Abstract: The present invention relates to a device for testing particles for composition and concentration. The device includes a particle counter, a collector screen, and a mass spectrometer. In one embodiment, the collector screen is positioned to receive particles received by the particle counter, and the mass spectrometer is positioned to receive counted particles retained on the collector screen.

Abstract: A method of preparing a monolithic structure for scanning electron microscope/energy dispersive spectroscopy (SEM/EDS) and a sample produced by way of the method. In one embodiment, the method includes: (1) aiming a focused ion beam at a location behind or beneath an area of interest in the monolithic structure and (2) employing the focused ion beam to remove at least a portion of an interaction volume of material beneath the area of interest. The area of interest preferably remains substantially intact for the spectroscopy.

Abstract: A reflective lens with at least one curved surface formed of polycrystalline material. In an example embodiment a lens structure includes a substrate having a surface of predetermined curvature and a film formed along a surface of the substrate with multiple individual members each having at least one similar orientation relative to the portion of the substrate surface adjacent the member such that collectively the members provide predictable angles for diffraction of x-rays generated from a common source.

Abstract: A non-destructive method for evaluating a topographical feature 16 of an integrated circuit 42, such as a photoresist runner, includes core sectioning the feature to remove a small section 22, without damage to the remainder of the wafer 36 on which the integrated circuit is formed. A tool having fine adjustment, such as a micromanipulator with a rod-shaped probe 24 in the form of a glass needle, is used to remove the section for examination and metrology. The section is separated from the underlying substrate surface 14 and can be examined from all sides. Variations in a critical dimension, such as line width W, along the length L of the section, as well as average measurements of the dimension, can be obtained.

Abstract: A patterned transfer process in the manufacture of a semiconductor device is monitored. Patterned features formed on a semiconductor layer to be etched are scanned for generating a first amplitude modulated waveform intensity signal. The first amplitude modulated waveform intensity signal is sampled to extract a first measurement population of critical dimension measurements. The patterned features are etched and then scanned for generating a second amplitude modulated waveform intensity signal. The second amplitude modulated waveform intensity signal is then sampled to extract a second measurement population of critical dimension measurements, which are then cross-correlated to obtain correlation values of the etching process.