Full perimeter chemical strengthening of substrates
Methods and apparatus for protecting the thin films during chemical and/or thermal edge strengthening treatment. In one embodiment, a portion of each individual sheet is laminated. Pairs of sheets are then sealed together such that the thin film sides face inward to form a thin film sandwich. In some embodiments, the sandwich in then immersed in a chemical strengthener. In other embodiments, a localized treatment is applied to the unstrengthened edges.
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This application is a divisional of U.S. patent application Ser. No. 12/165,336, filed Jun. 30, 2008, the entire disclosure of which is incorporated herein by reference in its entirety.
FIELD OF THE INVENTIONThe present invention relates generally to substrate strengthening. More particularly, the present invention is directed in one exemplary aspect to chemically strengthening the edges of substrates comprising thin film deposits.
BACKGROUND OF THE INVENTIONTouch sensor panels are typically fabricated as one or more thin films deposited and patterned into conductive traces upon one or both sides of a chemically strengthened sheet of glass. However, standard thin film equipment does not allow for thin film deposition on custom-sized or shaped sheets of glass. Instead, thin film deposition occurs on large, rectangular sheets of glass (called mother sheets) which are subsequently separated and shaped into a plurality of individual glass sheets. The individual sheets are typically used in separate electronic devices.
When the mother sheet is separated into individual sheets, however, a new set of edges is formed along each path of separation. Since the new set of edges has not been chemically treated, the individual sheets are susceptible to cracking.
Conventional techniques for chemically strengthening glass require immersion of the sheet into a chemical treatment for a certain period of time and at a certain temperature. In many cases, chemically strengthening the edges is infeasible since the exposed film would be damaged by the chemicals and/or the temperature required for the treatment.
SUMMARY OF THE INVENTIONVarious embodiments of the present invention relate to chemically strengthening the edges of glass sheets having thin films deposited on at least one surface. Thin films are typically deposited and patterned upon discrete regions of a chemically strengthened sheet of glass. This sheet of glass is called a mother sheet. The mother sheet is typically cut into separate sheets, where each sheet is adapted to service a separate electronic component or device.
When the mother sheet is separated, a new set of edges are formed at the path of separation. These edges have not been chemically strengthened and are therefore sensitive to forces exerted upon them. While applying a chemical strengthener to the edges of the sheets would protect the sheets from cracking, this tends to damage exposed regions of the thin film. Moreover, since standard thin film equipment lacks the capability to apply thin film processes to glass in different and/or smaller sizes than a mother sheet, in many cases, the thin film deposition process must precede the separation process.
Various embodiments of the present invention address these concerns by protecting the thin films during the chemical and/or thermal edge strengthening treatment. In one embodiment, a portion of each individual sheet is laminated. Pairs of sheets are then sealed together such that the thin film sides face inward to form a thin film sandwich. In some embodiments, the sandwich in then immersed in a chemical strengthener. In other embodiments, a localized treatment is applied to the unstrengthened edges.
In the following description of preferred embodiments, reference is made to the accompanying drawings in which it is shown by way of illustration specific embodiments in which the invention can be practiced. It is to be understood that other embodiments can be used and structural changes can be made without departing from the scope of the embodiments of this invention.
Various embodiments of the present invention relate to chemically strengthening the edges of glass sheets having thin films deposited on at least one surface. Thin films are typically deposited and patterned upon discrete regions of a chemically strengthened sheet of glass. This sheet of glass is called a mother sheet. The mother sheet is typically cut into separate sheets, where each sheet is adapted to service a separate electronic component or device.
When the mother sheet is separated, a new set of edges are formed at the path of separation. These edges have not been chemically strengthened and are therefore sensitive to forces exerted upon them. While applying a chemical strengthener to the edges of the sheets would protect the sheets from cracking, this tends to damage exposed regions of the thin film. Moreover, since standard thin film equipment lacks the capability to apply thin film processes to glass in different and/or smaller sizes than a mother sheet, in many cases, the thin film deposition process must precede the separation process.
Various embodiments of the present invention address these concerns by protecting the thin films during the chemical and/or thermal edge strengthening treatment. In one embodiment, a portion of each individual sheet is laminated. Pairs of sheets are then sealed together such that the thin film sides face inward to form a thin film sandwich. In some embodiments, the sandwich in then immersed in a chemical strengthener. In other embodiments, a localized treatment is applied to the unstrengthened edges.
Although embodiments of the invention may be described and illustrated herein in terms of touch sensor panels, it should be understood that embodiments of this invention are not so limited, but are additionally applicable to any circuit or communication path formed on a glass substrate or other substrate prone to weakness at an unstrengthened edge.
One or more thin films 104(1) and 104(2) are then deposited upon discrete regions of the target surface 102 and patterned. Note that even though
In some embodiments, at least one of the thin films 104(1) and 104(2) is indium tin oxide (ITO). In some embodiments, other materials are utilized in addition to, or instead of, ITO. These materials include, without limitation, amorphous silicon, copper indium diselenide, cadmium telluride and film crystalline silicon. Optionally, the thin films 104(1) and 104(2) can be protected by one or more passivation layers (organic and/or inorganic). Passivation layers are compositions formed over conductive material and other layers which protect those materials from corrosion and other environmental effects. Various types of passivation can be employed according to embodiments of the present invention. These include, without limitation, passivation layers comprising silicon dioxide (SiO2) and/or silicon nitride (SiNx).
Additionally, any number of means or mechanisms can be used in order to accomplish separation from the mother sheet 100. This includes, without limitation, etching, laser scribing, mechanical scribing, and/or grinding and polishing. In some embodiments, the edges of the separated sheets 106(1) and 106(2) include at least one curved portion (e.g., as depicted by the unstrengthened edges 108(1) and 108(2)). However, the glass sheets may be separated and/or shaped using any pattern or geometry according to embodiments of the present invention. This includes glass shapes having flat edges, cylindrical edges, uneven edges, and edges including extended regions.
Once the individual sheets have been separated, one or more unstrengthened edges 108(1) and 108(2) are formed along the paths of separation (or alternatively, upon the specific surfaces that have been shaped). In several embodiments, such as the one illustrated in
Even though
In other embodiments, the sealing process includes sealing the individual sheets 106(1) and 106(2) with an O-ring or other looped elastomer. This includes, without limitation, clamping two individual sheets 106(1) and 106(2) together with a Viton® or Kalrez® O-ring.
Other forms of sealing are also possible according to embodiments of the present invention. This includes, for example, ties, fasteners, and mechanical clamping devices. Note also that combinations of sealing techniques may also be employed in accordance with embodiments of the present invention (e.g., utilizing an O-ring in addition to a full-face adhesive covering).
Additionally, the localized treatment may include, without limitation, one or more of the following: edge polishes (e.g., as via cerium oxide or other similar compounds), acid polishes, chemical etches (e.g., as via hydrogen fluoride or hydrogen chloride), localized heat treatment (e.g., bringing the glass to its glass transition temperature in the range of 500° C.-620° C.) and/or chemical treatments. In many embodiments, the chemical treatment includes filling flaws in the surface of the glass 106 with an adhesive or other similar substance. In one embodiment, for example, potassium nitrate (KNO3) is applied to the unstrengthened regions at 350° C. The selection of chemical substances and thermal settings depends in part upon the type of thin films and/or conductive materials used.
In other embodiments, a non-localized treatment is used for strengthening. In a non-localized treatment, at least a portion of the sealed sheets 106(1) and 106(2) are immersed in one or more chemical substances and treated at a certain temperature. For example, in one embodiment, the chemical substance comprises potassium nitrate (KNO3) applied to the sheets at approximately 350° C. Note that in the above embodiment, the thin film 104 may comprise any combination of indium tin oxide, metal and/or silicon oxide (SiO2), but without organic passivation layers, which react adversely to the high temperature. In certain embodiments where organic passivation layers are utilized, the temperature settings are adjusted accordingly (for example, in one embodiment, the applied temperature is regulated such that it does not exceed 300° C.).
Once the treatment process has completed, the edges 112(1) and 112(2) of glass sheets 106(1) and 106(2) have been strengthened. In many embodiments, the sealant, adhesive, or other binding mechanism used in the sealing process is then removed and the sealed sheets 106(1) and 106(2) are separated. In some embodiments, for example, the adhesive used to seal the glass sheets 106(1) and 106(2) is chemically resistive to the strengthening agents but mechanically soft (e.g., 3M® reworkable pressure sensitive adhesives). This property enables the adhesive to be pulled out. The result of the strengthening process is shown in
At block 404, the individual sheets in each pair are positioned such that the surface of each sheet including a sensitive region faces each other, and the sandwich is then sealed. A sensitive region includes materials or components which could be damaged or otherwise adversely affected during chemical and/or thermal treatment (e.g., thin film).
In some embodiments, this sealing process comprises applying a sealant or adhesive around the perimeter of the sensitive regions. In other embodiments, the sealing process includes applying an adhesive over all portions of the thin film and then sealing the sheets together. In still other embodiments, the sealing process includes sealing the sheets together with an O-ring, elastomer, or other flexible substance protecting the thin film.
At block 406, each pair of sealed sheets is then chemically strengthened. In some embodiments, this chemical strengthening process includes subjecting each sandwich to an edge polishing procedure, a chemical etch or acid polish procedure, or a localized heat or chemical treatment. In other embodiments, the chemical strengthening process includes immersing the sandwich into a chemical substance at specific temperature settings (e.g., potassium nitrate (KNO3) at 350° C.).
At block 408, the sandwich is then separated. In some embodiments, for example, the adhesive used to seal the glass sheets 106(1) and 106(2) is chemically resistive to the strengthening agents but mechanically soft, which enables the adhesive to be pulled out.
Touch sensor panel 524 can include a capacitive sensing medium having a plurality of drive lines and a plurality of sense lines, although other sensing media can also be used. Each intersection of drive and sense lines can represent a capacitive sensing node and can be viewed as picture element (pixel) 526, which can be particularly useful when touch sensor panel 524 is viewed as capturing an “image” of touch. (In other words, after panel subsystem 506 has determined whether a touch event has been detected at each touch sensor in the touch sensor panel, the pattern of touch sensors in the multi-touch panel at which a touch event occurred can be viewed as an “image” of touch (e.g. a pattern of fingers touching the panel).) Each sense line of touch sensor panel 524 can drive sense channel 508 (also referred to herein as an event detection and demodulation circuit) in panel subsystem 506.
Computing system 500 can also include host processor 528 for receiving outputs from panel processor 502 and performing actions based on the outputs that can include, but are not limited to, moving an object such as a cursor or pointer, scrolling or panning, adjusting control settings, opening a file or document, viewing a menu, making a selection, executing instructions, operating a peripheral device coupled to the host device, answering a telephone call, placing a telephone call, terminating a telephone call, changing the volume or audio settings, storing information related to telephone communications such as addresses, frequently dialed numbers, received calls, missed calls, logging onto a computer or a computer network, permitting authorized individuals access to restricted areas of the computer or computer network, loading a user profile associated with a user's preferred arrangement of the computer desktop, permitting access to web content, launching a particular program, encrypting or decoding a message, and/or the like. Host processor 528 can also perform additional functions that may not be related to panel processing, and can be coupled to program storage 532 and display device 530 such as an LCD display for providing a UI to a user of the device. Display device 530 together with touch sensor panel 524, when located partially or entirely under the touch sensor panel, can form touch screen 518.
Note that one or more of the functions described above can be performed by firmware stored in memory (e.g. one of the peripherals 504 in
Although embodiments of this invention have been fully described with reference to the accompanying drawings, it is to be noted that various changes and modifications will become apparent to those skilled in the art. Such changes and modifications are to be understood as being included within the scope of embodiments of this invention as defined by the appended claims.
Claims
1. An apparatus comprising:
- a first glass substrate having a first surface and a second surface, the second surface created by the separation of the substrate from a larger glass sheet, the first surface previously strengthened with a chemical treatment and the second surface not strengthened with a chemical treatment;
- a second glass substrate having a third surface and a fourth surface, the fourth surface created by the separation of the substrate from the larger glass sheet, the third surface previously strengthened with a chemical treatment and the fourth surface not strengthened with a chemical treatment;
- a first thin film including one or more conductive traces formed on the first surface of the first glass substrate prior to the separation of the first substrate from the larger sheet;
- a second thin film including one or more conductive traces formed on the third surface of the second glass substrate prior to the separation of the second substrate from the larger sheet;
- a first sealant applied to a perimeter area of the first surface and not applied on the conductive traces on the first surface; and
- a second sealant applied to a perimeter area of the third surface and not applied on the conductive traces on the third surface,
- wherein the first sealant is mated with the second sealant to removably seal the first surface with the third surface, and
- wherein the first surface and the third surface are temporarily removably sealed when the first sealant on the first surface mates with the second sealant on the third surface such that the first sealant, the second sealant and the conductive traces occupy substantially all space between the first glass substrate and the second glass substrate.
2. The apparatus of claim 1, wherein the chemical treatment comprises an acid polish.
3. The apparatus of claim 1, wherein the chemical treatment comprises cerium oxide.
4. The apparatus of claim 1, wherein the chemical treatment comprises potassium nitrate.
5. The apparatus of claim 1, wherein the conductive traces include a thin film on conductor.
6. The apparatus of claim 5, wherein the thin film conductor includes one of indium tin oxide, amorphous silicon, copper indium diselenide, cadmium telluride, and film crystalline silicon.
7. The apparatus of claim 1, wherein the chemical treatment includes heating the first and third surface.
8. The apparatus of claim 1, wherein a passivation layer including one of silicon dioxide (SiO2) and silicon nitride (SiNx) is formed over the one or more conductive traces prior to separation.
9. The apparatus of claim 1, wherein the glass substrate is separated from larger glass sheet by a separating mechanism including one of etching, laser scribing, mechanical scribing, and grinding and polishing, the second surface including a surface created by the separating mechanism.
10. The apparatus of claim 1, wherein the second surface includes one of a flat surface, a cylindrical surface, an uneven surface, and a surface including extended regions.
11. The apparatus of claim 1, wherein the sealant includes one of polymer film, polyimide, SU-8, photoresist, reworkable pressure sensitive adhesive, and silicone based adhesive.
12. An apparatus comprising:
- a first glass substrate having a first surface and a second surface, the second surface created by the separation of the substrate from a larger glass sheet, the first surface previously strengthened with a chemical treatment;
- a second glass substrate having a third surface and a fourth surface, the fourth surface created by the separation of the substrate from the larger glass sheet, the third surface previously strengthened with a chemical treatment;
- a thin film including one or more conductive traces formed on the first surface of the first glass substrate and the third surface of the second glass substrate prior to the separation of the substrate from the larger sheet; and
- a temporary removable sealant applied to a perimeter of the first surface and a perimeter of the third surface, wherein the first surface and the third surface are removably sealed when the temporary removable sealant on the first surface mates with the temporary removable sealant on the third surface such that the temporary removable sealant and the conductive traces occupy substantially all space between the first glass substrate and the second glass substrate.
13. The apparatus of claim 12, wherein the temporary removable sealant includes one of polymer film, polyimide, SU-8 photoresist, reworkable pressure sensitive adhesive, and silicone based adhesive.
14. The apparatus of claim 12, wherein the conductive traces include a thin film of conductor.
15. The apparatus of claim 12, wherein the temporary removable sealant is applied to entire perimeter areas of the first surface and the third surface surrounding the conductive traces.
16. An apparatus comprising:
- a first glass substrate having a first surface and a second surface, the second surface created by the separation of the substrate from a larger glass sheet, the first surface previously strengthened with a chemical treatment;
- a second glass substrate having a third surface and a fourth surface, the fourth surface created by the separation of the substrate from the larger glass sheet, the first surface previously strengthened with a chemical treatment;
- a thin film including one or more conductive traces formed on the first surface of the first glass substrate and the third surface of the second glass substrate prior to the separation of the substrate from the larger sheet;
- a temporary removable sealant applied to a perimeter of the first surface and a perimeter of the third surface, wherein the first surface and the third surface are removably sealed when the temporary removable sealant on the first surface mates with the temporary removable sealant on the third surface such that the temporary removable sealant and the conductive traces occupy substantially all space between the first glass substrate and the second glass substrate.
17. The apparatus of claim 16, wherein the temporary removable sealant includes one of polymer film, polymide, SU-8 photoresist, reworkable pressure sensitive adhesive, and silicone based adhesive.
18. The apparatus of claim 16, wherein the temporary removable sealant is applied to entire perimeter areas of the first surface and the third surface surrounding the conductive traces.
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Type: Grant
Filed: Sep 17, 2010
Date of Patent: Dec 8, 2015
Patent Publication Number: 20110005820
Assignee: Apple Inc. (Cupertino, CA)
Inventors: Casey J. Feinstein (San Jose, CA), John Z. Zhong (Cupertino, CA)
Primary Examiner: Erin Snelting
Application Number: 12/885,376
International Classification: B32B 17/06 (20060101); B32B 38/10 (20060101); G06F 3/041 (20060101); C03C 15/00 (20060101); C03C 21/00 (20060101);