Patents by Inventor Chan WU

Chan WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260165073
    Abstract: This disclosure describes systems and methods for designing a wafer annealing chamber that combines laminar or near laminar purge gas flows across the wafer, higher flow and pressure in the upper portion of the chamber, and a specific progression of the lasing pattern relative to the purge gas laminar flow direction.
    Type: Application
    Filed: January 27, 2025
    Publication date: June 11, 2026
    Inventors: Chan Wu, Toby Rule
  • Publication number: 20260165062
    Abstract: This disclosure describes systems and methods for an annealing chamber that reduces oxygen infiltration from ambient air during the loading and unloading of a wafer. The wafer annealing chamber has an auxiliary port that is perpendicular to a plurality of exhaust ports. When the loading door is open, the plurality of exhaust ports are closed, and a pressurized zone is generated adjacent to the auxiliary port, in a throat of the annealing chamber.
    Type: Application
    Filed: January 27, 2025
    Publication date: June 11, 2026
    Inventors: Chan Wu, Toby Rule
  • Patent number: 12525454
    Abstract: A semiconductor wafer processing method, having: ablating a back side of a semiconductor wafer with a laser ablation process; and etching the back side of the semiconductor wafer with an etching process; wherein the laser ablation process forms a pattern in the back side of the semiconductor wafer; wherein the etching process preserves the pattern in the back side of the semiconductor wafer.
    Type: Grant
    Filed: May 23, 2022
    Date of Patent: January 13, 2026
    Assignee: Monolithic Power Systems, Inc.
    Inventors: Sudarsan Uppili, Vipindas Pala, Carl Johnson, Chan Wu, John Trepl, II
  • Publication number: 20220406601
    Abstract: A semiconductor wafer processing method, having: ablating a back side of a semiconductor wafer with a laser ablation process; and etching the back side of the semiconductor wafer with an etching process; wherein the laser ablation process forms a pattern in the back side of the semiconductor wafer; wherein the etching process preserves the pattern in the back side of the semiconductor wafer.
    Type: Application
    Filed: May 23, 2022
    Publication date: December 22, 2022
    Inventors: Sudarsan Uppili, Vipindas Pala, Carl Johnson, Chan Wu, John Trepl II
  • Patent number: 10314923
    Abstract: A silybin injection contains silybin, sulfobutyl ether-?-cyclodextrin, an organic solvent for injection, a pH regulator, and may further contain a co-solvent, a lyophilization bulking agent, and water for injection.
    Type: Grant
    Filed: December 24, 2015
    Date of Patent: June 11, 2019
    Assignee: Tasly Pharmaceutical Group Co., Ltd.
    Inventors: Jianming Chen, Baoan Gao, Qinqin Zhou, Shuiping Zhou, Nan Cai, Yuansheng Zhang, Chan Wu, Nong Yu, Lina Chen, Wenli Liu
  • Publication number: 20180000965
    Abstract: A silybin injection contains silybin, sulfobutyl ether-?-cyclodextrin, an organic solvent for injection and may further contain a co-solvent, a lyophilization proppant, a pH regulator, water for injection and the like.
    Type: Application
    Filed: December 24, 2015
    Publication date: January 4, 2018
    Inventors: Jianming CHEN, Baoan GAO, Qinqin ZHOU, Shuiping ZHOU, Nan CAI, Yuansheng ZHANG, Chan WU, Nong YU, Lina CHEN, Wenli LIU