Abstract: In a general aspect, a micromachined gyroscope can include a substrate and a static mass suspended in an x-y plane over the substrate by a plurality of anchors attached to the substrate. The static mass can be attached to the anchors by anchor suspension flexures. The micromachined gyroscope can include a dynamic mass surrounding the static mass and suspended from the static mass by one or more gyroscope suspension flexures.

Abstract: A platform for hermetic heterogeneous integration of passive and active electronic components is provided herein. The platform can include a substrate that provides a hermetic electrical interconnection between integrated circuits and passive devices, such as resistors, capacitors, and inductors. Such substrates can be formed of a dielectric, such as a ceramic, and include electrical interconnects and can further include one or more passive devices. The substrate can include one or more cavities, at least a primary cavity dimensioned to receive an active device and one or more secondary cavities can be included for secondary connector pads for interfacing with the active and passive devices and which can be separately hermetically sealed. The substrate can include a multi-coil inductor defined within alternating layers of the substrate within sidewalls that surround the primary cavity to minimize size of the device package while optimizing the size of the coil.

Abstract: In a general aspect, a micromachined gyroscope can include a substrate and a static mass suspended in an x-y plane over the substrate by a plurality of anchors attached to the substrate. The static mass can be attached to the anchors by anchor suspension flexures. The micromachined gyroscope can include a dynamic mass surrounding the static mass and suspended from the static mass by one or more gyroscope suspension flexures.

Abstract: In a general aspect, a micromachined gyroscope can include a substrate and a static mass suspended in an x-y plane over the substrate by a plurality of anchors attached to the substrate. The static mass can be attached to the anchors by anchor suspension flexures. The micromachined gyroscope can include a dynamic mass surrounding the static mass and suspended from the static mass by one or more gyroscope suspension flexures.

Abstract: Techniques for compensating package stress of a proof mass are provided. In an example, a proof mass can be suspended from a substrate by a proof mass anchor. The first proof mass can have a major surface that defines a first plane. Portions of electrodes forming part of the proof mass can be symmetric with each other across a first line, wherein the first line bisects the first proof mass anchor, extends parallel to the first plane and extends between the first electrode and the second electrode.

Abstract: A micromachined gyroscope includes a dynamic mass suspended from at least one anchor attached to a substrate. The dynamic mass includes a first proof mass and a second proof mass, a first drive actuator configured to drive the first proof mass in a first direction in a rotary oscillation mode of the gyroscope, and second drive actuator configured to drive the second proof mass in an opposite direction in the rotary oscillation mode of the gyroscope.

Abstract: Implementations of an accelerometer component may include: a first Z proof mass rotatable about a first axis and coupled to an anchor, the first Z proof mass including a first plurality of electrodes. Implementations may include a second Z proof mass rotatable about the first axis and coupled to the anchor, the second Z proof mass including a second plurality of electrodes. An X-axis accelerometer subcomponent may be located within a perimeter of the first Z proof mass, and a Y-axis accelerometer subcomponent may be located within a perimeter of the second Z proof mass. The first plurality of electrodes and the second plurality of electrodes may be symmetrical about each of the first axis, a second axis perpendicular to the first axis, a third axis diagonal to the first axis and second axis, and a fourth axis diagonal to the first axis and second axis.

Abstract: In a general aspect, a micromachined gyroscope can include a substrate and a static mass suspended in an x-y plane over the substrate by a plurality of anchors attached to the substrate. The static mass can be attached to the anchors by anchor suspension flexures. The micromachined gyroscope can include a dynamic mass surrounding the static mass and suspended from the static mass by one or more gyroscope suspension flexures.

Abstract: Techniques for compensating package stress of a proof mass are provided. In an example, a proof mass can be suspended from a substrate by a proof mass anchor. The first proof mass can have a major surface that defines a first plane. Portions of electrodes forming part of the proof mass can be symmetric with each other across a first line, wherein the first line bisects the first proof mass anchor, extends parallel to the first plane and extends between the first electrode and the second electrode.

Abstract: This document discusses, among other things, a cap wafer and a via wafer configured to encapsulate a single proof-mass 3-axis gyroscope formed in an x-y plane of a device layer. The single proof-mass 3-axis gyroscope can include a main proof-mass section suspended about a single, central anchor, the main proof-mass section including a radial portion extending outward towards an edge of the 3-axis gyroscope sensor, a central suspension system configured to suspend the 3-axis gyroscope from the single, central anchor, and a drive electrode including a moving portion and a stationary portion, the moving portion coupled to the radial portion, wherein the drive electrode and the central suspension system are configured to oscillate the 3-axis gyroscope about a z-axis normal to the x-y plane at a drive frequency.

Abstract: One example includes an integrated circuit including at least one electrical interconnects disposed on an elongate are extending away from a main portion of the integrated circuit and a microelectromechanical layer including an oscillating portion, the microelectromechanical layer coupled to the main portion of the integrated circuit, wherein the microelectromechanical layer includes a cap comprising a membrane that extends to the integrated circuit.

Abstract: Implementations of an accelerometer component may include: a first Z proof mass rotatable about a first axis and coupled to an anchor, the first Z proof mass including a first plurality of electrodes. Implementations may include a second Z proof mass rotatable about the first axis and coupled to the anchor, the second Z proof mass including a second plurality of electrodes. An X-axis accelerometer subcomponent may be located within a perimeter of the first Z proof mass, and a Y-axis accelerometer subcomponent may be located within a perimeter of the second Z proof mass. The first plurality of electrodes and the second plurality of electrodes may be symmetrical about each of the first axis, a second axis perpendicular to the first axis, a third axis diagonal to the first axis and second axis, and a fourth axis diagonal to the first axis and second axis.

Abstract: A method of fabricating a gyroscope may involve depositing conductive material on a substrate, forming an anchor on the substrate, forming a drive frame on the anchor and forming pairs of drive beams on opposing sides of the anchor. The drive beams may be configured to constrain the drive frame to rotate substantially in the plane of the drive beams. The method may involve forming a proof mass around the drive frame and forming a plurality of sense beams that connect the drive frame to the proof mass. The sense beams may be tapered sense beams having a width that decreases with increasing distance from the anchor. The tapered sense beams may be configured to allow sense motions of the proof mass in a sense plane substantially perpendicular to the plane of the drive beams in response to an applied angular rotation. Some components may be formed from plated metal.

Abstract: This document discusses among other things apparatus and methods for a proof mass including split z-axis portions. An example proof mass can include a center portion configured to anchor the proof-mass to an adjacent layer, a first z-axis portion configure to rotate about a first axis using a first hinge, the first axis parallel to an x-y plane orthogonal to a z-axis, a second z-axis portion configure to rotate about a second axis using a second hinge, the second axis parallel to the x-y plane, wherein the first z-axis portion is configured to rotate independent of the second z-axis portion.

Abstract: This document refers to multi-die micromechanical system (MEMS) packages. In an example, a multi-die MEMS package can include a controller integrated circuit (IC) configured to couple to a circuit board, a MEMS IC mounted to a first side of the controller IC, a through silicon via extending through the controller IC between the first side and a second side of the controller IC, the second side opposite the first side, and wherein the MEMS IC is coupled to the through silicon via.

Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using gyroscopes. Such gyroscopes may include a sense frame, a proof mass disposed outside the sense frame, a pair of anchors and a plurality of drive beams. The plurality of drive beams may be disposed on opposing sides of the sense frame and between the pair of anchors. The drive beams may connect the sense frame to the proof mass. The drive beams may be configured to cause torsional oscillations of the proof mass substantially in a first plane of the drive beams. The sense frame may be substantially decoupled from the drive motions of the proof mass. Such devices may be included in a mobile device, such as a mobile display device.

Abstract: This document discusses, among other things, an inertial measurement system including a device layer including a single proof-mass 3-axis accelerometer, a cap wafer bonded to a first surface of the device layer, and a via wafer bonded to a second surface of the device layer, wherein the cap wafer and the via wafer are configured to encapsulate the single proof-mass 3-axis accelerometer. The single proof-mass 3-axis accelerometer can be suspended about a single, central anchor, and can include separate x, y, and z-axis flexure bearings, wherein the x and y-axis flexure bearings are symmetrical about the single, central anchor and the z-axis flexure is not symmetrical about the single, central anchor.

Abstract: This document discusses, among other things, a cap wafer and a via wafer configured to encapsulate a single proof-mass 3-axis gyroscope formed in an x-y plane of a device layer. The single proof-mass 3-axis gyroscope can include a main proof-mass section suspended about a single, central anchor, the main proof-mass section including a radial portion extending outward towards an edge of the 3-axis gyroscope sensor, a central suspension system configured to suspend the 3-axis gyroscope from the single, central anchor, and a drive electrode including a moving portion and a stationary portion, the moving portion coupled to the radial portion, wherein the drive electrode and the central suspension system are configured to oscillate the 3-axis gyroscope about a z-axis normal to the x-y plane at a drive frequency.

Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using gyroscopes. Such gyroscopes may include a central anchor, a sense frame disposed around the central anchor, a plurality of sense beams configured for connecting the sense frame to the central anchor and a drive frame disposed around and coupled to the sense frame. The gyroscope may include pairs of drive beams disposed on opposing sides of the sense frame. The gyroscope may include a drive frame suspension for substantially restricting a drive motion of the drive frame to that of a substantially linear displacement along the first axis. The sense frame may be substantially decoupled from drive motions of the drive frame. Such devices may be included in a mobile device, such as a mobile display device.

Abstract: An example include microelectromechanical die for sensing motion that includes a fixed portion, an anchor coupled to the fixed portion, a first nonlinear suspension member coupled to anchor on a side of the anchor, a second nonlinear suspension member coupled to the anchor on the same side of the anchor, the second nonlinear suspension member having a shape and location mirroring the first nonlinear suspension member about an anchor bisecting plane and a proof-mass that is planar, the proof mass suspended at least in part by the first nonlinear suspension member and the second nonlinear suspension member such that the proof-mass is rotable about the anchor and is slideable in a plane parallel to the fixed portion.