Abstract: A power supply unit supplies power to a load, and the power supply unit includes a power factor corrector, a DC conversion module, and an isolated conversion module. The power factor corrector is plugged into a first main circuit board and converts an AC power into a DC power. The DC conversion module is plugged into the first main circuit board and converts the DC power into a main power. The isolated conversion module includes a bus capacitor, the bus capacitor is coupled to the DC conversion module through a first power copper bar, and coupled to the power factor corrector through a second power copper bar. The first power copper bar and the second power copper bar are arranged on a side opposite to the first main circuit board, and are arranged in parallel with the first main circuit board.

Abstract: A device includes a semiconductor fin, and a gate stack on sidewalls and a top surface of the semiconductor fin. The gate stack includes a high-k dielectric layer, a work-function layer overlapping a bottom portion of the high-k dielectric layer, and a blocking layer overlapping a second bottom portion of the work-function layer. A low-resistance metal layer overlaps and contacts the work-function layer and the blocking layer. The low-resistance metal layer has a resistivity value lower than second resistivity values of both of the work-function layer and the blocking layer. A gate spacer contacts a sidewall of the gate stack.

Abstract: Provided are a passivation layer for forming a semiconductor bonding structure, a sputtering target making the same, a semiconductor bonding structure and a semiconductor bonding process. The passivation layer is formed on a bonding substrate by sputtering the sputtering target; the passivation layer and the sputtering target comprise a first metal, a second metal or a combination thereof. The bonding substrate comprises a third metal. Based on a total atom number of the surface of the passivation layer, O content of the surface of the passivation layer is less than 30 at %; the third metal content of the surface of the passivation layer is less than or equal to 10 at %. The passivation layer has a polycrystalline structure. The semiconductor bonding structure sequentially comprises a first bonding substrate, a bonding layer and a second bonding substrate: the bonding layer is mainly formed by the passivation layer and the third metal.

Abstract: Embodiments of the present invention provide a method for sharing an application between terminals. The method includes: generating, by a first terminal according to an application that has been installed, a shared application installation package of the application; sending, by the first terminal, the shared application installation package to a second terminal; determining, by the first terminal, shared data of the application that has been installed, where the shared data is data that is from an application server and required for the application to run; and sending, by the first terminal, the shared data to the second terminal. In the embodiments of the present invention, when sharing an application, two terminals not only share an installation package of the application, but also share shared data of the application.

Abstract: An inductor is disclosed, the inductor comprising: a T-shaped magnetic core, being made of a material comprising an annealed soft magnetic metal material and having a base and a pillar integrally formed with the base, wherein ?C×Hsat?1800, where ?C is a permeability of the T-shaped magnetic core, and Hsat (Oe) is a strength of the magnetic field at 80% of ?C0, where ?C0 is the permeability of the T-shaped magnetic core when the strength of the magnetic field is 0.

Abstract: Spacecraft propulsion systems and methods featuring a first storage tank containing a metallic propellant and a second storage tank containing a non-metallic propellant are provided. A selected one of the metallic propellant and the non-metallic propellant is supplied to an electric propulsion thruster, depending on an operational mode of the spacecraft. The metallic propellant is stored at a relatively high density, while the non-metallic propellant is stored at a lower density than the metallic propellant. Moreover, the non-metallic propellant is preferably utilized to produce thrust through the electric propulsion thruster during operational maneuvers, while the metallic propellant is reserved for producing thrust through the electric propulsion thruster during end-of-life, such as deorbiting, maneuvers.

Abstract: Some implementations described herein include systems and techniques for fabricating a wafer-on-wafer product using a filled lateral gap between beveled regions of wafers included in a stacked-wafer assembly and along a perimeter region of the stacked-wafer assembly. The systems and techniques include a deposition tool having an electrode with a protrusion that enhances an electromagnetic field along the perimeter region of the stacked-wafer assembly during a deposition operation performed by the deposition tool. Relative to an electromagnetic field generated by a deposition tool not including the electrode with the protrusion, the enhanced electromagnetic field improves the deposition operation so that a supporting fill material may be sufficiently deposited.

Abstract: The present disclosure, in some embodiments, relates to a method of forming an integrated chip structure. The method may be performed by forming a plurality of interconnect layers within a first interconnect structure disposed over an upper surface of a first semiconductor substrate. An edge trimming process is performed to remove parts of the first interconnect structure and the first semiconductor substrate along a perimeter of the first semiconductor substrate. The edge trimming process results in the first semiconductor substrate having a recessed surface coupled to the upper surface by way of an interior sidewall disposed directly over the first semiconductor substrate. A dielectric capping structure is formed onto a sidewall of the first interconnect structure after performing the edge trimming process.

Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: A device includes a semiconductor fin, and a gate stack on sidewalls and a top surface of the semiconductor fin. The gate stack includes a high-k dielectric layer, a work-function layer overlapping a bottom portion of the high-k dielectric layer, and a blocking layer overlapping a second bottom portion of the work-function layer. A low-resistance metal layer overlaps and contacts the work-function layer and the blocking layer. The low-resistance metal layer has a resistivity value lower than second resistivity values of both of the work-function layer and the blocking layer. A gate spacer contacts a sidewall of the gate stack.

Abstract: A lighting module, an electronic device, and a display panel are provided. The lighting module includes a carrier, a first metal circuit layer, a first transparent conductive layer, a first insulating layer, a second transparent conductive layer, a second metal circuit layer, a bonding structure layer, and a plurality of lighting units. The bonding structure layer is configured to allow the second metal circuit layer to be well bonded to the first insulating layer, so that a resistance value of the lighting module is decreased, and a pressure drop is reduced.

Abstract: Disclosed herein is an anti-biofouling copolymer including a first structural unit represented by formula (I) and a second structural unit represented by formula (II), wherein each of the substituents is given the definition as set forth in the Specification and Claims. Also disclosed herein is a method for preparing an anti-biofouling copolymer which includes subjecting a first compound represented by formula (a) to polymerization reaction with a second compound represented by formula (b), wherein each of the substituents is given the definition as set forth in the Specification and Claims.

Abstract: Disclosed herein is an anti-biofouling copolymer including a first structural unit represented by formula (I) and a second structural unit represented by formula (II), wherein each of the substituents is given the definition as set forth in the Specification and Claims. Also disclosed herein is a method for preparing an anti-biofouling copolymer which includes subjecting a first compound represented by formula (a) to polymerization reaction with a second compound represented by formula (b), wherein each of the substituents is given the definition as set forth in the Specification and Claims.

Abstract: A wireless charger, comprising: a thermal-conductive plastic cover; a first circuit board; and a metallic case, wherein the first circuit board are disposed in the metallic case, wherein a wind tunnel is formed between the thermal-conductive plastic cover and the circuit board for lowering the temperature of an electronic device that is wirelessly charged on the thermal-conductive plastic cover.

Abstract: A semiconductor wafer processing method, having: ablating a back side of a semiconductor wafer with a laser ablation process; and etching the back side of the semiconductor wafer with an etching process; wherein the laser ablation process forms a pattern in the back side of the semiconductor wafer; wherein the etching process preserves the pattern in the back side of the semiconductor wafer.

Abstract: a wireless charger, comprising: a top cover for placing an electronic device thereon; at least one coil, disposed under the top cover; and a first magnet embedded inside the top cover for aligning with a second magnet of the electronic device for wireless charging the electronic device.

Abstract: A power supply device includes a power supply housing having an accommodating space and an accommodating opening, a hybrid wire-to-wire connector structure and a circuit board disposed in the accommodating space. The hybrid wire-to-wire connector structure includes a connecting seat and an adapter seat. The connecting seat has a signal line terminal and a power line terminal. The connecting seat is disposed in the accommodating opening through an annular rib. The adapter seat has a signal conduction end and a power conduction end. The adapter seat has formed a hook corresponding to the annular rib. The connecting seat and the adapter seat are combined through the signal conduction end inserted in the signal line terminal, the power conduction end inserted in the power line terminal and the hook clamped with the annular rib. Therefore, the power and signal connectors are integrated so as to simplify the assembly.

Abstract: A wireless charger, comprising: a thermal-conductive plastic cover; a first circuit board; and a metallic case, wherein the first circuit board are disposed in the metallic case, wherein a wind tunnel is formed between the thermal-conductive plastic cover and the circuit board for lowering the temperature of an electronic device that is wirelessly charged on the thermal-conductive plastic cover.

Abstract: An electronic device including a core, at least a wire and a magnetic material is provided. The core includes a pillar, a top board and a bottom board. The pillar is disposed between the top board and the bottom board. A winding space is formed among the top board, the bottom board and the pillar. The wire is wound around the pillar and located in the winding space. The magnetic material fills the winding space to encapsulate the wire. The magnetic material includes a resin and a magnetic powder, wherein an average particle diameter of the magnetic powder is smaller than 20 ?m.

Abstract: A wireless charger comprises a top cover; a metallic case; and a first thermoelectric cooler chip, disposed between a bottom surface of the top cover and a top surface of the metallic case to form a heat conductive path from the top cover to the metallic case via the first thermoelectric cooler chip for dissipating heat generated by an electronic device disposed on the top cover for wireless charging the electronic device.