Ceramic bonding tool with textured tip

- CoorsTek, Inc.
Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 depicts a perspective view of a ceramic bonding tool with textured tip.

FIG. 2 depicts a side elevation view of the ceramic bonding tool with textured tip of FIG. 1.

FIG. 3 depicts a top plan view of the ceramic bonding tool with textured tip of FIG. 1.

FIG. 4 depicts a bottom plan view of the ceramic bonding tool with textured tip of FIG. 1.

FIG. 5 depicts detailed side elevation view of the ceramic bonding tool with textured tip of FIG. 1.

FIG. 6 depicts a detailed bottom plan view of the ceramic bonding tool with textured tip shown in FIG. 4.

FIG. 7 depicts a detailed side cross-sectional view of the ceramic bonding tool with textured tip, the cross-section taken along cross-section indicator line 7-7 of FIG. 6.

The broken lines in the drawings illustrate environmental structure on the article and form no part of the claimed design.

Claims

The ornamental design for a ceramic bonding tool with textured tip, as shown and described.

Referenced Cited
U.S. Patent Documents
2721250 October 1955 Franklin
3101634 August 1963 Cooper
D213782 April 1969 Knowles
3453142 July 1969 Dorschu
3585352 June 1971 Zvanut
3690538 September 1972 Gaiser et al.
3698646 October 1972 Robba
4030657 June 21, 1977 Scheffer
D255318 June 10, 1980 Bakkeren
4343983 August 10, 1982 Schneider
D269521 June 28, 1983 Braun
4405074 September 20, 1983 Levintov
4411411 October 25, 1983 Barthelmess
4415115 November 15, 1983 James
D271741 December 13, 1983 Riccio
4600138 July 15, 1986 Hill
D297704 September 20, 1988 Bulow
D305720 January 30, 1990 Leech et al.
5217154 June 8, 1993 Elwood et al.
5248076 September 28, 1993 Eisele et al.
5445306 August 29, 1995 Huddleston et al.
5485949 January 23, 1996 Tomura et al.
5683603 November 4, 1997 Fortune
5954260 September 21, 1999 Orcutt
6041995 March 28, 2000 Takahashi et al.
6068174 May 30, 2000 Ball et al.
D431434 October 3, 2000 Yoshimura
6158647 December 12, 2000 Chapman et al.
D444175 June 26, 2001 Omura
6247631 June 19, 2001 Kawakatsu
6260753 July 17, 2001 Renard et al.
6352197 March 5, 2002 Mutaguchi
6457627 October 1, 2002 Komiyama
6511389 January 28, 2003 Ogg
6564989 May 20, 2003 Arakawa
6646228 November 11, 2003 Axinte et al.
6715658 April 6, 2004 Perlberg
6729527 May 4, 2004 Sonnenreich et al.
6910612 June 28, 2005 Perlberg
D517384 March 21, 2006 Ishii et al.
7051915 May 30, 2006 Mutaguchi
7216794 May 15, 2007 Lange et al.
7247588 July 24, 2007 Kwon et al.
7249702 July 31, 2007 Mironescu et al.
D549255 August 21, 2007 Axinte et al.
7261230 August 28, 2007 Harun
7320425 January 22, 2008 Eder
7407080 August 5, 2008 Lee et al.
7500590 March 10, 2009 Mironescu
D598721 August 25, 2009 Meza
7918378 April 5, 2011 Pham
8056794 November 15, 2011 Avraham et al.
D667857 September 25, 2012 Hidaka
8292160 October 23, 2012 Maruya et al.
D697956 January 21, 2014 Davis et al.
D720785 January 6, 2015 Sato
D735787 August 4, 2015 Hassan
D741127 October 20, 2015 Hasenmayer
D744560 December 1, 2015 Hassan
D753739 April 12, 2016 Bell
9455544 September 27, 2016 Gillotti
20040109980 June 10, 2004 Chen
20120045614 February 23, 2012 Chang
20130341874 December 26, 2013 Aykanat
Foreign Patent Documents
S62190343 December 1987 JP
S63080845 May 1988 JP
H11354569 December 1999 JP
2003-68784 March 2003 JP
2004-87822 March 2004 JP
2009-147103 July 2009 JP
2009283814 December 2009 JP
2013-135008 July 2013 JP
201482450 May 2014 JP
2014222729 November 2014 JP
201412448 April 2014 TW
201429600 August 2014 TW
201429601 August 2014 TW
Other references
  • JPS62190343 Japanese Laid-Open Utility Model Publication No. S62-190343, Dec. 3, 1987, NPL.
  • Gaiser Precision Bonding Tools “Thermosonic Capillaries”, pp. 28-40, located at http://www.coorstek.com/markets/semiconductorsequipment/bondingtools/cappillaries.php, catalog published 2006. NPL p. 36.
  • Office Action dated Oct. 6, 2015, issued in Japanese Design Application No. 2015-9731.
  • Information about Related Patents and Patent Applications, see section 6 of the accompanying Information Disclosure Statement Letter, which concerns Related Patents and Patent Applications.
  • Search Report issued on Mar. 15, 2016 in Taiwanese Design Patent Application No. 104304081 (English translation).
  • Search Report issued on Mar. 15, 2016 in Taiwanese Design Patent Application No. 104304080 (English translation).
  • Search Report issued on Mar. 15, 2016 in Taiwanese Design Patent Application No. 104304143 (English translation).
  • Decision to Grant dated Aug. 23, 2016 issued in Japanese Patent Application No. 2016-008037.
  • Decision to Grant dated Aug. 23, 2016 issued in Japanese Patent Application No. 2016-008038.
  • Search Report issued in Taiwan Design Patent Application No. 105302375, dated Jul. 12, 2016.
  • Search Report issued in Taiwan Design Patent Application No. 105302376, dated Jul. 12, 2016.
  • Search Report issued in Taiwan Design Patent Application No. 105302377, dated Jul. 12, 2016.
  • Search Report issued on Dec. 7, 2015 in Taiwanese Design Patent Application No. 104302295 (English Translation provided).
  • Decision of Grant issued on Jan. 26, 2016 in Japanese Design Application No. 2015-21935 with a listing of references considered.
  • Gaiser Precision Bonding Tools “Capillary Wire Bonding”, pp. 5-27, located at http://www.coorstek.com/markets/semiconductorsequipment/bonding-tools/capillaries.php, catalog published 2006.
  • Gaiser Precision Bonding Tools “Thermosonic Capillaries”, pp. 28-40, located at http://www.coorstek.com/markets/semiconductorsequipment/bonding-tools/capillaries.php, catalog published 2006.
  • Gaiser Precision Bonding Tools “Fine-Ptich Capillaries”, pp. 41-59, located at http://www.coorstek.com/markets/semiconductorsequipment/bonding-tools/capillaries.php, catalog published 2006.
  • Decision to Grant date Apr. 19, 2016 issued in Japanese Patent Application No. 2015-016867.
  • Decision to Grant date Apr. 19, 2016 issued in Japanese Patent Application No. 2015-016912.
  • Decision to Grant date Apr. 19, 2016 issued in Japanese Patent Application No. 2015-017097.
  • Decision to Grant dated Apr. 19, 2016 issued in Japanese Patent Application No. 2016-008039.
  • Search Report dated May 13, 2016 issued in Taiwan Application No. 104305492.
  • Gaiser Tool Company “Single Point T.A.B.”, p. 109, catalog vol. 11, published 2000.
Patent History
Patent number: D797172
Type: Grant
Filed: Feb 3, 2015
Date of Patent: Sep 12, 2017
Assignee: CoorsTek, Inc. (Golden, CO)
Inventors: Cesar Alfaro (Lewisville, TX), Russell Bell (Ventura, CA), Anne Cenedella (Evergreen, CO), Steve Govorchin (Superior, CO), Mark S. Greenwell (Ventura, CA), Brian Seegmiller (Arvada, CO), Matthew Simpson (Evergreen, CO)
Primary Examiner: Patricia Palasik
Application Number: 29/516,524
Classifications