Abstract: The power supply may be operated during a given cycle sequentially to produce high and low frequency drive signals for operating an ultrasonic transducer for sequentially producing an ultrasonic output at the two frequencies to carry out bonding operations at two different bond sites respectively.

Abstract: The present invention provides a thermally enhanced molded cavity package (10) having a package body (12) with upper (40) and lower (42) sections. The package body (12) has a cavity (22) with the cavity opening (32) in the upper section (40) of the package body (12). The present package (10) includes a lead frame (14) with a plurality of individual leads (16) that are external to the cavity (22) and a plurality of lead fingers (28) that are internal to the cavity (22). The present package (10) also includes a heat spreader (34) for increasing heat dissipation from the package (10) in the lower section (42) of the package body (12) and coupled to the lead frame (14). The heat spreader (34) has a first surface (26) forming a floor of the cavity upon which a microcircuit chip (24) may be mounted and a second surface forming a base (36) of the package body (12).

Abstract: The power supply includes a voltage controlled oscillator, two potentiometers and a by-pass circuit coupled to the output of the voltage controlled oscillator. The two potentiometers form two channels, channel 1 and channel 2, one of which will be selected during the bonding cycle to be coupled to a power amplifier. The output of the power amplifier is adapted to be coupled to an ultrasonic transducer for operating the transducer. Selectable channel 1 and channel 2 reference voltage devices are provided. The voltage and current applied to the amplifier are converted to power. During a bonding cycle, a comparator compares the power applied to the transducer with that of a selected reference voltage and varies the output of the potentiometer of the selected channel to maintain the output of the power amplifier constant during bonding.