Abstract: The present invention provides a composition for surface modification of a heat sink, the composition including: 0.01 to 10 parts by weight of an organic titanium compound; 0.01 to 5 parts by weight of an organic silane compound; 0.1 to 10 parts by weight of an organic acid; 0.01 to 5 parts by weight of a sequestering agent; and 0.1 to 10 parts by weight of a buffer with respect to 100 parts by weight of distilled water. The composition of the present invention provides excellent adhesion strength with prepreg, and improve heat releasing performance.

Abstract: There is provided a thermoelectric (TE) element. The TE element includes a plurality of pn junctions each formed by bonding an n-type TE semiconductor and a p-type TE semiconductor with a metallic layer interposed therebetween, and a first electrode and a second electrode electrically connected to the n-type TE semiconductor and the p-type TE semiconductor, respectively. The plurality of pn junctions are laminated with insulating layers interposed therebetween, and are connected electrically in parallel to each other. Even in the case that a section of components does not operate electrically, the operation of the entire element is not adversely affected, thereby improving stability of the TE element.

Abstract: Provided is a method of manufacturing a PCB, the method comprising: providing a substrate including an aluminum core; forming a via hole passing through the substrate; substituting the surface of the aluminum core with a zinc film by performing a zincate treatment on the inner surface of the via hole; substituting the zinc film with a metal film by performing substitution plating on the zinc film; forming a first plated film on the surface of the via hole, where the metal film is formed, through electroless plating; and forming a second plated film on the first plated film through electroplating.

Abstract: The present invention provides a composition for surface modification of a heat sink, the composition including: 0.01 to 10 parts by weight of an organic titanium compound; 0.01 to 5 parts by weight of an organic silane compound; 0.1 to 10 parts by weight of an organic acid; 0.01 to 5 parts by weight of a sequestering agent; and 0.1 to 10 parts by weight of a buffer with respect to 100 parts by weight of distilled water. The composition of the present invention provides excellent adhesion strength with prepreg, and improve heat releasing performance.

Abstract: A printed circuit board and a manufacturing method of the same. The method includes forming a circuit board by selectively positioning a heat release layer among multiple insulation layers that have circuit patterns formed on their surfaces, perforating a through-hole that penetrates through one side and the other side of the circuit board, forming a metal film over the heat release layer exposed at an inner wall surface of the through-hole, and forming a plating layer by depositing a conductive metal over an inner wall of the through-hole. By having the heat release layer selectively inserted inside the circuit board, the heat releasing effect may be improved, and the bending strength may be increased. Moreover, a reliable electrical connection can be implemented between the heat release layer and the circuit pattern, making it possible to utilize the heat release layer as a power supply layer or a ground layer.

Abstract: Disclosed is a radiant heat printed circuit board, which has improved heat-radiating properties and reliability, and a method of fabricating the same.

Abstract: The present invention relates to a method of manufacturing a multi-layered printed circuit board which can decrease the cost and time required to produce the printed circuit board and can improve heat radiation characteristics and bending strength.