Abstract: An apparatus for communication, a system thereof, and methods of manufacture thereof are provided. The apparatus comprises a body and a printed circuit board (PCB) operatively coupled to the body. The PCB comprises a processing unit, a first communication module operatively coupled to the processing unit, and an array of assemblies. The first communication module is configured to communicate with a secondary communication module wirelessly. The array of assemblies comprises at least two rows and at least two columns. Each assembly comprises a switch and a light. The array of assemblies are operatively coupled to the processing unit. Each light is configured to change a state responsive to at least one of a change in state by the switch within the same assembly and a control signal from the first communication module.

Abstract: A stretchable and transparent electronic structure may generally include a stretchable elastomer layer; optionally, a metal adhesion layer on top of the stretchable elastomer layer; a metal alloying layer on top of the metal adhesion layer; and a liquid metal, wherein the structure is colorless and transparent when viewed under visible light. Methods of making the stretchable and transparent electronic structure are also described.

Abstract: Soft-matter technologies are essential for emerging applications in wearable computing, human-machine interaction, and soft robotics. However, as these technologies gain adoption in society and interact with unstructured environments, material and structure damage becomes inevitable. A robotic material that mimics soft tissues found in biological systems may be used to identify, compute, and respond to damage. This material includes liquid metal droplets dispersed in soft elastomers that rupture when damaged to create electrically conductive pathways that are identified with a soft active-matrix grid. These technologies may be used to autonomously identify damage, calculate severity, and respond to prevent failure within robotic systems.

Abstract: The disclosure describes a soft-matter electronic device having micron-scale features, and methods to fabricate the electronic device. In some embodiments, the device comprises an elastomer mold having microchannels, which are filled with an eutectic alloy to create an electrically conductive element. The microchannels are sealed with a polymer to prevent the alloy from escaping the microchannels. In some embodiments, the alloy is drawn into the microchannels using a micro-transfer printing technique. Additionally, the molds can be created using soft-lithography or other fabrication techniques. The method described herein allows creation of micron-scale circuit features with a line width and spacing that is an order-of-magnitude smaller than those previously demonstrated.

Abstract: A stretchable and transparent electronic structure may generally include a stretchable elastomer layer; optionally, a metal adhesion layer on top of the stretchable elastomer layer; a metal alloying layer on top of the metal adhesion layer; and a liquid metal, wherein the structure is colorless and transparent when viewed under visible light. Methods of making the stretchable and transparent electronic structure are also described.

Abstract: An electrostatic clutch is described comprising a plurality of micron-scale thickness electrodes, adjacent electrodes being separated by a thin film of dielectric material. A power source and controller apply a voltage across two electrodes, causing an electrostatic force to develop. When engaged, a force can be transferred through the clutch. A tensioning device maintains the alignment of the clutch when the electrodes are disengaged, but permits movement in at least one direction. In some embodiments, multiple clutches are connected to an output to provide variable force control and a broad range of torque input and output values. Moreover, the clutch can be used as an energy-recycling actuator that captures mechanical energy from negative work movements, and returns energy during positive work movements.

Abstract: The disclosure describes a soft-matter electronic device having micron-scale features, and methods to fabricate the electronic device. In some embodiments, the device comprises an elastomer mold having microchannels, which are filled with an eutectic alloy to create an electrically conductive element. The microchannels are sealed with a polymer to prevent the alloy from escaping the microchannels. In some embodiments, the alloy is drawn into the microchannels using a micro-transfer printing technique. Additionally, the molds can be created using soft-lithography or other fabrication techniques. The method described herein allows creation of micron-scale circuit features with a line width and spacing that is an order-of-magnitude smaller than those previously demonstrated.

Abstract: An efficient fabrication technique, including an optional design step, used to create highly customizable wearable electronics through rapid laser machining and adhesion-controlled soft materials assembly is disclosed herein. Well-aligned, multi-layered materials can be created from 2D and 3D elements that stretch and bend while seamlessly integrating with rigid components such as microchip integrated circuits (IC), discrete electrical components, and interconnects. The design step can be used to create a 3D device that conforms to different-shaped body parts. These techniques are applied using commercially available materials. These materials and methods enable custom wearable electronics while offering versatility in design and functionality for a variety of bio-monitoring applications.

Abstract: A method for synthesizing a thermally conductive and stretchable elastomer composite comprises mixing liquid metal and soft material (e.g., elastomer) in a centrifugal or industrial shear mixer under conditions such that the liquid metal forms microscale liquid metal droplets that are dispersed in the soft elastomer. Liquid metal-embedded elastomers, or “LMEEs,” formed in this manner dramatically increase the fracture energy of soft materials up to 50 times over an unfilled polymer. This extreme toughening is achieved by means of (i) increasing energy dissipation, (ii) adaptive crack movement, and (iii) effective elimination of the crack tip. Such properties arise from the deformability and dynamic rearrangement of the LM inclusions during loading, providing a new mechanism to not only prevent crack initiation, but also resist the propagation of existing tears for ultra-tough, highly functional soft materials.

Abstract: Disclosed herein is a composite comprising an elastomer with an embedded network of liquid metal inclusions. The composite retains similar flexibility to that of an elastomer but exhibits electrical and thermal properties that differ from the properties of a homogeneous elastomer. The composite has applications for wearable devices and other soft matter electronics, among others.

Abstract: A fabrication process for soft-matter printed circuit boards is disclosed in which traces of liquid-phase Ga—In eutectic (eGaIn) are patterned with UV laser micromachining (UVLM). The terminals of the elastomer-sealed LM circuit connect to the surface mounted chips through vertically-aligned columns of eGaIn-coated ferromagnetic microspheres that are embedded within an interfacial elastomer layer.

Abstract: Manufacturing technology to fabricate liquid metal-based soft and flexible electronics (sensors, antennas, etc.) in a high-throughput fashion, with fabrication rates that may approach that of the traditional integrated circuit components and circuits, are described. The technique allows creation of liquid-metal-only circuits, as well as seamless integration of solid IC chips into the circuits, in which liquid metal traces are used as flexible interconnects and/or as other circuit elements. The process may be applied at the wafer scale and may be integrated into the traditional microelectronics fabrication processes. Many sensors, antennas, and other circuit elements may be directly created using liquid metal, and when combined with the IC chips, a broad range of electronic functionality may be provided in a flexible, soft circuit that can be conformable, wearable.

Abstract: A die of an integrated circuit and an upper layer of a circuit assembly are thermally connected by applying a thermal interface material (TIM) on the die, such that the TIM is between the die and an upper layer. The TIM comprises an emulsion of liquid metal droplets and uncured polymer. The method further comprises compressing the circuit assembly thereby deforming the liquid metal droplets and curing the thermal interface material thereby forming the circuit assembly.

Abstract: A fabrication process for soft-matter printed circuit boards is disclosed in which traces of liquid-phase Ga—In eutectic (eGaIn) are patterned with UV laser micromachining (UVLM). The terminals of the elastomer-sealed LM circuit connect to the surface mounted chips through vertically-aligned columns of eGaIn-coated ferromagnetic microspheres that are embedded within an interfacial elastomer layer.

Abstract: An electrostatic clutch is described comprising a plurality of micron-scale thickness electrodes, adjacent electrodes being separated by a thin film of dielectric material. A power source and controller apply a voltage across two electrodes, causing an electrostatic force to develop. When engaged, a force can be transferred through the clutch. A tensioning device maintains the alignment of the clutch when the electrodes are disengaged, but permits movement in at least one direction. In some embodiments, multiple clutches are connected to an output to provide variable force control and a broad range of torque input and output values. Moreover, the clutch can be used as an energy-recycling actuator that captures mechanical energy from negative work movements, and returns energy during positive work movements.

Abstract: A stretchable and transparent electronic structure may generally include a stretchable elastomer layer; optionally, a metal adhesion layer on top of the stretchable elastomer layer; a metal alloying layer on top of the metal adhesion layer; and a liquid metal, wherein the structure is colorless and transparent when viewed under visible light. Methods of making the stretchable and transparent electronic structure are also described.

Abstract: Disclosed herein is a composite comprising an elastomer with an embedded network of liquid metal inclusions. The composite retains similar flexibility to that of an elastomer but exhibits electrical and thermal properties that differ from the properties of a homogeneous elastomer. The composite has applications for wearable devices and other soft matter electronics, among others.

Abstract: Coating inkjet-printed traces of silver nanoparticles (AgNP) ink with a thin layer of eutectic gallium indium (EGaIn) increases the electrical conductivity and significantly improves tolerance to tensile strain. This enhancement is achieved through a room temperature “sintering” process in which the liquid-phase EGaIn alloy binds the AgNP particles to form a continuous conductive trace. These mechanically robust thin-film circuits are well suited for transfer to highly curved and non-developable 3D surfaces as well as skin and other soft deformable substrates.

Abstract: An electrostatic clutch is described comprising a plurality of micron-scale thickness electrodes, adjacent electrodes being separated by a thin film of dielectric material. A power source and controller apply a voltage across two electrodes, causing an electrostatic force to develop. When engaged, a force can be transferred through the clutch. A tensioning device maintains the alignment of the clutch when the electrodes are disengaged, but permits movement in at least one direction. In some embodiments, multiple clutches are connected to an output to provide variable force control and a broad range of torque input and output values. Moreover, the clutch can be used as an energy-recycling actuator that captures mechanical energy from negative work movements, and returns energy during positive work movements.

Abstract: Disclosed herein is an efficient fabrication approach to create highly customizable wearable electronics through rapid laser machining and adhesion-controlled soft materials assembly. Well-aligned, multi-layered materials can be created from 2D and 3D elements that stretch and bend while seamlessly integrating with rigid components such as microchip integrated circuits (IC), discrete electrical components, and interconnects. These techniques are applied using commercially available materials. These materials and methods enable custom wearable electronics while offering versatility in design and functionality for a variety of bio-monitoring applications.