Abstract: A stretchable and transparent electronic structure may generally include a stretchable elastomer layer; optionally, a metal adhesion layer on top of the stretchable elastomer layer; a metal alloying layer on top of the metal adhesion layer; and a liquid metal, wherein the structure is colorless and transparent when viewed under visible light. Methods of making the stretchable and transparent electronic structure are also described.

Abstract: The disclosure describes a soft-matter electronic device having micron-scale features, and methods to fabricate the electronic device. In some embodiments, the device comprises an elastomer mold having microchannels, which are filled with an eutectic alloy to create an electrically conductive element. The microchannels are sealed with a polymer to prevent the alloy from escaping the microchannels. In some embodiments, the alloy is drawn into the microchannels using a micro-transfer printing technique. Additionally, the molds can be created using soft-lithography or other fabrication techniques. The method described herein allows creation of micron-scale circuit features with a line width and spacing that is an order-of-magnitude smaller than those previously demonstrated.

Abstract: Manufacturing technology to fabricate liquid metal-based soft and flexible electronics (sensors, antennas, etc.) in a high-throughput fashion, with fabrication rates that may approach that of the traditional integrated circuit components and circuits, are described. The technique allows creation of liquid-metal-only circuits, as well as seamless integration of solid IC chips into the circuits, in which liquid metal traces are used as flexible interconnects and/or as other circuit elements. The process may be applied at the wafer scale and may be integrated into the traditional microelectronics fabrication processes. Many sensors, antennas, and other circuit elements may be directly created using liquid metal, and when combined with the IC chips, a broad range of electronic functionality may be provided in a flexible, soft circuit that can be conformable, wearable.

Abstract: A high-throughput method of manufacturing a liquid metal circuit may include applying a liquid metal to an alloying metal pattern on an elastic substrate to form the liquid metal circuit. The elastic substrate may have a surface area greater than 1 square inch. The liquid metal circuit may include a plurality of liquid metal circuits on the elastic substrate. Methods of using the liquid metal circuit are also described.

Abstract: A method for synthesizing a thermally conductive and stretchable elastomer composite comprises mixing liquid metal and soft material (e.g., elastomer) in a centrifugal or industrial shear mixer under conditions such that the liquid metal forms microscale liquid metal droplets that are dispersed in the soft elastomer. Liquid metal-embedded elastomers, or “LMEEs,” formed in this manner dramatically increase the fracture energy of soft materials up to 50 times over an unfilled polymer. This extreme toughening is achieved by means of (i) increasing energy dissipation, (ii) adaptive crack movement, and (iii) effective elimination of the crack tip. Such properties arise from the deformability and dynamic rearrangement of the LM inclusions during loading, providing a new mechanism to not only prevent crack initiation, but also resist the propagation of existing tears for ultra-tough, highly functional soft materials.

Abstract: An efficient fabrication technique, including an optional design step, is used to create highly customizable wearable electronics. The method of fabrication utilizes rapid laser machining and adhesion-controlled soft materials. The method produces well-aligned, multi-layered materials created from 2D and 3D elements that stretch and bend while seamlessly integrating with rigid components such as microchip integrated circuits (IC), discrete electrical components, and interconnects. The design step can be used to create a 3D device that conforms to different-shaped body parts. These techniques are applied using commercially available materials. These methods enable custom wearable electronics while offering versatility in design and functionality for a variety of bio-monitoring applications.

Abstract: Soft-matter technologies are essential for emerging applications in wearable computing, human-machine interaction, and soft robotics. However, as these technologies gain adoption in society and interact with unstructured environments, material and structure damage becomes inevitable. A robotic material that mimics soft tissues found in biological systems may be used to identify, compute, and respond to damage. This material includes liquid metal droplets dispersed in soft elastomers that rupture when damaged to create electrically conductive pathways that are identified with a soft active-matrix grid. These technologies may be used to autonomously identify damage, calculate severity, and respond to prevent failure within robotic systems.

Abstract: An apparatus for communication, a system thereof, and methods of manufacture thereof are provided. The apparatus comprises a body and a printed circuit board (PCB) operatively coupled to the body. The PCB comprises a processing unit, a first communication module operatively coupled to the processing unit, and an array of assemblies. The first communication module is configured to communicate with a secondary communication module wirelessly. The array of assemblies comprises at least two rows and at least two columns. Each assembly comprises a switch and a light. The array of assemblies are operatively coupled to the processing unit. Each light is configured to change a state responsive to at least one of a change in state by the switch within the same assembly and a control signal from the first communication module.

Abstract: A fabrication process for soft-matter printed circuit boards is disclosed in which traces of liquid-phase Ga—In eutectic (eGaIn) are patterned with UV laser micromachining (UVLM). The terminals of the elastomer-sealed LM circuit connect to the surface mounted chips through vertically-aligned columns of eGaIn-coated ferromagnetic microspheres that are embedded within an interfacial elastomer layer.

Abstract: The present invention relates to a gripping apparatus comprising a membrane; a flexible housing; with said membrane being fixedly connected to a periphery of the housing. The invention further relates to a method of producing a gripping apparatus.

Abstract: A soft magnetic sensor comprising a soft material containing randomly distributed magnetic microparticles and a magnetometer that can estimate force and localize contact over a continuous area. A reference magnetometer can be used to filter motion and ambient noise. Methods for locating contact and determining force comprise data analysis of the magnetometer output. In some embodiments, the sensor can localize an object prior to contact.

Abstract: Coating inkjet-printed traces of silver nanoparticles (AgNP) ink with a thin layer of eutectic gallium indium (EGaIn) increases the electrical conductivity and significantly improves tolerance to tensile strain. This enhancement is achieved through a room temperature “sintering” process in which the liquid-phase EGaIn alloy binds the AgNP particles to form a continuous conductive trace. These mechanically robust thin-film circuits are well suited for transfer to highly curved and non-developable 3D surfaces as well as skin and other soft deformable substrates.

Abstract: Coating inkjet-printed traces of silver nanoparticles (AgNP) ink with a thin layer of eutectic gallium indium (EGaIn) increases the electrical conductivity and significantly improves tolerance to tensile strain. This enhancement is achieved through a room temperature “sintering” process in which the liquid-phase EGaIn alloy binds the AgNP particles to form a continuous conductive trace. These mechanically robust thin-film circuits are well suited for transfer to highly curved and non-developable 3D surfaces as well as skin and other soft deformable substrates.

Abstract: A die of an integrated circuit and an upper layer of a circuit assembly are thermally connected by applying a thermal interface material (TIM) on the die, such that the TIM is between the die and an upper layer. The TIM comprises an emulsion of liquid metal droplets and uncured polymer. The method further comprises compressing the circuit assembly thereby deforming the liquid metal droplets and curing the thermal interface material thereby forming the circuit assembly.

Abstract: A polymer composite having shape-morphing capabilities where the composite comprises a liquid crystal elastomer and liquid metal inclusions to improve thermal and/or electrical conductivity. The liquid metal inclusions are metals such as Gallium, alloys of Gallium, eutectic alloys, and other metals that have low melting points. The composite is soft and stretchable, while still retaining the shape-morphing characteristics of the liquid crystal elastomer. The composite is an electrical insulator, yet conductivity can be induced through mechanical pressure.

Abstract: Disclosed herein is system, including a hand-held tool, for example, a surgical scalpel, integrated with a 9 degree-of-freedom inertial measurement unit and a method for tracking the location of the hand-held instrument during manual or robotically-assisted procedures. The system and method has application in the surgical field, wherein instrumented surgical instruments may be precisely tracked throughout a surgical procedure.

Abstract: An apparatus for communication, a system thereof, and methods of manufacture thereof are provided. The apparatus comprises a body and a printed circuit board (PCB) operatively coupled to the body. The PCB comprises a processing unit, a first communication module operatively coupled to the processing unit, and an array of assemblies. The first communication module is configured to communicate with a secondary communication module wirelessly. The array of assemblies comprises at least two rows and at least two columns. Each assembly comprises a switch and a light. The array of assemblies are operatively coupled to the processing unit. Each light is configured to change a state responsive to at least one of a change in state by the switch within the same assembly and a control signal from the first communication module.

Abstract: Disclosed herein is a composite comprising an elastomer with an embedded network of liquid metal inclusions. The composite retains similar flexibility to that of an elastomer but exhibits electrical and thermal properties that differ from the properties of a homogeneous elastomer. The composite has applications for wearable devices and other soft matter electronics, among others.

Abstract: According to one embodiment is a flexible circuit comprising a flexible base, a conductive polymer supported by the base, and an integrated circuit component having an elongated electrical contact, wherein the elongated electrical contact penetrates into the conductive polymer, thereby providing a robust electrical connection. According to methods of certain embodiments, the flexible circuit is manufactured using a molding process, where a conductive polymer is deposited into recesses in a mold, integrated circuit components are placed in contact with the conductive polymer, and a flexible polymer base is poured over the mold prior to curing. In an alternative embodiment, a multiple-layer flexible circuit is manufacturing using a plurality of molds.

Abstract: A die of an integrated circuit and an upper layer of a circuit assembly are thermally connected by applying a thermal interface material (TIM) on the die, such that the TIM is between the die and an upper layer. The TIM comprises an emulsion of liquid metal droplets and uncured polymer. The method further comprises compressing the circuit assembly thereby deforming the liquid metal droplets and curing the thermal interface material thereby forming the circuit assembly.