Abstract: A system and method for cooling a room configured to house a plurality of computer systems. A plurality of evaporator units are arranged in parallel and are configured to receive air from the room and to deliver air to the room. The evaporator units are supplied with refrigerant operable to cool the received air in the evaporator units. The air may be controlled in response to temperatures sensed at one or more locations in the room.

Abstract: A system and method for cooling a room configured to house a plurality of computer systems. A heat exchanger unit is configured to receive air from the room and to deliver air to the room. The heat exchanger unit is supplied with cooling fluid operable to cool the received air in the heat exchanger unit. At least one of the temperature of the cooling fluid supplied to the heat exchanger unit and the air delivery to the room may be controlled in response to temperatures sensed at one or more locations in the room.

Abstract: A system and method for cooling a room configured to house a plurality of computer systems. A plurality of evaporator units are arranged in series and are configured to receive air from the room and to deliver air to the room. The evaporator units are supplied with refrigerant operable to cool the received air in the evaporator units. At least one of the temperature of the refrigerant supplied to the evaporator units and the air delivery to the room may be controlled in response to temperatures sensed at one or more locations in the room.

Abstract: An apparatus for cooling electronic components contained within a housing member is configured to be easily removed from the housing member. In one example embodiment, an apparatus for cooling an electronic component is coupled to a housing that contains an electronic component. The apparatus includes a heat conductive member having a first lateral edge shaped to slidably attach and retain the heat conductive member to a portion of the housing. A top surface of the housing includes a second edge shaped to slidably receive and retain the heat conductive member.

Abstract: A device having a signal module configured to transmit a first type of signal and a second type of signal and to receive the first type of signal and the second type of signal. The device also includes a timer and a controller configured to operate the signal module and timer. The controller is operable to determine a location of the device with respect to another device based upon the time elapsed between transmission and receipt of the first type of signal and transmission and receipt of the second type of signal.

Abstract: A system and method for reducing temperature variation among components in a multi-component system. In this respect, component temperatures are controlled to remain relatively constant (approximately within 5° C.) with respect to other components, while allowing for multiple fluctuating heat loads between components. A refrigeration system possessing a variable capacity (speed) compressor and a thermostatic expansion valve is utilized to control the flow of refrigerant through the refrigeration system. The temperatures of the components are reduced by metering the mass flow rate of the refrigerant cooling the components to compensate for the heat load applied to the refrigeration system. The temperature variation among the components is reduced by supplemental heaters independently providing heat to each respective component.

Abstract: In a thermal regulating system, individual temperatures of a plurality of components are maintained within a predetermined temperature range. This thermal regulating system includes a refrigeration system having a refrigerant contained in a refrigerant line, a valve capable of being electronically controlled, a plurality of evaporators configured for thermal attachment to the components, and a supplemental heating system. The valve is configured to control superheat formation in the refrigeration system. Furthermore, the refrigeration system and the supplemental heating system are operable to maintain each of the plurality of components within the predetermined temperature range.

Abstract: A device for sensing at least one environmental condition in a data center. The device includes a chassis, a propelling mechanism, a power supply, a steering mechanism, and a controller supported on the chassis. The chassis also supports at least one environmental condition sensor and is operable to travel through the data center and sense at least one environmental condition at various locations throughout the data center.

Abstract: A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within the chamber are adjustably mounted on one or more brackets to allow each sprayer to be set for the individual height of its respective component. The enclosure can be readily removed from a computer system through a quick release connection. The computer system can include a condenser and pump to operate all its modular cooling systems, removing the condensing function from the individual modules.

Abstract: An energy management system for one or more computer data centers, including a plurality of racks containing electronic packages. The electronic packages may be one or a combination of components such as, processors, micro-controllers, high-speed video cards, memories, semi-conductor devices, computers and the like. The energy management system includes a system controller for distributing workload among the electronic packages. The system controller is also configured to manipulate cooling systems within the one or more data centers.

Abstract: An apparatus, method, and system for cooling electronic components is disclosed. The apparatus includes liquid-to-air heat exchange equipment mounted to an enclosure for cooling the electronic components housed therein. In one embodiment the apparatus is a self-contained, stand-alone unit. In another embodiment the apparatus is connected to a remote heat exchange device. The system includes several of the apparatus arranged in parallel and is controlled to balance and optimize efficiency among the several apparatus.

Abstract: A cooling system for cooling one or more components that produce heat. The cooling system includes sprayers configured to spray cooling fluid toward the components. A detection system includes a radiation source and a radiation sensor that pass radiant energy in the vicinity of the component such that the radiant energy is affected by passing through the vaporizing spray coolant. A controller controls the flow rates of the sprayers in response to levels of radiant energy detected by the radiation sensor, allowing the controller to more accurately control the wall temperature and cooling regime achieved by the spray cooling. The source and sensor are aimable or otherwise configured for gathering information for different thermal zones of the component, providing the controller with information that is helpful in separately controlling the wall temperature and/or cooling regime in each zone.

Abstract: A semiconductor chip cooling system configured with thermal inkjet type sprayers controlled by a control system. The control system can operate groups of the sprayers at different rates to controllably cool separate regions of a chip at different rates. A detection system is configured to separately detect the cooling regime occurring on the different regions of the chip by reflecting an optical beam off the chip in the region that is being sprayed.

Abstract: A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within the chamber are set in an array to spray a target area, and a controller controls which sprayers are activated based on information delineating the locations of the components to be cooled. The enclosure can be readily removed from a computer system through a quick release connection. The computer system can include a condenser and pump to operate all its modular cooling systems, removing the condensing function from the individual modules.

Abstract: A device and a system for cooling heat generating electronics is disclosed. In one embodiment, the invention is a system for cooling at least one computer component. The system has a plurality of cold plates which are adapted to transfer heat from a plurality of computer components to a cooling fluid. A supply line supplies the cooling fluid to and from these cold plates. The system also has a housing with one or more racks to support the computer component(s). The racks may also support the cold plates so that the cold plates are in thermal communication with at least one computer component.

Abstract: An apparatus, method, and system for cooling electronic components is disclosed. The apparatus includes liquid-to-air heat exchange equipment mounted to an enclosure for cooling the electronic components housed therein. In one embodiment the apparatus is a self-contained, stand-alone unit. In another embodiment the apparatus is connected to a remote heat exchange device. The system includes several of the apparatus arranged in parallel and is controlled to balance and optimize efficiency among the several apparatus.

Abstract: A multi-chip module (MCM) having a substrate including a first surface, a second surface and a multi-layer interconnection arrangement disposed between the two surfaces. A high-density thin-film circuit region is provided on the substrate first surface to interconnect a plurality of integrated circuit chips and the multi-layer interconnection arrangement. The integrated circuit chips are powered through the high-density thin-film circuit region, which receives power from the multi-layer interconnection arrangement. A plurality of discrete on-board voltage converter devices, mounted on at least one substrate surface, provide uniform power supply distribution to multi-layer interconnection arrangement power planes, converting an MCM input voltage and current to a relatively lower output voltage and a relatively higher output current.

Abstract: A cooling system for cooling one or more components that produce heat. The cooling system includes sprayers configured to spray cooling fluid toward the components. A detection system includes a radiation source and a radiation sensor that pass radiant energy in the vicinity of the component such that the radiant energy is affected by passing through the vaporizing spray coolant. A controller controls the flow rates of the sprayers in response to levels of radiant energy detected by the radiation sensor, allowing the controller to more accurately control the wall temperature and cooling regime achieved by the spray cooling. The source and sensor are aimable or otherwise configured for gathering information for different thermal zones of the component, providing the controller with information that is helpful in separately controlling the wall temperature and/or cooling regime in each zone.

Abstract: A cooling system is configured to adjust cooling fluid flow to various racks located throughout a data center based upon the detected or anticipated temperatures at various locations throughout the data center. In one respect, by substantially increasing the cooling fluid flow to those racks dissipating greater amounts of heat and by substantially decreasing the cooling fluid flow to those racks dissipating lesser amounts of heat, the amount of energy required to operate the cooling system may be relatively reduced. Thus, instead of operating the devices, e.g., compressors, fans, etc., of the cooling system at substantially 100 percent of the anticipated heat dissipation from the racks, those devices may be operated according to the actual cooling needs.

Abstract: A semiconductor chip cooling system having a body that forms a cavity configured to create a spray chamber when conformingly adjoined to a chip, or to a substrate or printed circuit board carrying one or more chips. The cooling system uses thermal inkjet sprayers to spray the chip(s) in the spray chamber with cooling fluid. The cooling system includes a combined reservoir and condenser. Liquid and gaseous cooling fluid travel or are pumped from the spray chamber to the reservoir. A controller transmits a control signal to the sprayer to cause the sprayer to spray at a rate leading to the cooling fluid being vaporized by the semiconductor device.