected along each power string.