Abstract: Embodiments of the invention provide an information input system for a terminal and a multifunctional button assembly for use in the information input system and methods for operating the same. The multifunctional button assembly can include a lever control button, a rotary button and a switch that can be mounted on a substrate. The multifunctional button assembly of the invention can provide advantages in that since the number of functions provided by the multifunctional button assembly is relatively increased, more functions can be concurrently employed, and a terminal employing the multifunctional button assembly can be manufactured to be light, thin, short and compact.

Abstract: A chemical solution dispensing device adapted for use with photo spinner equipment is disclosed. The device includes a nozzle adapted to spray chemical solution onto a wafer, a pressure sensor associated with the nozzle and adapted to sense a spraying pressure and generate a pressure value corresponding to the sensed spraying pressure, and a controller adapted to receive the pressure value, compare the received pressure value to a predetermined threshold pressure value, and generate an interlock signal when the received pressure value exceeds the predetermined threshold pressure value.

Abstract: A system is provided for adjusting a photo-exposure time of a manufacturing apparatus for semiconductor devices. The system for adjusting the photo-exposure time includes a photo-exposure unit whose photo-exposure time is adjustable according to one or more adjustment signals, a pre-exposure step influence prediction unit that obtains pre-exposure step processing information and extracts parameters that may influence a resulting pattern during photo-exposure, and provides this information as feed forward data, an inspection unit that checks processed steps during a certain period after photo-exposure and provides an inspection value as a feed back data, and a central processing unit that receives the feed forward and feedback data and, by means of a predetermined calculation method, generates the one or more adjustment signals, which are used to adjust the photo-exposure time.

Abstract: A semiconductor manufacturing apparatus includes a wafer guide, and a wafer detecting system to determine whether a wafer is properly seated on a hot plate, by detecting temperature variations for the hot plate when the wafer is positioned onto the hot plate.

Abstract: A front panel operating apparatus and method of a vehicle display device such as a car audio can include a main chassis for accommodating an audio device, a front panel provided in the front side of the main chassis that opens or closes to allow access to a record medium for the audio device. The front panel can have a display part in the front side thereof. A supporting panel can be hinge-coupled to a lower side of the front panel to move a lower end of the front panel forward and backward by sliding from a prescribed location of the main chassis in forward and backward directions of the main chassis. A vertical guide can be formed at the front side of the main chassis, and a protrusion formed on the front panel can be inserted into the vertical guide for controllably moving an upper portion of the front panel up and down.

Abstract: A system is provided for adjusting a photo-exposure time of a manufacturing apparatus for semiconductor devices. The system for adjusting the photo-exposure time includes a photo-exposure unit whose photo-exposure time is adjustable according to one or more adjustment signals, a pre-exposure step influence prediction unit that obtains pre-exposure step processing information and extracts parameters that may influence a resulting pattern during photo-exposure, and provides this information as feed forward data, an inspection unit that checks processed steps during a certain period after photo-exposure and provides an inspection value as a feed back data, and a central processing unit that receives the feed forward and feedback data and, by means of a predetermined calculation method, generates the one or more adjustment signals, which are used to adjust the photo-exposure time.

Abstract: A system is provided for adjusting a photo-exposure time of a manufacturing apparatus for semiconductor devices. The system for adjusting the photo-exposure time includes a photo-exposure unit whose photo-exposure time is adjustable according to one or more adjustment signals, a pre-exposure step influence prediction unit that obtains pre-exposure step processing information and extracts parameters that may influence a resulting pattern during photo-exposure, and provides this information as feed forward data, an inspection unit that checks processed steps during a certain period after photo-exposure and provides an inspection value as a feed back data, and a central processing unit that receives the feed forward and feedback data and, by means of a predetermined calculation method, generates the one or more adjustment signals, which are used to adjust the photo-exposure time.

Abstract: A semiconductor wafer overlay correction method for an exposure process in a semiconductor fabricating stepper incorporates variations in equipment characteristics with time. The wafer overlay correction method includes measuring an overlay error correction value of a semiconductor wafer that is exposed by the stepper, calculating an overlay error correction value by summing the measured overlay error correction value, a variation in the stepper characteristics that is obtained through an empirical characterization of input changes, and a weighting value obtained from a predetermined plurality of wafer lots, and providing the calculated overlay error correction value to the semiconductor fabricating stepper to control an exposure process of a subsequent wafer lot.

Abstract: In a method for controlling a processing apparatus, an error value between an input value of the processing apparatus for processing a subject to be processed, and a measurement value obtained by measuring the subject being processed is obtained. A correction value is computed for correcting the input value of the processing apparatus in the direction of decreasing the error value, and the values are managed as processing data to be utilized in computing a next correction value. Previous processing data having a history identical to that of the subject loaded to the processing apparatus is searched, and a current bias correction value is predicted from a plurality of most recent correction values having the identical history. Also, a current random correction value is predicted by means of a neural network on the basis of a plurality of most recent random correction values. The predicted bias correction value is summed with the random correction value as a current correction value of the processing apparatus.

Abstract: A front panel operating apparatus and method of a vehicle display device such as a car audio can include a main chassis for accommodating an audio device, a front panel provided in the front side of the main chassis that opens or closes to allow access to a record medium for the audio device. The front panel can have a display part in the front side thereof. A supporting panel can be hinge-coupled to a lower side of the front panel to move a lower end of the front panel forward and backward by sliding from a prescribed location of the main chassis in forward and backward directions of the main chassis. A vertical guide can be formed at the front side of the main chassis, and a protrusion formed on the front panel can be inserted into the vertical guide for controllably moving an upper portion of the front panel up and down.

Abstract: A semiconductor wafer overlay correction method for an exposure process in a semiconductor fabricating stepper incorporates variations in equipment characteristics with time. The wafer overlay correction method includes measuring an overlay error correction value of a semiconductor wafer that is exposed by the stepper, calculating an overlay error correction value by summing the measured overlay error correction value, a variation in the stepper characteristics that is obtained through an empirical characterization of input changes, and a weighting value obtained from a predetermined plurality of wafer lots, and providing the calculated overlay error correction value to the semiconductor fabricating stepper to control an exposure process of a subsequent wafer lot.

Abstract: In a method for controlling a processing apparatus, an error value between an input value of the processing apparatus for processing a subject to be processed, and a measurement value obtained by measuring the subject being processed is obtained. A correction value is computed for correcting the input value of the processing apparatus in the direction of decreasing the error value, and the values are managed as processing data to be utilized in computing a next correction value. Previous processing data having a history identical to that of the subject loaded to the processing apparatus is searched, and a current bias correction value is predicted from a plurality of most recent correction values having the identical history. Also, a current random correction value is predicted by means of a neural network on the basis of a plurality of most recent random correction values. The predicted bias correction value is summed with the random correction value as a current correction value of the processing apparatus.

Abstract: A lithography system includes a spinner, a first controller, a stepper and a second controller. The spinner coats a photoresist film on a semiconductor substrate. The first controller sets a first optimal process parameter according to external information regarding the semiconductor wafer and controls the spinner according to the first optimal process parameter, when the semiconductor wafer is loaded into the spinner. The stepper exposes the semiconductor wafer, which is coated with the photoresist film, to light of a predetermined wavelength. The second controller sets a second optimal process parameter according to the external information regarding the semiconductor wafer and controls the stepper according to the second optimal process parameter, when the semiconductor wafer coated with the photoresist film is loaded into the stepper.

Abstract: To heat an object, a first solid heat transfer medium is supplied with heat. The heat is transmitted from the first solid heat transfer medium to a fluid heat transfer medium which is partitioned into an interconnected plurality of evaporation cavities each containing a liquid. The heat causes the liquid to evaporate into a plurality of vapor parts in the respective plurality of evaporation cavities, and the plurality of vapor parts are guided in parallel in an upward direction towards the object. The vapor parts contact a second solid heat transfer medium to heat the second solid heat transfer medium, thereby transmitting the heat to the second solid heat transfer medium. The second solid heat transfer medium is thermally contacted with the object to transmit the heat from the second solid heat transfer medium to the object.

Abstract: A system is provided for adjusting a photo-exposure time of a manufacturing apparatus for semiconductor devices. The system for adjusting the photo-exposure time includes a photo-exposure unit whose photo-exposure time is adjustable according to one or more adjustment signals, a pre-exposure step influence prediction unit that obtains pre-exposure step processing information and extracts parameters that may influence a resulting pattern during photo-exposure, and provides this information as feed forward data, an inspection unit that checks processed steps during a certain period after photo-exposure and provides an inspection value as a feed back data, and a central processing unit that receives the feed forward and feedback data and, by means of a predetermined calculation method, generates the one or more adjustment signals, which are used to adjust the photo-exposure time.