Abstract: A fabrication process for soft-matter printed circuit boards is disclosed in which traces of liquid-phase Ga—In eutectic (eGaIn) are patterned with UV laser micromachining (UVLM). The terminals of the elastomer-sealed LM circuit connect to the surface mounted chips through vertically-aligned columns of eGaIn-coated ferromagnetic microspheres that are embedded within an interfacial elastomer layer.

Abstract: The present invention relates to a gripping apparatus comprising a membrane; a flexible housing; with said membrane being fixedly connected to a periphery of the housing. The invention further relates to a method of producing a gripping apparatus.

Abstract: A soft magnetic sensor comprising a soft material containing randomly distributed magnetic microparticles and a magnetometer that can estimate force and localize contact over a continuous area. A reference magnetometer can be used to filter motion and ambient noise. Methods for locating contact and determining force comprise data analysis of the magnetometer output. In some embodiments, the sensor can localize an object prior to contact.

Abstract: Coating inkjet-printed traces of silver nanoparticles (AgNP) ink with a thin layer of eutectic gallium indium (EGaIn) increases the electrical conductivity and significantly improves tolerance to tensile strain. This enhancement is achieved through a room temperature “sintering” process in which the liquid-phase EGaIn alloy binds the AgNP particles to form a continuous conductive trace. These mechanically robust thin-film circuits are well suited for transfer to highly curved and non-developable 3D surfaces as well as skin and other soft deformable substrates.

Abstract: Coating inkjet-printed traces of silver nanoparticles (AgNP) ink with a thin layer of eutectic gallium indium (EGaIn) increases the electrical conductivity and significantly improves tolerance to tensile strain. This enhancement is achieved through a room temperature “sintering” process in which the liquid-phase EGaIn alloy binds the AgNP particles to form a continuous conductive trace. These mechanically robust thin-film circuits are well suited for transfer to highly curved and non-developable 3D surfaces as well as skin and other soft deformable substrates.

Abstract: A die of an integrated circuit and an upper layer of a circuit assembly are thermally connected by applying a thermal interface material (TIM) on the die, such that the TIM is between the die and an upper layer. The TIM comprises an emulsion of liquid metal droplets and uncured polymer. The method further comprises compressing the circuit assembly thereby deforming the liquid metal droplets and curing the thermal interface material thereby forming the circuit assembly.

Abstract: A polymer composite having shape-morphing capabilities where the composite comprises a liquid crystal elastomer and liquid metal inclusions to improve thermal and/or electrical conductivity. The liquid metal inclusions are metals such as Gallium, alloys of Gallium, eutectic alloys, and other metals that have low melting points. The composite is soft and stretchable, while still retaining the shape-morphing characteristics of the liquid crystal elastomer. The composite is an electrical insulator, yet conductivity can be induced through mechanical pressure.

Abstract: Disclosed herein is system, including a hand-held tool, for example, a surgical scalpel, integrated with a 9 degree-of-freedom inertial measurement unit and a method for tracking the location of the hand-held instrument during manual or robotically-assisted procedures. The system and method has application in the surgical field, wherein instrumented surgical instruments may be precisely tracked throughout a surgical procedure.

Abstract: An apparatus for communication, a system thereof, and methods of manufacture thereof are provided. The apparatus comprises a body and a printed circuit board (PCB) operatively coupled to the body. The PCB comprises a processing unit, a first communication module operatively coupled to the processing unit, and an array of assemblies. The first communication module is configured to communicate with a secondary communication module wirelessly. The array of assemblies comprises at least two rows and at least two columns. Each assembly comprises a switch and a light. The array of assemblies are operatively coupled to the processing unit. Each light is configured to change a state responsive to at least one of a change in state by the switch within the same assembly and a control signal from the first communication module.

Abstract: Disclosed herein is a composite comprising an elastomer with an embedded network of liquid metal inclusions. The composite retains similar flexibility to that of an elastomer but exhibits electrical and thermal properties that differ from the properties of a homogeneous elastomer. The composite has applications for wearable devices and other soft matter electronics, among others.

Abstract: According to one embodiment is a flexible circuit comprising a flexible base, a conductive polymer supported by the base, and an integrated circuit component having an elongated electrical contact, wherein the elongated electrical contact penetrates into the conductive polymer, thereby providing a robust electrical connection. According to methods of certain embodiments, the flexible circuit is manufactured using a molding process, where a conductive polymer is deposited into recesses in a mold, integrated circuit components are placed in contact with the conductive polymer, and a flexible polymer base is poured over the mold prior to curing. In an alternative embodiment, a multiple-layer flexible circuit is manufacturing using a plurality of molds.

Abstract: A die of an integrated circuit and an upper layer of a circuit assembly are thermally connected by applying a thermal interface material (TIM) on the die, such that the TIM is between the die and an upper layer. The TIM comprises an emulsion of liquid metal droplets and uncured polymer. The method further comprises compressing the circuit assembly thereby deforming the liquid metal droplets and curing the thermal interface material thereby forming the circuit assembly.

Abstract: An apparatus for communication, a system thereof, and methods of manufacture thereof are provided. The apparatus comprises a body and a printed circuit board (PCB) operatively coupled to the body. The PCB comprises a processing unit, a first communication module operatively coupled to the processing unit, and an array of assemblies. The first communication module is configured to communicate with a secondary communication module wirelessly. The array of assemblies comprises at least two rows and at least two columns. Each assembly comprises a switch and a light. The array of assemblies are operatively coupled to the processing unit. Each light is configured to change a state responsive to at least one of a change in state by the switch within the same assembly and a control signal from the first communication module.

Abstract: A stretchable and transparent electronic structure may generally include a stretchable elastomer layer; optionally, a metal adhesion layer on top of the stretchable elastomer layer; a metal alloying layer on top of the metal adhesion layer; and a liquid metal, wherein the structure is colorless and transparent when viewed under visible light. Methods of making the stretchable and transparent electronic structure are also described.

Abstract: Soft-matter technologies are essential for emerging applications in wearable computing, human-machine interaction, and soft robotics. However, as these technologies gain adoption in society and interact with unstructured environments, material and structure damage becomes inevitable. A robotic material that mimics soft tissues found in biological systems may be used to identify, compute, and respond to damage. This material includes liquid metal droplets dispersed in soft elastomers that rupture when damaged to create electrically conductive pathways that are identified with a soft active-matrix grid. These technologies may be used to autonomously identify damage, calculate severity, and respond to prevent failure within robotic systems.

Abstract: The disclosure describes a soft-matter electronic device having micron-scale features, and methods to fabricate the electronic device. In some embodiments, the device comprises an elastomer mold having microchannels, which are filled with an eutectic alloy to create an electrically conductive element. The microchannels are sealed with a polymer to prevent the alloy from escaping the microchannels. In some embodiments, the alloy is drawn into the microchannels using a micro-transfer printing technique. Additionally, the molds can be created using soft-lithography or other fabrication techniques. The method described herein allows creation of micron-scale circuit features with a line width and spacing that is an order-of-magnitude smaller than those previously demonstrated.

Abstract: A stretchable and transparent electronic structure may generally include a stretchable elastomer layer; optionally, a metal adhesion layer on top of the stretchable elastomer layer; a metal alloying layer on top of the metal adhesion layer; and a liquid metal, wherein the structure is colorless and transparent when viewed under visible light. Methods of making the stretchable and transparent electronic structure are also described.

Abstract: An electrostatic clutch is described comprising a plurality of micron-scale thickness electrodes, adjacent electrodes being separated by a thin film of dielectric material. A power source and controller apply a voltage across two electrodes, causing an electrostatic force to develop. When engaged, a force can be transferred through the clutch. A tensioning device maintains the alignment of the clutch when the electrodes are disengaged, but permits movement in at least one direction. In some embodiments, multiple clutches are connected to an output to provide variable force control and a broad range of torque input and output values. Moreover, the clutch can be used as an energy-recycling actuator that captures mechanical energy from negative work movements, and returns energy during positive work movements.

Abstract: The disclosure describes a soft-matter electronic device having micron-scale features, and methods to fabricate the electronic device. In some embodiments, the device comprises an elastomer mold having microchannels, which are filled with an eutectic alloy to create an electrically conductive element. The microchannels are sealed with a polymer to prevent the alloy from escaping the microchannels. In some embodiments, the alloy is drawn into the microchannels using a micro-transfer printing technique. Additionally, the molds can be created using soft-lithography or other fabrication techniques. The method described herein allows creation of micron-scale circuit features with a line width and spacing that is an order-of-magnitude smaller than those previously demonstrated.

Abstract: An efficient fabrication technique, including an optional design step, used to create highly customizable wearable electronics through rapid laser machining and adhesion-controlled soft materials assembly is disclosed herein. Well-aligned, multi-layered materials can be created from 2D and 3D elements that stretch and bend while seamlessly integrating with rigid components such as microchip integrated circuits (IC), discrete electrical components, and interconnects. The design step can be used to create a 3D device that conforms to different-shaped body parts. These techniques are applied using commercially available materials. These materials and methods enable custom wearable electronics while offering versatility in design and functionality for a variety of bio-monitoring applications.