Patents by Inventor Casey J. Feinstein

Casey J. Feinstein has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9944554
    Abstract: Methods for chemically strengthening the edges of glass sheets are provided. Voids can be formed in a mother sheet. The edges of these voids may correspond to a portion of the new edges that would normally be created during separation and free shaping of the mother sheet. The mother sheet can then be immersed in a chemical strengthener. The edges of the voids can be chemically strengthened in addition to the front and back sides of the mother sheet. After thin film processing and separation, each of the resulting individual sheets has been chemically strengthened on both sides and on a portion of its edges.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: April 17, 2018
    Assignee: APPLE INC.
    Inventors: Seung Jae Hong, Casey J. Feinstein, Lili Huang, Sunggu Kang, Kuo-Hua Sung, John Z. Zhong
  • Patent number: 9615448
    Abstract: Fabrication of thin sheets of glass or other substrate material for use in devices such as touch sensor panels is disclosed. A pair of thick glass sheets, typically with thicknesses of 0.5 mm or greater each, may each be patterned with thin film on a surface, sealed together to form a sandwich with the patterned surfaces facing each other and spaced apart by removable spacers, either or both thinned on their outside surfaces to thicknesses of less than 0.5 mm each, and separated into two thin glass sheets. A single thick glass sheet, typically with a thickness of 0.5 mm or greater, may be patterned, covered with a protective layer over the pattern, thinned on its outside surface to a thickness of less than 0.5 mm, and the protective layer removed. This thinness of less than 0.5 mm may be accomplished using standard LCD equipment, despite the equipment having a sheet minimum thickness requirement of 0.5 mm.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: April 4, 2017
    Assignee: APPLE INC.
    Inventors: Casey J. Feinstein, John Z. Zhong, Steve Porter Hotelling, Shih Chang Chang
  • Patent number: 9409383
    Abstract: Delamination of a laminated multilayer stack is provided by generating a layer-specific energy distribution in the stack during delamination. A localized energy transferrer can generate localized heating, cooling heating, cooling, or other form of energy absorption or transmission, in a bonding layer of a multilayer stack. Localized energy transfer can include thermal energy transfer, such as heating and/or cooling, acoustic energy transfer, such as applying ultrasonic energy, electromagnetic energy transfer, such as applying laser light, directed microwaves, etc. Localized energy transfer can generate a layer-specific energy distribution that can weaken the bonding layer while reducing damage to other layers of the stack.
    Type: Grant
    Filed: March 20, 2009
    Date of Patent: August 9, 2016
    Assignee: APPLE INC.
    Inventors: Casey J. Feinstein, Silvio Grespan, Kuo-Hua Sung, John Z. Zhong, Lynn Youngs
  • Patent number: 9405388
    Abstract: Methods and apparatus for protecting the thin films during chemical and/or thermal edge strengthening treatment. In one embodiment, a portion of each individual sheet is laminated. Pairs of sheets are then sealed together such that the thin film sides face inward to form a thin film sandwich. In some embodiments, the sandwich in then immersed in a chemical strengthener. In other embodiments, a localized treatment is applied to the unstrengthened edges.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: August 2, 2016
    Assignee: Apple Inc.
    Inventors: Casey J. Feinstein, John Z. Zhong
  • Patent number: 9207787
    Abstract: Methods and apparatus for protecting the thin films during chemical and/or thermal edge strengthening treatment. In one embodiment, a portion of each individual sheet is laminated. Pairs of sheets are then sealed together such that the thin film sides face inward to form a thin film sandwich. In some embodiments, the sandwich in then immersed in a chemical strengthener. In other embodiments, a localized treatment is applied to the unstrengthened edges.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: December 8, 2015
    Assignee: Apple Inc.
    Inventors: Casey J. Feinstein, John Z. Zhong
  • Patent number: 9063605
    Abstract: A method of fabricating a display panel from a thin substrate using a carrier substrate is disclosed. The method includes depositing a bonding agent on a first surface of the thin substrate; depositing a bonding agent on a second surface of the carrier substrate; bonding the thin substrate and the carrier substrate with the bonding agent deposited on the first surface and the second surface; performing thin film processing on a third surface of the thin substrate opposite the first surface; and separating the processed thin substrate from the carrier substrate. The thin substrate has a thickness less than a required thickness for sustaining thin film processing while a thickness of the bonded thin substrate and the carrier substrates is greater than or equal to that the required thickness.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: June 23, 2015
    Assignee: Apple Inc.
    Inventors: Casey J. Feinstein, John Z. Zhong, Lynn R. Youngs, Stephen S. Poon
  • Patent number: 8946561
    Abstract: A flexible printed circuit may be provided with an integrated heat and pressure spreading layer. The heat and pressure spreading layer may be configured to uniformly spread heat and pressure from a bonding tool across a portion of the flexible printed circuit during bonding of the flexible printed circuit to additional circuitry. During manufacturing of the flexible printed circuit, a sheet of heat and pressure spreading material may be attached to a sheet of flexible printed circuitry and the heat and pressure spreading material and the sheet of flexible printed circuitry may be die cut to form multiple flexible printed circuits each with a heat and pressure spreading layer. An electronic device may be provided with a flexible printed circuit with a heat and pressure spreading layer coupled to a component such as a display.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: February 3, 2015
    Assignee: Apple Inc.
    Inventors: Joshua G. Wurzel, Casey J. Feinstein
  • Patent number: 8944659
    Abstract: Electronic devices may include assemblies of structures such as electronic device assemblies connected using light-cured liquid adhesive such as ultraviolet-light-cured adhesive. Light guide structures may be mounted in the assemblies. During manufacture of an electronic device, ultraviolet light may be injected into a light guide structure to cure the light-cured liquid adhesive. A light guide structure may include portions that prevent escape of ultraviolet light and portions that allow ultraviolet light to escape into the light-cured liquid adhesive. Light guide structures may include masked portions, rigid support members, and one or more openings. Openings in a light guide structure may allow the light-cured liquid adhesive to be injected into an assembly through the openings. An adhesive applicator may be used to apply the adhesive to portions of the assembly. An external light source may be used to inject light that cures the adhesive into the light guide structures.
    Type: Grant
    Filed: February 21, 2012
    Date of Patent: February 3, 2015
    Assignee: Apple Inc.
    Inventors: Teodor Dabov, Casey J. Feinstein, David A. Pakula, Stephen Brian Lynch
  • Patent number: 8875652
    Abstract: A system for controlling a boundary of spreading liquid adhesive on a surface is disclosed. The system includes one or more ultra-violet (UV) sources configurable to emit UV light onto the liquid adhesive; and a control circuit coupled to the one or more UV sources and configured to control the one or more UV sources to selectively apply the UV light at selected locations on the liquid adhesive to cure the adhesive and prevent its further spread at those locations.
    Type: Grant
    Filed: September 14, 2011
    Date of Patent: November 4, 2014
    Assignee: Apple Inc.
    Inventors: Casey J. Feinstein, Kuo-Hua Sung, Ralf Horstkemper
  • Patent number: 8808483
    Abstract: A method of forming a curved touch surface is disclosed. According to an embodiment, the method includes depositing a touch sensor pattern on a flexible substrate; and curving the flexible substrate, using a chuck surface supporting the flexible substrate, to conform to a shape of a curved cover surface. Then, the curved flexible substrate can be laminated or otherwise adhered to the cover surface. The flexible substrate can be a glass substrate greater than 200 ?m in thickness, and can be reduced to a desired thickness below 200 ?m after the touch sensor pattern is deposited thereon. The flexible substrate can be curved by supporting the flexible substrate on the chuck surface such that the flexible substrate conforms to a shape of the chuck surface, or forcing the flexible substrate against the cover surface, such that the flexible substrate conforms to the shape of the curved cover surface.
    Type: Grant
    Filed: November 5, 2010
    Date of Patent: August 19, 2014
    Assignee: Apple Inc.
    Inventors: Kuo-Hua Sung, Casey J. Feinstein, Silvio Grespan
  • Publication number: 20140196933
    Abstract: Fabrication of thin sheets of glass or other substrate material for use in devices such as touch sensor panels is disclosed. A pair of thick glass sheets, typically with thicknesses of 0.5 mm or greater each, may each be patterned with thin film on a surface, sealed together to form a sandwich with the patterned surfaces facing each other and spaced apart by removable spacers, either or both thinned on their outside surfaces to thicknesses of less than 0.5 mm each, and separated into two thin glass sheets. A single thick glass sheet, typically with a thickness of 0.5 mm or greater, may be patterned, covered with a protective layer over the pattern, thinned on its outside surface to a thickness of less than 0.5 mm, and the protective layer removed. This thinness of less than 0.5 mm may be accomplished using standard LCD equipment, despite the equipment having a sheet minimum thickness requirement of 0.5 mm.
    Type: Application
    Filed: March 14, 2014
    Publication date: July 17, 2014
    Applicant: Apple Inc.
    Inventors: Casey J. Feinstein, John Z. Zhong, Steve Porter Hotelling, Shih Chang Chang
  • Patent number: 8673163
    Abstract: Fabrication of thin sheets of glass or other substrate material for use in devices such as touch sensor panels is disclosed. A pair of thick glass sheets, typically with thicknesses of 0.5 mm or greater each, may each be patterned with thin film on a surface, sealed together to form a sandwich with the patterned surfaces facing each other and spaced apart by removable spacers, either or both thinned on their outside surfaces to thicknesses of less than 0.5 mm each, and separated into two thin glass sheets. A single thick glass sheet, typically with a thickness of 0.5 mm or greater, may be patterned, covered with a protective layer over the pattern, thinned on its outside surface to a thickness of less than 0.5 mm, and the protective layer removed. This thinness of less than 0.5 mm may be accomplished using standard LCD equipment, despite the equipment having a sheet minimum thickness requirement of 0.5 mm.
    Type: Grant
    Filed: June 27, 2008
    Date of Patent: March 18, 2014
    Assignee: Apple Inc.
    Inventors: John Z. Zhong, Casey J. Feinstein, Steve Porter Hotelling, Shih Chang Chang
  • Patent number: 8608896
    Abstract: Methods for liquid adhesive lamination for precision adhesive control are provided. Precision liquid adhesive control can be obtained by first patterning liquid adhesive in a thin pre-coat layer on a substrate. A second adhesive layer can then be patterned on top of the pre-coat layer. When the second substrate is pressed onto the first substrate, the second substrate first comes into contact with the second adhesive layer. The adhesive can then be spread uniformly across the two substrates without forming voids. Alternatively, a single liquid adhesive layer can be formed in a three dimensional gradient pattern.
    Type: Grant
    Filed: September 13, 2011
    Date of Patent: December 17, 2013
    Assignee: Apple Inc.
    Inventors: Ralf Horstkemper, Casey J. Feinstein, Kuo-Hua Sung
  • Publication number: 20130215638
    Abstract: Electronic devices may include assemblies of structures such as electronic device assemblies connected using light-cured liquid adhesive such as ultraviolet-light-cured adhesive. Light guide structures may be mounted in the assemblies. During manufacture of an electronic device, ultraviolet light may be injected into a light guide structure to cure the light-cured liquid adhesive. A light guide structure may include portions that prevent escape of ultraviolet light and portions that allow ultraviolet light to escape into the light-cured liquid adhesive. Light guide structures may include masked portions, rigid support members, and one or more openings. Openings in a light guide structure may allow the light-cured liquid adhesive to be injected into an assembly through the openings. An adhesive applicator may be used to apply the adhesive to portions of the assembly. An external light source may be used to inject light that cures the adhesive into the light guide structures.
    Type: Application
    Filed: February 21, 2012
    Publication date: August 22, 2013
    Inventors: Teodor Dabov, Casey J. Feinstein, David A. Pakula, Stephen Brian Lynch
  • Publication number: 20130180764
    Abstract: A flexible printed circuit may be provided with an integrated heat and pressure spreading layer. The heat and pressure spreading layer may be configured to uniformly spread heat and pressure from a bonding tool across a portion of the flexible printed circuit during bonding of the flexible printed circuit to additional circuitry. During manufacturing of the flexible printed circuit, a sheet of heat and pressure spreading material may be attached to a sheet of flexible printed circuitry and the heat and pressure spreading material and the sheet of flexible printed circuitry may be die cut to form multiple flexible printed circuits each with a heat and pressure spreading layer. An electronic device may be provided with a flexible printed circuit with a heat and pressure spreading layer coupled to a component such as a display.
    Type: Application
    Filed: January 18, 2012
    Publication date: July 18, 2013
    Inventors: Joshua G. Wurzel, Casey J. Feinstein
  • Publication number: 20130068505
    Abstract: Methods for chemically strengthening the edges of glass sheets are provided. Voids can be formed in a mother sheet. The edges of these voids may correspond to a portion of the new edges that would normally be created during separation and free shaping of the mother sheet. The mother sheet can then be immersed in a chemical strengthener. The edges of the voids can be chemically strengthened in addition to the front and back sides of the mother sheet. After thin film processing and separation, each of the resulting individual sheets has been chemically strengthened on both sides and on a portion of its edges.
    Type: Application
    Filed: September 15, 2011
    Publication date: March 21, 2013
    Inventors: Seung Jae Hong, Casey J. Feinstein, Lili Huang, Sunggu Kang, Kuo-Hua Sung, John Z. Zhong
  • Publication number: 20130062011
    Abstract: Methods for liquid adhesive lamination for precision adhesive control are provided. Precision liquid adhesive control can be obtained by first patterning liquid adhesive in a thin pre-coat layer on a substrate. A second adhesive layer can then be patterned on top of the pre-coat layer. When the second substrate is pressed onto the first substrate, the second substrate first comes into contact with the second adhesive layer. The adhesive can then be spread uniformly across the two substrates without forming voids. Alternatively, a single liquid adhesive layer can be formed in a three dimensional gradient pattern.
    Type: Application
    Filed: September 13, 2011
    Publication date: March 14, 2013
    Inventors: Ralf Horstkemper, Casey J. Feinstein, Kuo-Hua Sung
  • Publication number: 20130064967
    Abstract: A system for controlling a boundary of spreading liquid adhesive on a surface is disclosed. The system includes one or more ultra-violet (UV) sources configurable to emit UV light onto the liquid adhesive; and a control circuit coupled to the one or more UV sources and configured to control the one or more UV sources to selectively apply the UV light at selected locations on the liquid adhesive to cure the adhesive and prevent its further spread at those locations.
    Type: Application
    Filed: September 14, 2011
    Publication date: March 14, 2013
    Inventors: CASEY J. FEINSTEIN, Kuo-Hua Sung, Ralf Horstkemper
  • Patent number: 8196636
    Abstract: A method of laminating a surface of a flexible material to a surface of a rigid, curved material. The method includes pressing an area of the surface of the flexible material into the surface of the rigid, curved material with a holder to create a contact area while the flexible material is conformed to the holder, which has a curvature greater than a curvature of the rigid, curved material surface; and changing the contact area between the surface of the flexible material and the surface of the rigid, curved material while maintaining pressure on the contact area until the surface of the flexible material and the surface of the rigid curved material are laminated.
    Type: Grant
    Filed: July 23, 2010
    Date of Patent: June 12, 2012
    Assignee: Apple Inc.
    Inventors: Kuo-Hua Sung, Troy J. Edwards, Casey J. Feinstein, John Z. Zhong, Steven Porter Hotelling, Andrew David Lauder
  • Publication number: 20120111479
    Abstract: A method of forming a curved touch surface is disclosed. According to an embodiment, the method includes depositing a touch sensor pattern on a flexible substrate; and curving the flexible substrate, using a chuck surface supporting the flexible substrate, to conform to a shape of a curved cover surface. Then, the curved flexible substrate can be laminated or otherwise adhered to the cover surface. The flexible substrate can be a glass substrate greater than 200 ?m in thickness, and can be reduced to a desired thickness below 200 ?m after the touch sensor pattern is deposited thereon. The flexible substrate can be curved by supporting the flexible substrate on the chuck surface such that the flexible substrate conforms to a shape of the chuck surface, or forcing the flexible substrate against the cover surface, such that the flexible substrate conforms to the shape of the curved cover surface.
    Type: Application
    Filed: November 5, 2010
    Publication date: May 10, 2012
    Inventors: Kuo-Hua Sung, Casey J. Feinstein, Silvio Grespan