Patents by Inventor Chan Hyo Park

Chan Hyo Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210313214
    Abstract: According to the present invention, a stack comprises, between a carrier substrate and a flexible substrate layer, a peeling power adjustment layer comprising polyimide, which has a refractive index higher than that of the flexible substrate layer, so that a flexible substrate can be more easily peeled from a carrier substrate layer, and thus a flexible element can be manufactured without damage to the element through a simpler process.
    Type: Application
    Filed: November 19, 2019
    Publication date: October 7, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Chae Won PARK, Jinho LEE, Chan Hyo PARK
  • Publication number: 20210230368
    Abstract: The present disclosure relates to a polyimide-based resin film which is synthesized by the reaction of an acid anhydride compound having a specific structure and a diamine compound, thereby capable of ensuring excellent optical properties even under high temperature heat treatment conditions, and stably maintaining optical properties even during further heat treatment, a substrate for display device, and an optical device using the same.
    Type: Application
    Filed: January 28, 2020
    Publication date: July 29, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Kyunghwan KIM, Chan Hyo PARK
  • Publication number: 20210214501
    Abstract: The present disclosure relates to a polyimide-based resin film which is synthesized by the reaction of an acid anhydride compound and a diamine compound having a specific structure, thereby capable of ensuring excellent flatness even under high temperature heat treatment conditions, and stably maintaining flatness even during further heat treatment, a substrate for display device, and an optical device using the same.
    Type: Application
    Filed: January 28, 2020
    Publication date: July 15, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Kyunghwan KIM, Chan Hyo PARK
  • Publication number: 20210147679
    Abstract: Provided according to the present invention is a substrate for a flexible display device in which the problems of threshold voltage shift-induced current fluctuation and resultant image sticking can be solved by introducing an imide monomer as an organic filler into a polyamic acid composition to enhance thickness and surface direction densities in the film that is manufactured while vulcanization is performed at high temperatures, thereby enhancing thermal diffusivity and thermal conductivity of the film.
    Type: Application
    Filed: January 23, 2019
    Publication date: May 20, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Kyunghwan KIM, Hye Won JEONG, Chan Hyo PARK, Jinyoung PARK
  • Patent number: 10882957
    Abstract: A method for producing a device substrate by obtaining a laminate comprising a carrier substrate with a first polyimide film disposed on at least one surface of the carrier substrate, a second polyimide film disposed on the first polyimide film, applying a physical stimulus to the second polyimide film without causing chemical changes in the first polyimide film such that the adhesive strength of the first polyimide to the second polyimide film decreases and separating the second polyimide film from the first polyimide film formed on the carrier substrate to obtain the device.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: January 5, 2021
    Assignee: LG CHEM, LTD.
    Inventors: Hye Won Jeong, Kyungjun Kim, Kyoung Hoon Kim, Chan Hyo Park, BoRa Shin, Seung Yup Lee, HangAh Park, JinHo Lee, MiRa Im
  • Publication number: 20200347184
    Abstract: A polyimide precursor solution containing a reaction product of tetracarboxylic acid anhydride and diamine in a molar ratio of 1:0.93 to 1:0.99. The polyimide precursor solution contains a polyimide precursor having a number average molecular weight of at least 38,000 g/mol and can thus produce a polyimide film having high heat resistance. A polyimide precursor solution having improved storage stability can be provided by quantifying the defoaming properties of the solution and controlling the content of bubbles. Moreover, a polyimide film produced therefrom has a reduced amount of bubbles in the film, and can thus suppress the formation of cracks that can form in an inorganic layer when forming a device.
    Type: Application
    Filed: September 26, 2019
    Publication date: November 5, 2020
    Applicant: LG CHEM, LTD.
    Inventors: Jinho LEE, Jinyoung PARK, Chae Won PARK, Chan Hyo PARK
  • Publication number: 20200165452
    Abstract: A polyimide film according to the present invention can be effectively used as a substrate for a flexible display device without a deterioration in heat resistance even at a temperature of 350° C. or higher since a coefficient of thermal expansion (A) in the section of 100-350° C., of the polyimide film, and a coefficient of thermal expansion (B) in the section of 350-450° C.
    Type: Application
    Filed: August 27, 2018
    Publication date: May 28, 2020
    Applicant: LG CHEM, LTD.
    Inventors: Hye Won JEONG, Chan Hyo PARK, Jinho LEE, Jinyoung PARK, Kyunghwan KIM, Ye Ji HONG, Danbi CHOI
  • Patent number: 10414869
    Abstract: The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a debonding layer including a polyimide resin between a carrier substrate and a flexible substrate. The adhesive strength of the debonding layer to the flexible substrate is changed by a physical stimulus. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device. In addition, the device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. This ensures improved characteristics and high reliability of the device.
    Type: Grant
    Filed: April 8, 2014
    Date of Patent: September 17, 2019
    Assignee: LG CHEM, LTD.
    Inventors: Hye Won Jeong, Kyungjun Kim, Kyoung Hoon Kim, Chan Hyo Park, BoRa Shin, Seung Yup Lee, HangAh Park, JinHo Lee, MiRa Im
  • Publication number: 20190048143
    Abstract: The present invention can provide a method for manufacturing a polyimide with improved thermal stability that has no contraction even at a high temperature, by adjusting the amount of an acid anhydride in the preparation of a polyimide precursor, and a polyimide film manufactured by the method causes residual stress in a substrate during a high-temperature thermal treatment procedure, thereby suppressing the occurrence of problems, such as cracks in an inorganic film or delamination of a film.
    Type: Application
    Filed: March 27, 2017
    Publication date: February 14, 2019
    Applicant: LG CHEM, LTD.
    Inventors: Ye Ji HONG, Kyungjun KIM, Jinyoung PARK, Chan Hyo PARK, Jin Ho LEE
  • Publication number: 20180334541
    Abstract: A method for producing a device substrate by obtaining a laminate comprising a carrier substrate, a first polyimide film comprising a first polyimide resin disposed on at least one surface of the carrier substrate, a second polyimide film disposed on the first polyimide film opposite to the surface of the first polyimide film formed on a surface of the carrier substrate; applying a physical stimulus to the second polyimide film without causing chemical changes in the first polyimide film such that the cross-sections of the second polyimide film are exposed and cross-sectional surfaces of the first polyimide film are not exposed and no physical stimulus is applied to the surface of the carrier substrate, wherein the adhesive strength of the first polyimide to the second polyimide film decreases when the second polyimide film in the laminate is cut to expose cross-sectional surfaces of the second polyimide film; and separating the second polyimide film from the first polyimide film formed on the carrier substra
    Type: Application
    Filed: July 27, 2018
    Publication date: November 22, 2018
    Applicant: LG CHEM, LTD.
    Inventors: Hye Won JEONG, Kyungjun KIM, Kyoung Hoon KIM, Chan Hyo PARK, BoRa SHIN, Seung Yup LEE, HangAh PARK, JinHo LEE, MiRa IM
  • Patent number: 10035883
    Abstract: The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a first polyimide resin layer between a carrier substrate and a second polyimide resin layer, wherein the first polyimide resin layer has a coefficient of thermal expansion (CTE) equal to or lower than the CTE of the second polyimide-based resin layer at a temperature of 100 to 200° C., and the adhesive strength of the first resin layer to the second resin layer decreases when a physical stimulus causing no chemical changes in the first resin layer is applied to the laminate. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device.
    Type: Grant
    Filed: April 8, 2014
    Date of Patent: July 31, 2018
    Assignee: LG CHEM, LTD.
    Inventors: Hye Won Jeong, Kyungjun Kim, Kyoung Hoon Kim, Chan Hyo Park, BoRa Shin, Seung Yup Lee, HangAh Park, JinHo Lee, MiRa Im
  • Patent number: 9611358
    Abstract: The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a debonding layer including a polyimide resin having a similarity score not greater than 0.5, as calculated by Equation 1 defined in the detailed description, between a carrier substrate and a flexible substrate. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device. In addition, the device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. This ensures improved characteristics and high reliability of the device.
    Type: Grant
    Filed: April 8, 2014
    Date of Patent: April 4, 2017
    Assignee: LG CHEM, LTD.
    Inventors: Hye Won Jeong, Kyungjun Kim, Kyoung Hoon Kim, Chan Hyo Park, BoRa Shin, Seung Yup Lee, HangAh Park, JinHo Lee, MiRa Im
  • Publication number: 20150239210
    Abstract: The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a debonding layer including a polyimide resin between a carrier substrate and a flexible substrate. The adhesive strength of the debonding layer to the flexible substrate is changed by a physical stimulus. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device. In addition, the device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. This ensures improved characteristics and high reliability of the device.
    Type: Application
    Filed: April 8, 2014
    Publication date: August 27, 2015
    Applicant: LG CHEM, LTD.
    Inventors: Hye Won Jeong, Kyungjun Kim, Kyoung Hoon Kim, Chan Hyo Park, BoRa Shin, Seung Yup Lee, HangAh Park, JinHo Lee, MiRa Im
  • Publication number: 20150232621
    Abstract: The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a debonding layer including a polyimide resin having a similarity score not greater than 0.5, as calculated by Equation 1 defined in the detailed description, between a carrier substrate and a flexible substrate. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device. In addition, the device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. This ensures improved characteristics and high reliability of the device.
    Type: Application
    Filed: April 8, 2014
    Publication date: August 20, 2015
    Applicant: LG CHEM, LTD.
    Inventors: Hye Won Jeong, Kyungjun Kim, Kyoung Hoon Kim, Chan Hyo Park, BoRa Shin, Seung Yup Lee, HangAh Park, JinHo Lee, MiRa Im
  • Patent number: 9104106
    Abstract: The present invention relates to a negative photoresist composition and a patterning method for device in which a photoresist pattern having a high sensitivity with a good reverse taper profile can be formed not only to realize an effective patterning of various thin films but also to facilitate removal of the photoresist pattern after the patterning. The photoresist composition comprises an alkali-soluble binder resin; a halogen-containing first photo-acid generator; a triazine-based second photo-acid generator; a cross-linking agent having an alkoxy structure; and a solvent.
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: August 11, 2015
    Assignee: LG CHEM, LTD.
    Inventors: Chan-Hyo Park, Kyung-Jun Kim, Yu-Na Kim
  • Publication number: 20150210048
    Abstract: The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a first polyimide resin layer between a carrier substrate and a second polyimide resin layer, wherein the first polyimide resin layer has a coefficient of thermal expansion (CTE) equal to or lower than the CTE of the second polyimide-based resin layer at a temperature of 100 to 200° C., and the adhesive strength of the first resin layer to the second resin layer decreases when a physical stimulus causing no chemical changes in the first resin layer is applied to the laminate. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device.
    Type: Application
    Filed: April 8, 2014
    Publication date: July 30, 2015
    Applicant: LG CHEM, LTD.
    Inventors: Hye Won Jeong, Kyungjun Kim, Kyoung Hoon Kim, Chan Hyo Park, BoRa Shin, Seung Yup Lee, HangAh Park, JinHo Lee, MiRa Im
  • Publication number: 20150024327
    Abstract: The present invention relates to a negative photoresist composition and a patterning method for device in which a photoresist pattern having a high sensitivity with a good reverse taper profile can be formed not only to realize an effective patterning of various thin films but also to facilitate removal of the photoresist pattern after the patterning. The photoresist composition comprises an alkali-soluble binder resin; a halogen-containing first photo-acid generator; a triazine-based second photo-acid generator; a cross-linking agent having an alkoxy structure; and a solvent.
    Type: Application
    Filed: July 24, 2014
    Publication date: January 22, 2015
    Applicant: LG CHEM, LTD.
    Inventors: Chan-Hyo PARK, Kyung-Jun KIM, Yu-Na KIM
  • Publication number: 20140296408
    Abstract: The present invention relates to insulating material for an electronic device that may inhibit damage to an electronic device due to a high temperature curing process, and simultaneously exhibit excellent properties and reliability. The insulating material for an electronic device comprises soluble polyimide resin comprising a specific repeat unit, exhibits imidization degree of 70% or more after curing at a temperature of 250° C., and comprises a low boiling point solvent having boiling point of 130 to 180° C. as a residual solvent.
    Type: Application
    Filed: January 11, 2013
    Publication date: October 2, 2014
    Applicant: LG CHEM, LTD.
    Inventors: Sang-Woo Kim, Mi-Ra Im, Kyung-Jun Kim, Chan-Hyo Park, Kyou-Hyun Nam
  • Publication number: 20140256876
    Abstract: The present invention relates to insulating material for an electronic device that may inhibit damage to electronic devices by a high temperature curing process, and simultaneously contribute to improvement in reliability of electronic devices. The insulating material for an electronic device comprises soluble polyimide resin comprising a specific repeat unit, and a residual solvent comprising a low boiling point solvent having boiling point of 130 to 180° C., wherein after curing at a temperature of 250° C. or less, the amount of outgassing is 4 ppm or less based on total weight of the soluble polyimide resin, and the amount of outgassing derived from water or alcohol is less than 0.1 ppm.
    Type: Application
    Filed: January 11, 2013
    Publication date: September 11, 2014
    Applicant: LG CHEM, LTD.
    Inventors: Sang-Woo Kim, Mi-Ra Im, Kyung-Jun Kim, Chan-Hyo Park, Kyou-Hyun Nam
  • Patent number: 8795943
    Abstract: The present invention relates to a negative photoresist composition and a patterning method for device in which a photoresist pattern having a high sensitivity with a good reverse taper profile can be formed not only to realize an effective patterning of various thin films but also to facilitate removal of the photoresist pattern after the patterning. The photoresist composition comprises an alkali-soluble binder resin; a halogen-containing first photo-acid generator; a triazine-based second photo-acid generator; a cross-linking agent having an alkoxy structure; and a solvent.
    Type: Grant
    Filed: May 4, 2011
    Date of Patent: August 5, 2014
    Assignee: LG Chem, Ltd.
    Inventors: Chan-Hyo Park, Kyung-Jun Kim, Yu-Na Kim